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Extract from the Register of European Patents

EP About this file: EP3322268

EP3322268 - METHOD FOR PRODUCING PRINTED CIRCUIT BOARD, AND RESIN COMPOSITION [Right-click to bookmark this link]
Former [2018/20]PRINTED WIRING BOARD PRODUCTION METHOD AND RESIN COMPOSITION
[2022/21]
StatusNo opposition filed within time limit
Status updated on  16.06.2023
Database last updated on 05.10.2024
FormerThe patent has been granted
Status updated on  08.07.2022
FormerGrant of patent is intended
Status updated on  19.05.2022
FormerRequest for examination was made
Status updated on  13.04.2018
FormerThe international publication has been made
Status updated on  13.01.2017
Most recent event   Tooltip01.03.2024Lapse of the patent in a contracting state
New state(s): MC		published on 03.04.2024  [2024/14]
Applicant(s)For all designated states
Mitsubishi Gas Chemical Company, Inc.
5-2, Marunouchi 2-chome Chiyoda-ku
Tokyo 100-8324 / JP
[2018/20]
Inventor(s)01 / TOMIZAWA, Katsuya
c/o Mitsubishi Gas Chemical Company, Inc.
Tokyo Techno Park
1-1 Niijuku 6-chome
Katsushika-ku
Tokyo 125-8601 / JP
02 / TAKAHASHI, Hiroshi
c/o Mitsubishi Gas Chemical Company, Inc.
Tokyo Techno Park
1-1 Niijuku 6-chome
Katsushika-ku
Tokyo 125-8601 / JP
03 / SHIGA, Eisuke
c/o Mitsubishi Gas Chemical Company, Inc.
Tokyo Techno Park
1-1 Niijuku 6-chome
Katsushika-ku
Tokyo 125-8601 / JP
 [2018/20]
Representative(s)Hoffmann Eitle
Patent- und Rechtsanwälte PartmbB
Arabellastraße 30
81925 München / DE
[2018/20]
Application number, filing date16821362.704.07.2016
[2018/20]
WO2016JP69747
Priority number, dateJP2015013520306.07.2015         Original published format: JP 2015135203
[2018/20]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2017006893
Date:12.01.2017
Language:JA
[2017/02]
Type: A1 Application with search report 
No.:EP3322268
Date:16.05.2018
Language:EN
[2018/20]
Type: B1 Patent specification 
No.:EP3322268
Date:10.08.2022
Language:EN
[2022/32]
Search report(s)International search report - published on:JP12.01.2017
(Supplementary) European search report - dispatched on:EP27.06.2018
ClassificationIPC:H05K3/38, C08G73/00, C08J5/24, C08K5/541, C08L35/00, C08L101/00, H05K1/03, C09D179/08
[2018/30]
CPC:
C08J5/244 (EP,KR,US); H05K1/0386 (KR); C08L79/085 (KR,US);
C08F220/06 (KR); C08G73/00 (EP,US); C08G73/128 (KR,US);
C08J5/043 (KR); C08J5/249 (EP,KR,US); C08J7/12 (KR,US);
C08K3/22 (KR); C08K3/36 (KR,US); C08K5/541 (EP,KR,US);
C08K7/18 (KR,US); C08L101/00 (EP,US); C08L101/02 (KR);
C08L35/00 (EP,KR,US); C08L63/00 (KR); C09D179/085 (EP,KR,US);
C25D3/38 (KR,US); H05K1/03 (EP,US); H05K1/0373 (US);
H05K3/181 (KR,US); H05K3/188 (KR,US); H05K3/38 (EP,US);
H05K3/381 (KR); H05K3/389 (KR,US); C08J2379/08 (KR,US);
C08J2465/00 (KR,US); C08L2203/20 (KR,US); H05K2201/0162 (KR,US);
H05K2203/072 (US); H05K2203/0723 (KR,US); H05K2203/0786 (KR,US) (-)
C-Set:
C09D179/085, C08K3/36, C08K5/5425, C08L61/14 (EP,US)
Former IPC [2018/20]H05K3/38, C08G73/00, C08J5/24, C08K5/541, C08L35/00, C08L101/00, H05K1/03
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2018/20]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TitleGerman:VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE UND HARZZUSAMMENSETZUNG[2022/21]
English:METHOD FOR PRODUCING PRINTED CIRCUIT BOARD, AND RESIN COMPOSITION[2022/21]
French:MÉTHODE DE PRODUCTION D'UNE CARTE DE CIRCUIT IMPRIMÉ, ET COMPOSITION DE RÉSINE[2022/21]
Former [2018/20]LEITERPLATTENHERSTELLUNGSVERFAHREN UND HARZZUSAMMENSETZUNG
Former [2018/20]PRINTED WIRING BOARD PRODUCTION METHOD AND RESIN COMPOSITION
Former [2018/20]PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ ET COMPOSITION DE RÉSINE
Entry into regional phase02.02.2018Translation filed 
02.02.2018National basic fee paid 
02.02.2018Search fee paid 
02.02.2018Designation fee(s) paid 
02.02.2018Examination fee paid 
Examination procedure02.02.2018Examination requested  [2018/20]
02.02.2018Date on which the examining division has become responsible
13.12.2018Amendment by applicant (claims and/or description)
20.05.2022Communication of intention to grant the patent
28.06.2022Fee for grant paid
28.06.2022Fee for publishing/printing paid
28.06.2022Receipt of the translation of the claim(s)
Opposition(s)11.05.2023No opposition filed within time limit [2023/29]
Fees paidRenewal fee
24.07.2018Renewal fee patent year 03
26.07.2019Renewal fee patent year 04
14.07.2020Renewal fee patent year 05
15.07.2021Renewal fee patent year 06
15.06.2022Renewal fee patent year 07
Opt-out from the exclusive  Tooltip
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAL10.08.2022
AT10.08.2022
CZ10.08.2022
DK10.08.2022
EE10.08.2022
ES10.08.2022
FI10.08.2022
HR10.08.2022
LT10.08.2022
LV10.08.2022
MC10.08.2022
NL10.08.2022
PL10.08.2022
RO10.08.2022
RS10.08.2022
SE10.08.2022
SI10.08.2022
SK10.08.2022
SM10.08.2022
NO10.11.2022
GR11.11.2022
IS10.12.2022
PT12.12.2022
[2024/14]
Former [2023/37]AL10.08.2022
AT10.08.2022
CZ10.08.2022
DK10.08.2022
EE10.08.2022
ES10.08.2022
FI10.08.2022
HR10.08.2022
LT10.08.2022
LV10.08.2022
NL10.08.2022
PL10.08.2022
RO10.08.2022
RS10.08.2022
SE10.08.2022
SI10.08.2022
SK10.08.2022
SM10.08.2022
NO10.11.2022
GR11.11.2022
IS10.12.2022
PT12.12.2022
Former [2023/29]AL10.08.2022
AT10.08.2022
CZ10.08.2022
DK10.08.2022
EE10.08.2022
ES10.08.2022
FI10.08.2022
HR10.08.2022
LT10.08.2022
LV10.08.2022
NL10.08.2022
PL10.08.2022
RO10.08.2022
RS10.08.2022
SE10.08.2022
SK10.08.2022
SM10.08.2022
NO10.11.2022
GR11.11.2022
IS10.12.2022
PT12.12.2022
Former [2023/23]AT10.08.2022
CZ10.08.2022
DK10.08.2022
EE10.08.2022
ES10.08.2022
FI10.08.2022
HR10.08.2022
LT10.08.2022
LV10.08.2022
NL10.08.2022
PL10.08.2022
RO10.08.2022
RS10.08.2022
SE10.08.2022
SK10.08.2022
SM10.08.2022
NO10.11.2022
GR11.11.2022
IS10.12.2022
PT12.12.2022
Former [2023/22]AT10.08.2022
CZ10.08.2022
DK10.08.2022
ES10.08.2022
FI10.08.2022
HR10.08.2022
LT10.08.2022
LV10.08.2022
NL10.08.2022
PL10.08.2022
RO10.08.2022
RS10.08.2022
SE10.08.2022
SM10.08.2022
NO10.11.2022
GR11.11.2022
IS10.12.2022
PT12.12.2022
Former [2023/21]DK10.08.2022
FI10.08.2022
HR10.08.2022
LT10.08.2022
LV10.08.2022
NL10.08.2022
PL10.08.2022
RS10.08.2022
SE10.08.2022
SM10.08.2022
NO10.11.2022
GR11.11.2022
IS10.12.2022
PT12.12.2022
Former [2023/20]FI10.08.2022
HR10.08.2022
LT10.08.2022
LV10.08.2022
NL10.08.2022
PL10.08.2022
RS10.08.2022
SE10.08.2022
SM10.08.2022
NO10.11.2022
GR11.11.2022
IS10.12.2022
PT12.12.2022
Former [2023/12]FI10.08.2022
HR10.08.2022
LT10.08.2022
LV10.08.2022
NL10.08.2022
PL10.08.2022
RS10.08.2022
SE10.08.2022
NO10.11.2022
GR11.11.2022
IS10.12.2022
PT12.12.2022
Former [2023/11]FI10.08.2022
HR10.08.2022
LT10.08.2022
LV10.08.2022
NL10.08.2022
PL10.08.2022
RS10.08.2022
SE10.08.2022
NO10.11.2022
GR11.11.2022
PT12.12.2022
Former [2023/10]FI10.08.2022
HR10.08.2022
LT10.08.2022
LV10.08.2022
NL10.08.2022
RS10.08.2022
SE10.08.2022
NO10.11.2022
GR11.11.2022
PT12.12.2022
Former [2023/09]FI10.08.2022
LT10.08.2022
LV10.08.2022
NL10.08.2022
RS10.08.2022
SE10.08.2022
NO10.11.2022
PT12.12.2022
Former [2023/08]FI10.08.2022
LT10.08.2022
NL10.08.2022
RS10.08.2022
SE10.08.2022
NO10.11.2022
Documents cited:Search[XI]EP2733177  (MITSUBISHI GAS CHEMICAL CO [JP]) [X] 1-3,7-19 * claim - * * example 2 * * paragraph [0019] - paragraph [0020] * * paragraph [0050] - paragraph [0054] * * paragraph [0060] * * paragraph [0076] - paragraph [0081] * * paragraph [0087] - paragraph [0088] * * paragraph [0109] * [I] 4-6;
 [XP]EP3006503  (MITSUBISHI GAS CHEMICAL CO [JP]) [XP] 1-3,7-19 * claim - * * example - * * paragraph [0046] * * paragraph [0056] * * paragraph [0069] - paragraph [0070] * * paragraph [0093] - paragraph [0095] ** paragraph [0104] - paragraph [0105] *
International search[Y]JP2007299875  (HITACHI CHEMICAL CO LTD) [Y] 1-19 * , abstract; paragraphs [0009] to [0014]; fig. 1 (Family: none) *;
 [Y]JP2008133414  (HITACHI CHEMICAL CO LTD) [Y] 2, 3 * , abstract; paragraphs [0053] to [0063], [0093] (Family: none) *;
 [Y]JP2012197336  (PANASONIC CORP) [Y] 4-6 * , abstract; paragraphs [0024] to [0040] (Family: none) *;
 [Y]WO2013047041  (MITSUBISHI GAS CHEMICAL CO [JP], et al) [Y] 12* , abstract; paragraphs [0037] to [0046] & US 2014/0370771 A1 abstract; paragraphs [0024] to [0031] & TW 201323499 A & KR 10-2014-0069047 A & EP 2762507 A1 & CN 103842397 A *;
 [Y]JP2013189577  (HITACHI CHEMICAL CO LTD) [Y] 1-19 * , abstract; paragraphs [0021] to [0027], [0041] to [0053], [0075] (Family: none) *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.