EP3434398 - THERMAL BONDING SHEET, THERMAL BONDING SHEET WITH DICING TAPE, BONDED BODY PRODUCTION METHOD, AND POWER SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 24.12.2021 Database last updated on 18.11.2024 | |
Former | The patent has been granted Status updated on 15.01.2021 | ||
Former | Grant of patent is intended Status updated on 27.10.2020 | ||
Former | Examination is in progress Status updated on 24.08.2019 | ||
Former | Request for examination was made Status updated on 30.12.2018 | ||
Former | The international publication has been made Status updated on 29.09.2017 | Most recent event Tooltip | 13.09.2024 | Lapse of the patent in a contracting state New state(s): MT | published on 16.10.2024 [2024/42] | Applicant(s) | For all designated states Nitto Denko Corporation 1-1-2 Shimohozumi Ibaraki-shi, Osaka 567-8680 / JP | [2019/05] | Inventor(s) | 01 /
SUGO, Yuki c/o NITTO DENKOCORPORATION 1-1-2 Shimohozumi Ibaraki-shi Osaka 567-8680 / JP | 02 /
KAMAKURA, Nao c/o NITTO DENKO CORPORATION 1-1-2 Shimohozumi Ibaraki-shi Osaka 567-8680 / JP | 03 /
HONDA, Satoshi c/o NITTO DENKO CORPORATION 1-1-2 Shimohozumi Ibaraki-shi Osaka 567-8680 / JP | [2019/05] | Representative(s) | Grünecker Patent- und Rechtsanwälte PartG mbB Leopoldstraße 4 80802 München / DE | [2019/05] | Application number, filing date | 16895526.8 | 13.12.2016 | [2019/05] | WO2016JP87075 | Priority number, date | JP20160058584 | 23.03.2016 Original published format: JP 2016058584 | [2019/05] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2017163503 | Date: | 28.09.2017 | Language: | JA | [2017/39] | Type: | A1 Application with search report | No.: | EP3434398 | Date: | 30.01.2019 | Language: | EN | [2019/05] | Type: | B1 Patent specification | No.: | EP3434398 | Date: | 17.02.2021 | Language: | EN | [2021/07] | Search report(s) | International search report - published on: | JP | 28.09.2017 | (Supplementary) European search report - dispatched on: | EP | 28.01.2019 | Classification | IPC: | B23K35/30, B22F7/08, B22F1/00, B23K35/36, B23K35/02, // B22F7/00, B23K35/38, B23K101/40 | [2020/41] | CPC: |
B22F7/08 (EP,US);
H01L24/32 (US);
B22F1/07 (EP,US);
B23K20/00 (EP,US);
B23K35/0233 (EP,US);
B23K35/302 (EP,US);
B23K35/3613 (EP,US);
H01L21/52 (EP,US);
H01L21/6836 (US);
H01L24/27 (US);
H01L24/83 (US);
B22F2999/00 (EP,US);
B22F7/008 (EP,US);
B23K2101/40 (EP,US);
B23K35/383 (EP,US);
H01L2021/60015 (US);
H01L2224/29347 (EP);
H01L2224/48091 (EP,US);
H01L2224/73265 (EP,US);
H01L2224/83191 (EP,US);
H01L2224/8384 (EP);
| C-Set: |
B22F2999/00, B22F2003/248, B22F2201/01, B22F2201/20, B22F2201/02 (US,EP);
H01L2224/48091, H01L2924/00014 (EP,US);
H01L2924/181, H01L2924/00012 (US,EP)
|
Former IPC [2019/09] | B22F7/08, B22F1/00, B23K20/00, H01L21/52, B23K35/30, B23K35/36, B23K35/02, // B22F7/00, B23K35/38, B23K101/40 | ||
Former IPC [2019/05] | B22F7/08, B22F1/00, B23K20/00, H01L21/52 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2019/05] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | MA | Not yet paid | MD | Not yet paid | Title | German: | THERMISCHE KLEBEFOLIE, THERMISCHE KLEBEFOLIE MIT SÄGEFOLIE, VERFAHREN ZUR HERSTELLUNG EINES GEKLEBTEN KÖRPERS UND LEISTUNGSHALBLEITERBAUELEMENT | [2019/05] | English: | THERMAL BONDING SHEET, THERMAL BONDING SHEET WITH DICING TAPE, BONDED BODY PRODUCTION METHOD, AND POWER SEMICONDUCTOR DEVICE | [2019/05] | French: | FEUILLE DE LIAISON THERMIQUE, FEUILLE DE LIAISON THERMIQUE COMPRENANT UNE BANDE DE DÉCOUPAGE EN DÉS, PROCÉDÉ DE PRODUCTION DE CORPS LIÉ ET DISPOSITIF SEMI-CONDUCTEUR DE PUISSANCE | [2019/05] | Entry into regional phase | 22.10.2018 | Translation filed | 22.10.2018 | National basic fee paid | 22.10.2018 | Search fee paid | 22.10.2018 | Designation fee(s) paid | 22.10.2018 | Examination fee paid | Examination procedure | deleted | Date on which the examining division has become responsible | 22.10.2018 | Examination requested [2019/05] | 06.08.2019 | Amendment by applicant (claims and/or description) | 28.08.2019 | Despatch of a communication from the examining division (Time limit: M04) | 26.11.2019 | Reply to a communication from the examining division | 06.04.2020 | Despatch of a communication from the examining division (Time limit: M04) | 22.07.2020 | Reply to a communication from the examining division | 28.10.2020 | Communication of intention to grant the patent | 05.01.2021 | Fee for grant paid | 05.01.2021 | Fee for publishing/printing paid | 05.01.2021 | Receipt of the translation of the claim(s) | Opposition(s) | 18.11.2021 | No opposition filed within time limit [2022/04] | Fees paid | Renewal fee | 22.10.2018 | Renewal fee patent year 03 | 20.12.2019 | Renewal fee patent year 04 | 28.12.2020 | Renewal fee patent year 05 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 13.12.2016 | AL | 17.02.2021 | AT | 17.02.2021 | CY | 17.02.2021 | CZ | 17.02.2021 | DK | 17.02.2021 | EE | 17.02.2021 | ES | 17.02.2021 | FI | 17.02.2021 | HR | 17.02.2021 | IT | 17.02.2021 | LT | 17.02.2021 | LV | 17.02.2021 | MC | 17.02.2021 | MK | 17.02.2021 | MT | 17.02.2021 | NL | 17.02.2021 | PL | 17.02.2021 | RO | 17.02.2021 | RS | 17.02.2021 | SE | 17.02.2021 | SI | 17.02.2021 | SK | 17.02.2021 | SM | 17.02.2021 | TR | 17.02.2021 | BG | 17.05.2021 | NO | 17.05.2021 | GR | 18.05.2021 | IS | 17.06.2021 | PT | 17.06.2021 | [2024/42] |
Former [2024/29] | HU | 13.12.2016 | |
AL | 17.02.2021 | ||
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DK | 17.02.2021 | ||
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SM | 17.02.2021 | ||
BG | 17.05.2021 | ||
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IS | 17.06.2021 | ||
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BG | 17.05.2021 | ||
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PT | 17.06.2021 | Documents cited: | Search | [XYI]US2005156325 (YOU YANG ONG [MY]) [X] 1,4,5,7 * abstract * * paragraph [0033] * * paragraph [0045] - paragraph [0046] * * paragraph [0055] * [Y] 2,3 [I] 6; | [Y]EP2923781 (MITSUI MINING & SMELTING CO [JP]) [Y] 2,3 * abstract * * paragraph [0015] * * paragraph [0027] - paragraph [0028] ** paragraph [0060] - paragraph [0061] *; | [X]WO2015154236 (GM GLOBAL TECH OPERATIONS INC [US], et al) [X] 1 * abstract * * paragraph [0051] *; | [E]EP3358607 (NITTO DENKO CORP [JP]) [E] 1-7 * abstract * * paragraph [0093] * * paragraph [0125] * * paragraph [0134] * * paragraph [0136] * * paragraph [0144] * * example 4; table 1 * * figure 1 *; | [E]EP3358608 (NITTO DENKO CORP [JP]) [E] 1-7 * abstract * * paragraph [0091] * * paragraph [0123] * * paragraph [0134] * * paragraph [0132] * * paragraph [0142] * * example 4; table 1 * * figure 1 *; | [E]EP3358609 (NITTO DENKO CORP [JP]) [E] 1-7 * abstract * * paragraph [0015] * * paragraph [0044] * * paragraph [0055] * * paragraph [0058] * * example H; table 1 * * figure 2 * | International search | [Y]JP2002030306 (GUNZE KK) [Y] 1-7 * , paragraphs [0010] to [0024] (Family: none) *; | [Y]JP2005166938 (NEC MACHINERY CORP) [Y] 4* , paragraph [0004] (Family: none) *; | [Y]JP2008031491 (SUMITOMO METAL MINING CO) [Y] 2-7 * , paragraph [0034] (Family: none) *; | [Y]WO2015034579 (HENKEL IP & HOLDING GMBH [DE], et al) [Y] 1-7 * , paragraphs [0002] to [0009] & US 2016/0151864 A1 & CN 105473257 A & KR 10-2016-0051766 A & TW 201509869 A * | by applicant | JPS60196956 | JP2013007028 | JP2014111800 |