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EP3437137
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EP Citations: EP3437137
| Cited in | Search | Type: | Patent literature | Publication No.: | US8836016
[A] (WU CHENG-HSIEN [TW], et al) [A] 1-15* figure 6 *; | Type: | Patent literature | Publication No.: | US2014284726
[XI] (LEE YI-JING [TW], et al) [X] 1,2,7 * paragraph [0040]; figure 1 * [I] 3-6,8-15; | Type: | Non-patent literature | Publication information: | [A] - WALDRON NIAMH ET AL, "Replacement fin processing for III-V on Si: From FinFets to nanowires", SOLID STATE ELECTRONICS, ELSEVIER SCIENCE PUBLISHERS, BARKING, GB, (20151023), vol. 115, doi:10.1016/J.SSE.2015.09.020, ISSN 0038-1101, pages 81 - 91, XP029309681 [A] 1-15 * figures 9, 10 * | DOI: | http://dx.doi.org/10.1016/j.sse.2015.09.020 | Cited in | International search | Type: | Patent literature | Publication No.: | US2014302658
[A] (ADAM THOMAS N [US], et al) [A] 1-21 * See abstract, paragraphs [0041]-[0046] and figures 6A-7. *; | Type: | Patent literature | Publication No.: | US2015137266
[A] (HUANG YU-LIEN [TW], et al) [A] 1-21 * See abstract, paragraph [0030] and figure 5B. *; | Type: | Patent literature | Publication No.: | WO2015147858
[A] (INTEL CORP [US]) [A] 1-21 * See abstract, paragraphs [0080]-[0083] and figures 18A-19. *; | Type: | Patent literature | Publication No.: | KR20150116771
[A] (SAMSUNG ELECTRONICS CO LTD [KR], et al) [A] 1-21* See abstract, paragraphs [0049]-[0055] and figures 2a-3c. *; | Type: | Patent literature | Publication No.: | WO2016043769
[A] (INTEL CORP [US], et al) [A] 1-21 * See abstract, page 5, lines 6-20 and figure 7. * |