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Extract from the Register of European Patents

EP About this file: EP3496138

EP3496138 - SUPPORT SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT [Right-click to bookmark this link]
Former [2019/24]SUPPORT SUBSTRATE, LAMINATE WITH SUPPORT SUBSTRATE, AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT
[2023/37]
StatusThe patent has been granted
Status updated on  15.12.2023
Database last updated on 03.09.2024
FormerGrant of patent is intended
Status updated on  30.08.2023
FormerExamination is in progress
Status updated on  19.11.2021
FormerRequest for examination was made
Status updated on  10.05.2019
FormerThe international publication has been made
Status updated on  10.02.2018
Most recent event   Tooltip08.08.2024Lapse of the patent in a contracting state
New state(s): SE		published on 11.09.2024 [2024/37]
Applicant(s)For all designated states
Mitsubishi Gas Chemical Company, Inc.
5-2, Marunouchi 2-chome Chiyoda-ku
Tokyo 100-8324 / JP
[2019/24]
Inventor(s)01 / HIRANO, Syunsuke
c/o YONEZAWA DIA ELECTRONICS Co., Inc.
446-3 Hachimanpara 3-chome
Yonezawa-shi Yamagata 992-1128 / JP
02 / KATO, Yoshihiro
c/o YONEZAWA DIA ELECTRONICS Co., Inc.
446-3 Hachimanpara 3-chome
Yonezawa-shi Yamagata 992-1128 / JP
03 / OGASHIWA, Takaaki
c/o YONEZAWA DIA ELECTRONICS Co., Inc.
446-3 Hachimanpara 3-chome
Yonezawa-shi Yamagata 992-1128 / JP
04 / KAWASHITA, Kazuaki
c/o YONEZAWA DIA ELECTRONICS Co., Inc.
446-3 Hachimanpara 3-chome
Yonezawa-shi Yamagata 992-1128 / JP
05 / NAKAJIMA, Youichi
c/o YONEZAWA DIA ELECTRONICS Co., Inc.
446-3 Hachimanpara 3-chome
Yonezawa-shi Yamagata 992-1128 / JP
 [2024/03]
Former [2019/24]01 / HIRANO, Syunsuke
c/o YONEZAWA DIA ELECTRONICS Co. Inc.
446-3 Hachimanpara 3-chome
Yonezawa-shi Yamagata 992-1128 / JP
02 / KATO, Yoshihiro
c/o YONEZAWA DIA ELECTRONICS Co. Inc.
446-3 Hachimanpara 3-chome
Yonezawa-shi Yamagata 992-1128 / JP
03 / OGASHIWA, Takaaki
c/o YONEZAWA DIA ELECTRONICS Co. Inc.
446-3 Hachimanpara 3-chome
Yonezawa-shi Yamagata 992-1128 / JP
04 / KAWASHITA, Kazuaki
c/o YONEZAWA DIA ELECTRONICS Co. Inc.
446-3 Hachimanpara 3-chome
Yonezawa-shi Yamagata 992-1128 / JP
05 / NAKAJIMA, Youichi
c/o YONEZAWA DIA ELECTRONICS Co. Inc.
446-3 Hachimanpara 3-chome
Yonezawa-shi Yamagata 992-1128 / JP
Representative(s)Hoffmann Eitle
Patent- und Rechtsanwälte PartmbB
Arabellastraße 30
81925 München / DE
[2019/24]
Application number, filing date17837105.004.08.2017
[2019/24]
WO2017JP28432
Priority number, dateJP2016015489005.08.2016         Original published format: JP 2016154890
JP2017008633825.04.2017         Original published format: JP 2017086338
[2019/24]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2018026004
Date:08.02.2018
Language:JA
[2018/06]
Type: A1 Application with search report 
No.:EP3496138
Date:12.06.2019
Language:EN
[2019/24]
Type: B1 Patent specification 
No.:EP3496138
Date:17.01.2024
Language:EN
[2024/03]
Search report(s)International search report - published on:JP08.02.2018
(Supplementary) European search report - dispatched on:EP11.09.2019
ClassificationIPC:H01L21/48, H05K3/46, H01L23/538, H01L23/498, H01L21/683, H05K3/00
[2023/37]
CPC:
H01L21/4857 (EP,US); H01L23/142 (KR); H01L21/022 (US);
G03F7/34 (KR); H01L21/0274 (KR); H01L21/30604 (KR);
H01L21/3065 (KR); H01L21/6835 (EP); H01L21/768 (KR);
H01L23/12 (US); H01L23/31 (KR); H01L23/485 (KR);
H01L23/49822 (EP,US); H01L23/5226 (US); H01L23/525 (KR);
H01L23/528 (US); H01L23/5383 (US); H05K3/0067 (US);
H05K3/007 (EP,US); H05K3/0097 (EP,US); H05K3/46 (KR);
H05K3/4623 (US); H05K3/4629 (US); H01L2221/68345 (EP);
H05K2203/1536 (EP,US); H05K3/4682 (EP,US) (-)
Former IPC [2019/41]H01L21/48, H01L23/498, H01L23/538, H05K3/46
Former IPC [2019/24]H01L23/12, H05K3/46
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2019/24]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TitleGerman:TRÄGERSUBSTRAT UND VERFAHREN ZUR HERSTELLUNG EINES GEHÄUSESUBSTRATS ZUR MONTAGE EINES HALBLEITERELEMENTS[2023/37]
English:SUPPORT SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT[2023/37]
French:SUBSTRAT DE SUPPORT ET PROCÉDÉ DE FABRICATION D'UN SUBSTRAT DE BOÎTIER POUR MONTER UN ÉLÉMENT SEMI-CONDUCTEUR[2023/37]
Former [2019/24]TRÄGERSUBSTRAT, LAMINAT MIT TRÄGERSUBSTRAT UND VERFAHREN ZUR HERSTELLUNG EINES GEHÄUSESUBSTRATS ZUR MONTAGE EINES HALBLEITERELEMENTS
Former [2019/24]SUPPORT SUBSTRATE, LAMINATE WITH SUPPORT SUBSTRATE, AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT
Former [2019/24]SUBSTRAT DE SUPPORT, STRATIFIÉ AVEC SUBSTRAT DE SUPPORT, ET PROCÉDÉ DE FABRICATION D'UN SUBSTRAT DE BOÎTIER POUR MONTER UN ÉLÉMENT SEMI-CONDUCTEUR
Entry into regional phase04.03.2019Translation filed 
04.03.2019National basic fee paid 
04.03.2019Search fee paid 
04.03.2019Designation fee(s) paid 
04.03.2019Examination fee paid 
Examination procedure04.03.2019Examination requested  [2019/24]
11.03.2020Amendment by applicant (claims and/or description)
22.11.2021Despatch of a communication from the examining division (Time limit: M04)
01.04.2022Reply to a communication from the examining division
31.08.2023Communication of intention to grant the patent
12.12.2023Fee for grant paid
12.12.2023Fee for publishing/printing paid
12.12.2023Receipt of the translation of the claim(s)
Fees paidRenewal fee
12.08.2019Renewal fee patent year 03
13.08.2020Renewal fee patent year 04
13.08.2021Renewal fee patent year 05
28.06.2022Renewal fee patent year 06
05.07.2023Renewal fee patent year 07
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT17.01.2024
BG17.01.2024
ES17.01.2024
FI17.01.2024
HR17.01.2024
LT17.01.2024
LV17.01.2024
PL17.01.2024
SE17.01.2024
NO17.04.2024
RS17.04.2024
GR18.04.2024
IS17.05.2024
PT17.05.2024
[2024/37]
Former [2024/36]AT17.01.2024
BG17.01.2024
ES17.01.2024
FI17.01.2024
HR17.01.2024
LT17.01.2024
LV17.01.2024
PL17.01.2024
NO17.04.2024
RS17.04.2024
GR18.04.2024
IS17.05.2024
PT17.05.2024
Former [2024/35]AT17.01.2024
BG17.01.2024
ES17.01.2024
FI17.01.2024
HR17.01.2024
LT17.01.2024
NO17.04.2024
RS17.04.2024
GR18.04.2024
IS17.05.2024
Former [2024/34]BG17.01.2024
FI17.01.2024
HR17.01.2024
LT17.01.2024
NO17.04.2024
RS17.04.2024
GR18.04.2024
IS17.05.2024
Former [2024/33]LT17.01.2024
NO17.04.2024
IS17.05.2024
Former [2024/32]IS17.05.2024
Documents cited:Search[Y]JP2001057472  (HITACHI CHEMICAL CO LTD) [Y] 1-15 * abstract * * figures 1-3 ** paragraph [0005] *;
 [Y]JP2005101137  (HITACHI CHEMICAL CO LTD) [Y] 1-15 * abstract * * figure 2 * * paragraphs [0033] - [0035] * * paragraphs [0040] - [0041] *;
 [Y]US2007289128  (TAKANO KENJI [JP], et al) [Y] 1-15 * abstract * * figures 1-8 * * paragraphs [0034] - [0047] *;
 [Y]JP2009032918  (SHINKO ELECTRIC IND CO) [Y] 1-15 * abstract * * figures 3-10 * * paragraph [0025] *;
 [Y]US2010096078  (NAKAMURA TATSUYA [JP], et al) [Y] 1-15 * abstract * * figures 5-12 * * paragraphs [0079] - [0107] *;
 [XY]US2010314037  (LIU CHIN-MING [TW]) [X] 1,11,15 * abstract * * figure 2 * * paragraphs [0042] - [0053] * [Y] 2-10,12-14;
 [Y]JP2012094840  (HITACHI CHEMICAL CO LTD) [Y] 1-15 * abstract * * figure 3 * * paragraphs [0028] - [0030] *;
 [Y]WO2015076373  (MITSUI MINING & SMELTING CO [JP]) [Y] 1-15 * abstract * * figures 3-5 *
International search[YA]JP2001057472  (HITACHI CHEMICAL CO LTD) [Y] 20-21, 29 * , abstract (Family: none) *[A] 15;
 [YA]JP2005101137  (HITACHI CHEMICAL CO LTD) [Y] 3, 7, 16-17, 22-25, 27, 30 * , paragraphs [0033] to [0035], [0040] to [0041]; fig. 2 (Family: none) * [A] 15;
 [XYA]JP2007335698  (FUJITSU LTD) [X] 26, 31 * , paragraphs [0012] to [0022]; fig. 1 to 8 & US 2007/0289128 A1 paragraphs [0021], [0034] to [0047]; fig. 1 to 8 & KR 10-2007-0120013 A & CN 101090608 A & TW 200803681 A * [Y] 1-14, 16-25, 27-30, 32 [A] 15;
 [YA]JP2009032918  (SHINKO ELECTRIC IND CO) [Y] 18-19, 28 * , paragraphs [0025], [0050] to [0051]; fig. 6 to 7 (Family: none) * [A] 15;
 [YA]JP2012094840  (HITACHI CHEMICAL CO LTD) [Y] 1-14, 16-25, 27-30, 32 * , paragraphs [0028] to [0030]; fig. 3 & WO 2012/043742 A1 & TW 201218323 A & CN 103119710 A & KR 10-2013-0043684 A * [A] 15
ExaminationUS2014020931
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.