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Extract from the Register of European Patents

EP About this file: EP3422100

EP3422100 - MICROTRANSFER MOLDING PROCESS AND PATTERNED SUBSTRATE OBTAINABLE THEREFROM [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  17.07.2020
Database last updated on 03.10.2024
FormerThe patent has been granted
Status updated on  09.08.2019
FormerGrant of patent is intended
Status updated on  11.07.2019
FormerRequest for examination was made
Status updated on  11.06.2019
FormerGrant of patent is intended
Status updated on  17.04.2019
FormerRequest for examination was made
Status updated on  08.03.2019
FormerThe application has been published
Status updated on  30.11.2018
Most recent event   Tooltip08.09.2023Lapse of the patent in a contracting state
New state(s): SI
published on 11.10.2023  [2023/41]
Applicant(s)For all designated states
Université d'Aix Marseille
58 Boulevard Charles Livon
13007 Marseille 7 / FR
For all designated states
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
3, rue Michel-Ange
75016 Paris / FR
For all designated states
Université de Toulon
Avenue de l'Université
83130 La Garde / FR
[2019/01]
Inventor(s)01 / GROSSO, David
129, chemin des Cigales
13190 ALLAUCH / FR
02 / BOTTEIN, Thomas
2 impasse des écrivains
59229 Téteghem / FR
 [2019/01]
Representative(s)Cabinet Becker et Associés
25, rue Louis le Grand
75002 Paris / FR
[2019/01]
Application number, filing date17305823.129.06.2017
[2019/01]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP3422100
Date:02.01.2019
Language:EN
[2019/01]
Type: B1 Patent specification 
No.:EP3422100
Date:11.09.2019
Language:EN
[2019/37]
Search report(s)(Supplementary) European search report - dispatched on:EP14.12.2017
ClassificationIPC:G03F7/00
[2019/01]
CPC:
G03F7/0002 (EP,US)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2019/15]
Former [2019/01]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:MIKROÜBERTRAGUNGS-FORMUNGSPROZESS UND DARAUS ERHÄLTLICHES STRUKTURIERTES SUBSTRAT[2019/01]
English:MICROTRANSFER MOLDING PROCESS AND PATTERNED SUBSTRATE OBTAINABLE THEREFROM[2019/01]
French:PROCÉDÉ DE LITHOGRAPHIE PAR MICROTRANSFERT ET SUBSTRAT À MOTIFS AINSI OBTENU[2019/01]
Examination procedure05.03.2019Examination requested  [2019/15]
05.03.2019Date on which the examining division has become responsible
18.04.2019Communication of intention to grant the patent
04.06.2019Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO
04.06.2019Fee for grant paid
04.06.2019Fee for publishing/printing paid
11.07.2019Communication of intention to grant the patent
01.08.2019Receipt of the translation of the claim(s)
Opposition(s)15.06.2020No opposition filed within time limit [2020/34]
Fees paidRenewal fee
25.06.2019Renewal fee patent year 03
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU29.06.2017
AL11.09.2019
AT11.09.2019
CY11.09.2019
CZ11.09.2019
DK11.09.2019
EE11.09.2019
FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
MC11.09.2019
MK11.09.2019
MT11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
SI11.09.2019
SK11.09.2019
SM11.09.2019
TR11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
IS12.01.2020
PT13.01.2020
[2023/41]
Former [2022/33]HU29.06.2017
AL11.09.2019
AT11.09.2019
CY11.09.2019
CZ11.09.2019
DK11.09.2019
EE11.09.2019
FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
MC11.09.2019
MK11.09.2019
MT11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
SK11.09.2019
SM11.09.2019
TR11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
IS12.01.2020
PT13.01.2020
Former [2022/27]HU29.06.2017
AL11.09.2019
AT11.09.2019
CY11.09.2019
CZ11.09.2019
DK11.09.2019
EE11.09.2019
FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
MC11.09.2019
MT11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
SK11.09.2019
SM11.09.2019
TR11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
IS12.01.2020
PT13.01.2020
Former [2021/12]AL11.09.2019
AT11.09.2019
CZ11.09.2019
DK11.09.2019
EE11.09.2019
FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
MC11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
SK11.09.2019
SM11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
IS12.01.2020
PT13.01.2020
Former [2020/36]AL11.09.2019
AT11.09.2019
CZ11.09.2019
DK11.09.2019
EE11.09.2019
FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
SK11.09.2019
SM11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
IS12.01.2020
PT13.01.2020
Former [2020/27]AL11.09.2019
AT11.09.2019
CZ11.09.2019
EE11.09.2019
FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
SK11.09.2019
SM11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
PT13.01.2020
IS24.02.2020
Former [2020/25]AL11.09.2019
AT11.09.2019
CZ11.09.2019
EE11.09.2019
FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
SK11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
PT13.01.2020
IS24.02.2020
Former [2020/23]AL11.09.2019
AT11.09.2019
EE11.09.2019
FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
NL11.09.2019
PL11.09.2019
RO11.09.2019
RS11.09.2019
SE11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
PT13.01.2020
Former [2020/22]AL11.09.2019
EE11.09.2019
FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
NL11.09.2019
RS11.09.2019
SE11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
PT13.01.2020
Former [2020/20]AL11.09.2019
FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
NL11.09.2019
RS11.09.2019
SE11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
Former [2020/15]AL11.09.2019
FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
RS11.09.2019
SE11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
Former [2020/12]FI11.09.2019
HR11.09.2019
LT11.09.2019
LV11.09.2019
RS11.09.2019
SE11.09.2019
BG11.12.2019
NO11.12.2019
GR12.12.2019
Former [2020/10]FI11.09.2019
LT11.09.2019
SE11.09.2019
BG11.12.2019
NO11.12.2019
Former [2020/09]FI11.09.2019
LT11.09.2019
NO11.12.2019
Former [2020/08]LT11.09.2019
NO11.12.2019
Documents cited:Search[A]US2009026658  (HOSODA YASUO [JP], et al) [A] 1-11 * figure 1; claim 21 *;
 [A]US2009098340  (CAMPOS LUIS M [US], et al) [A] 1-11 * paragraph [0042]; figure 7; claim 1 *;
 [A]US2010109201  (FLETCHER EDWARD BRIAN [US], et al) [A] 1-11* claim 16 *;
 [A]US2013078796  (GANESAN RAMAKRISHNAN [SG], et al) [A] 1-11 * figure 1; claims 1,8,19 *
by applicant   - C. FERNANDEZ-SANCHEZ, Chem. Mater., (20080000), vol. 20, pages 2662 - 2668
    - X. ZHAO et al., Adv. Mater., (19960000), vol. 8, page 837
    - KANG, Fabrication of ceramic layer-by-layer infrared wavelength photonic band gap crystals, Iowa State University, (20040000), pages 68 - 75
    - C.R. MARTIN et al., Journal of Electroceramics, (20040000), vol. 12, pages 53 - 68
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