EP3390698 - METHOD FOR EPITAXIAL COATING OF SEMICONDUCTOR WAFERS [Right-click to bookmark this link] | |||
Former [2018/43] | METHOD FOR EPITAXIAL COATING OF SEMICONDUCTOR WAFERS, AND SEMICONDUCTOR WAFER | ||
[2020/35] | Status | No opposition filed within time limit Status updated on 10.12.2021 Database last updated on 02.11.2024 | |
Former | The patent has been granted Status updated on 01.01.2021 | ||
Former | Grant of patent is intended Status updated on 13.08.2020 | ||
Former | Examination is in progress Status updated on 15.02.2020 | ||
Former | Request for examination was made Status updated on 21.09.2018 | ||
Former | The international publication has been made Status updated on 23.06.2017 | ||
Former | unknown Status updated on 21.12.2016 | Most recent event Tooltip | 13.09.2024 | Lapse of the patent in a contracting state New state(s): MT | published on 16.10.2024 [2024/42] | Applicant(s) | For all designated states Siltronic AG Einsteinstraße 172 81677 München / DE | [2021/08] |
Former [2018/43] | For all designated states Siltronic AG Hanns-Seidel-Platz 4 81737 München / DE | Inventor(s) | 01 /
HAGER, Christian Schulstrasse 12 84556 Kastl / DE | 02 /
MAY, Katharina Vollmerstrasse 4 84489 Burghausen / DE | 03 /
WEBER, Christof Ludwig-Thoma-Str. 12 84489 Burghausen / DE | [2018/43] | Representative(s) | Killinger, Andreas Siltronic AG Intellectual Property Johannes-Hess-Straße 24 84489 Burghausen / DE | [2018/43] | Application number, filing date | 16809795.4 | 09.12.2016 | [2018/43] | WO2016EP80494 | Priority number, date | DE201510225663 | 17.12.2015 Original published format: DE102015225663 | [2018/43] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | WO2017102597 | Date: | 22.06.2017 | Language: | DE | [2017/25] | Type: | A1 Application with search report | No.: | EP3390698 | Date: | 24.10.2018 | Language: | DE | The application published by WIPO in one of the EPO official languages on 22.06.2017 takes the place of the publication of the European patent application. | [2018/43] | Type: | B1 Patent specification | No.: | EP3390698 | Date: | 03.02.2021 | Language: | DE | [2021/05] | Search report(s) | International search report - published on: | EP | 22.06.2017 | Classification | IPC: | C23C16/44, C30B29/06, H01L21/02, C23C16/02, C30B25/18 | [2020/35] | CPC: |
C23C16/0236 (EP,KR,US);
H01L21/02293 (KR);
C30B25/14 (US);
C23C16/4405 (EP,KR,US);
C30B25/08 (US);
C30B25/12 (US);
C30B25/165 (US);
C30B25/186 (EP,KR,US);
C30B29/06 (EP,KR,US);
H01L21/02381 (EP,KR,US);
H01L21/0243 (EP,KR,US);
H01L21/02433 (EP,KR,US);
|
Former IPC [2018/43] | C30B25/02, C30B29/06, H01L21/02, C23C16/44, C23C16/02 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2018/43] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | MA | Not yet paid | MD | Not yet paid | Title | German: | VERFAHREN ZUM EPITAKTISCHEN BESCHICHTEN VON HALBLEITERSCHEIBEN | [2020/35] | English: | METHOD FOR EPITAXIAL COATING OF SEMICONDUCTOR WAFERS | [2020/35] | French: | PROCÉDÉ POUR EFFECTUER LE REVÊTEMENT ÉPITAXIQUE DE TRANCHES DE SEMI-CONDUCTEUR | [2020/35] |
Former [2018/43] | VERFAHREN ZUM EPITAKTISCHEN BESCHICHTEN VON HALBLEITERSCHEIBEN UND HALBLEITERSCHEIBE | ||
Former [2018/43] | METHOD FOR EPITAXIAL COATING OF SEMICONDUCTOR WAFERS, AND SEMICONDUCTOR WAFER | ||
Former [2018/43] | PROCÉDÉ POUR EFFECTUER LE REVÊTEMENT ÉPITAXIQUE DE TRANCHES DE SEMI-CONDUCTEUR ET TRANCHE DE SEMI-CONDUCTEUR | Entry into regional phase | 04.06.2018 | National basic fee paid | 04.06.2018 | Designation fee(s) paid | 04.06.2018 | Examination fee paid | Examination procedure | 04.06.2018 | Examination requested [2018/43] | 04.06.2018 | Date on which the examining division has become responsible | 11.01.2019 | Amendment by applicant (claims and/or description) | 19.02.2020 | Despatch of a communication from the examining division (Time limit: M04) | 18.06.2020 | Reply to a communication from the examining division | 14.08.2020 | Communication of intention to grant the patent | 01.12.2020 | Fee for grant paid | 01.12.2020 | Fee for publishing/printing paid | 01.12.2020 | Receipt of the translation of the claim(s) | Opposition(s) | 04.11.2021 | No opposition filed within time limit [2022/02] | Fees paid | Renewal fee | 19.12.2018 | Renewal fee patent year 03 | 23.12.2019 | Renewal fee patent year 04 | 24.12.2020 | Renewal fee patent year 05 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 09.12.2016 | AL | 03.02.2021 | CY | 03.02.2021 | CZ | 03.02.2021 | DK | 03.02.2021 | EE | 03.02.2021 | ES | 03.02.2021 | FI | 03.02.2021 | HR | 03.02.2021 | IT | 03.02.2021 | LT | 03.02.2021 | LV | 03.02.2021 | MC | 03.02.2021 | MK | 03.02.2021 | MT | 03.02.2021 | NL | 03.02.2021 | PL | 03.02.2021 | RO | 03.02.2021 | RS | 03.02.2021 | SE | 03.02.2021 | SI | 03.02.2021 | SK | 03.02.2021 | SM | 03.02.2021 | BG | 03.05.2021 | NO | 03.05.2021 | GR | 04.05.2021 | IS | 03.06.2021 | PT | 04.06.2021 | [2024/42] |
Former [2024/22] | HU | 09.12.2016 | |
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BG | 03.05.2021 | ||
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GR | 04.05.2021 | ||
IS | 03.06.2021 | ||
PT | 04.06.2021 | ||
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BG | 03.05.2021 | ||
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GR | 04.05.2021 | ||
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PT | 04.06.2021 | Cited in | International search | [XI]DE102005045338 (SILTRONIC AG [DE]) [X] 1-4,8,10-16 * paragraphs [0058] , [0 72] * * page 5, paragraph 36 - paragraph 46 * [I] 5-7,9; | [AD]DE102005045339 (SILTRONIC AG [DE]) [AD] 7,9 * paragraphs [0065] , [0069] - [0072] * * paragraphs [0023] , [0 49] *; | [A]JP2009278035 (SHINETSU HANDOTAI KK) [A] 16* figures 4,5 *; | [IP]WO2016155915 (SILTRONIC AG [DE]) [IP] 1 * page 4, paragraph 3 * | by applicant | DE102005045339 |