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EP3590130
European procedure
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Extract from the Register of European Patents
EP About this file: EP3590130
| EP3590130 - METHOD AND DEVICE FOR BONDING CHIPS [Right-click to bookmark this link] | Status | Examination is in progress Status updated on 22.07.2022 Database last updated on 09.09.2024 | |
| Former | Request for examination was made Status updated on 06.12.2019 | ||
| Former | The international publication has been made Status updated on 11.09.2018 | ||
| Former | unknown Status updated on 21.03.2017 | Most recent event Tooltip | 08.03.2024 | New entry: Renewal fee paid | Applicant(s) | For all designated states EV Group E. Thallner GmbH DI Erich Thallner Strasse 1 St. Florian am Inn / AT | [2020/02] | Inventor(s) | 01 /
WIMPLINGER, Markus Richard Billingerweg 18/1 4910 Ried im Innkreis / AT | [2020/02] | Representative(s) | Schneider, Sascha, et al Becker & Müller Patentanwälte Turmstraße 22 40878 Ratingen / DE | [2020/02] | Application number, filing date | 17710159.9 | 02.03.2017 | [2020/02] | WO2017EP54971 | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | WO2018157937 | Date: | 07.09.2018 | Language: | DE | [2018/36] | Type: | A1 Application with search report | No.: | EP3590130 | Date: | 08.01.2020 | Language: | DE | The application published by WIPO in one of the EPO official languages on 07.09.2018 takes the place of the publication of the European patent application. | [2020/02] | Search report(s) | International search report - published on: | EP | 07.09.2018 | (Supplementary) European search report - dispatched on: | EP | 22.07.2022 | Classification | IPC: | H01L21/683, H01L21/67, H01L21/78, H01L21/60, H01L23/544 | [2020/02] | CPC: |
H01L24/80 (EP,KR,US);
H01L24/97 (EP,KR);
H01L25/50 (EP,US);
H01L21/6835 (EP,KR);
H01L21/6836 (EP);
H01L24/74 (US);
H01L24/75 (EP,KR,US);
H01L25/0652 (US);
H01L25/0657 (EP);
H05K13/0404 (US);
H01L2221/68318 (EP,KR);
H01L2221/68327 (EP,KR);
H01L2221/68354 (EP,KR);
H01L2221/68368 (EP,KR);
H01L2221/68381 (EP,KR);
H01L2223/54426 (EP);
H01L2224/75317 (EP,KR);
H01L2224/75702 (EP,KR);
H01L2224/758 (EP,KR);
H01L2224/7598 (EP,KR);
H01L2224/80003 (US);
H01L2224/80004 (EP,KR);
H01L2224/80006 (EP,KR);
H01L2224/8001 (EP,KR);
H01L2224/80011 (US);
H01L2224/80013 (US);
H01L2224/80143 (EP,KR);
H01L2224/80894 (US);
H01L2224/80895 (EP,KR);
H01L2224/80896 (EP);
H01L2224/94 (EP);
H01L2224/95001 (EP);
H01L2224/95136 (EP);
| C-Set: |
H01L2224/94, H01L2224/80001 (EP);
H01L2224/97, H01L2224/80001 (EP) | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2020/02] | Title | German: | VERFAHREN UND VORRICHTUNG ZUM BONDEN VON CHIPS | [2020/02] | English: | METHOD AND DEVICE FOR BONDING CHIPS | [2020/02] | French: | PROCÉDÉ ET DISPOSITIF D'ASSEMBLAGE DE PUCES | [2020/02] | Entry into regional phase | 13.09.2019 | National basic fee paid | 13.09.2019 | Designation fee(s) paid | 13.09.2019 | Examination fee paid | Examination procedure | 21.11.2018 | Request for preliminary examination filed International Preliminary Examining Authority: EP | 13.09.2019 | Examination requested [2020/02] | 13.09.2019 | Date on which the examining division has become responsible | 19.03.2020 | Amendment by applicant (claims and/or description) | 22.07.2022 | Despatch of a communication from the examining division to which search results under Rule 164(2) EPC are annexed (Time limit: M04) [2022/34] | 22.07.2022 | Despatch of a communication from the examining division (Time limit: M04) | 27.10.2022 | Reply to a communication from the examining division | Fees paid | Renewal fee | 13.09.2019 | Renewal fee patent year 03 | 17.02.2020 | Renewal fee patent year 04 | 05.03.2021 | Renewal fee patent year 05 | 10.03.2022 | Renewal fee patent year 06 | 06.03.2023 | Renewal fee patent year 07 | 08.03.2024 | Renewal fee patent year 08 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [XI]US2015228535 (SADAKA MARIAM [US], et al) | by applicant | US6214692 | WO2012100786 | WO2012136267 | WO2012136268 | WO2012136266 | WO2014015899 | WO2014191033 | WO2014202106 | WO2015082020 | WO2016EP53268 | WO2016EP56249 | WO2016EP69307 |