EP3496138 - SUPPORT SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT [Right-click to bookmark this link] | |||
Former [2019/24] | SUPPORT SUBSTRATE, LAMINATE WITH SUPPORT SUBSTRATE, AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT | ||
[2023/37] | Status | The patent has been granted Status updated on 15.12.2023 Database last updated on 03.09.2024 | |
Former | Grant of patent is intended Status updated on 30.08.2023 | ||
Former | Examination is in progress Status updated on 19.11.2021 | ||
Former | Request for examination was made Status updated on 10.05.2019 | ||
Former | The international publication has been made Status updated on 10.02.2018 | Most recent event Tooltip | 08.08.2024 | Lapse of the patent in a contracting state New state(s): SE | published on 11.09.2024 [2024/37] | Applicant(s) | For all designated states Mitsubishi Gas Chemical Company, Inc. 5-2, Marunouchi 2-chome Chiyoda-ku Tokyo 100-8324 / JP | [2019/24] | Inventor(s) | 01 /
HIRANO, Syunsuke c/o YONEZAWA DIA ELECTRONICS Co., Inc. 446-3 Hachimanpara 3-chome Yonezawa-shi Yamagata 992-1128 / JP | 02 /
KATO, Yoshihiro c/o YONEZAWA DIA ELECTRONICS Co., Inc. 446-3 Hachimanpara 3-chome Yonezawa-shi Yamagata 992-1128 / JP | 03 /
OGASHIWA, Takaaki c/o YONEZAWA DIA ELECTRONICS Co., Inc. 446-3 Hachimanpara 3-chome Yonezawa-shi Yamagata 992-1128 / JP | 04 /
KAWASHITA, Kazuaki c/o YONEZAWA DIA ELECTRONICS Co., Inc. 446-3 Hachimanpara 3-chome Yonezawa-shi Yamagata 992-1128 / JP | 05 /
NAKAJIMA, Youichi c/o YONEZAWA DIA ELECTRONICS Co., Inc. 446-3 Hachimanpara 3-chome Yonezawa-shi Yamagata 992-1128 / JP | [2024/03] |
Former [2019/24] | 01 /
HIRANO, Syunsuke c/o YONEZAWA DIA ELECTRONICS Co. Inc. 446-3 Hachimanpara 3-chome Yonezawa-shi Yamagata 992-1128 / JP | ||
02 /
KATO, Yoshihiro c/o YONEZAWA DIA ELECTRONICS Co. Inc. 446-3 Hachimanpara 3-chome Yonezawa-shi Yamagata 992-1128 / JP | |||
03 /
OGASHIWA, Takaaki c/o YONEZAWA DIA ELECTRONICS Co. Inc. 446-3 Hachimanpara 3-chome Yonezawa-shi Yamagata 992-1128 / JP | |||
04 /
KAWASHITA, Kazuaki c/o YONEZAWA DIA ELECTRONICS Co. Inc. 446-3 Hachimanpara 3-chome Yonezawa-shi Yamagata 992-1128 / JP | |||
05 /
NAKAJIMA, Youichi c/o YONEZAWA DIA ELECTRONICS Co. Inc. 446-3 Hachimanpara 3-chome Yonezawa-shi Yamagata 992-1128 / JP | Representative(s) | Hoffmann Eitle Patent- und Rechtsanwälte PartmbB Arabellastraße 30 81925 München / DE | [2019/24] | Application number, filing date | 17837105.0 | 04.08.2017 | [2019/24] | WO2017JP28432 | Priority number, date | JP20160154890 | 05.08.2016 Original published format: JP 2016154890 | JP20170086338 | 25.04.2017 Original published format: JP 2017086338 | [2019/24] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2018026004 | Date: | 08.02.2018 | Language: | JA | [2018/06] | Type: | A1 Application with search report | No.: | EP3496138 | Date: | 12.06.2019 | Language: | EN | [2019/24] | Type: | B1 Patent specification | No.: | EP3496138 | Date: | 17.01.2024 | Language: | EN | [2024/03] | Search report(s) | International search report - published on: | JP | 08.02.2018 | (Supplementary) European search report - dispatched on: | EP | 11.09.2019 | Classification | IPC: | H01L21/48, H05K3/46, H01L23/538, H01L23/498, H01L21/683, H05K3/00 | [2023/37] | CPC: |
H01L21/4857 (EP,US);
H01L23/142 (KR);
H01L21/022 (US);
G03F7/34 (KR);
H01L21/0274 (KR);
H01L21/30604 (KR);
H01L21/3065 (KR);
H01L21/6835 (EP);
H01L21/768 (KR);
H01L23/12 (US);
H01L23/31 (KR);
H01L23/485 (KR);
H01L23/49822 (EP,US);
H01L23/5226 (US);
H01L23/525 (KR);
H01L23/528 (US);
H01L23/5383 (US);
H05K3/0067 (US);
H05K3/007 (EP,US);
H05K3/0097 (EP,US);
H05K3/46 (KR);
H05K3/4623 (US);
H05K3/4629 (US);
H01L2221/68345 (EP);
|
Former IPC [2019/41] | H01L21/48, H01L23/498, H01L23/538, H05K3/46 | ||
Former IPC [2019/24] | H01L23/12, H05K3/46 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2019/24] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | MA | Not yet paid | MD | Not yet paid | Title | German: | TRÄGERSUBSTRAT UND VERFAHREN ZUR HERSTELLUNG EINES GEHÄUSESUBSTRATS ZUR MONTAGE EINES HALBLEITERELEMENTS | [2023/37] | English: | SUPPORT SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT | [2023/37] | French: | SUBSTRAT DE SUPPORT ET PROCÉDÉ DE FABRICATION D'UN SUBSTRAT DE BOÎTIER POUR MONTER UN ÉLÉMENT SEMI-CONDUCTEUR | [2023/37] |
Former [2019/24] | TRÄGERSUBSTRAT, LAMINAT MIT TRÄGERSUBSTRAT UND VERFAHREN ZUR HERSTELLUNG EINES GEHÄUSESUBSTRATS ZUR MONTAGE EINES HALBLEITERELEMENTS | ||
Former [2019/24] | SUPPORT SUBSTRATE, LAMINATE WITH SUPPORT SUBSTRATE, AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT | ||
Former [2019/24] | SUBSTRAT DE SUPPORT, STRATIFIÉ AVEC SUBSTRAT DE SUPPORT, ET PROCÉDÉ DE FABRICATION D'UN SUBSTRAT DE BOÎTIER POUR MONTER UN ÉLÉMENT SEMI-CONDUCTEUR | Entry into regional phase | 04.03.2019 | Translation filed | 04.03.2019 | National basic fee paid | 04.03.2019 | Search fee paid | 04.03.2019 | Designation fee(s) paid | 04.03.2019 | Examination fee paid | Examination procedure | 04.03.2019 | Examination requested [2019/24] | 11.03.2020 | Amendment by applicant (claims and/or description) | 22.11.2021 | Despatch of a communication from the examining division (Time limit: M04) | 01.04.2022 | Reply to a communication from the examining division | 31.08.2023 | Communication of intention to grant the patent | 12.12.2023 | Fee for grant paid | 12.12.2023 | Fee for publishing/printing paid | 12.12.2023 | Receipt of the translation of the claim(s) | Fees paid | Renewal fee | 12.08.2019 | Renewal fee patent year 03 | 13.08.2020 | Renewal fee patent year 04 | 13.08.2021 | Renewal fee patent year 05 | 28.06.2022 | Renewal fee patent year 06 | 05.07.2023 | Renewal fee patent year 07 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 17.01.2024 | BG | 17.01.2024 | ES | 17.01.2024 | FI | 17.01.2024 | HR | 17.01.2024 | LT | 17.01.2024 | LV | 17.01.2024 | PL | 17.01.2024 | SE | 17.01.2024 | NO | 17.04.2024 | RS | 17.04.2024 | GR | 18.04.2024 | IS | 17.05.2024 | PT | 17.05.2024 | [2024/37] |
Former [2024/36] | AT | 17.01.2024 | |
BG | 17.01.2024 | ||
ES | 17.01.2024 | ||
FI | 17.01.2024 | ||
HR | 17.01.2024 | ||
LT | 17.01.2024 | ||
LV | 17.01.2024 | ||
PL | 17.01.2024 | ||
NO | 17.04.2024 | ||
RS | 17.04.2024 | ||
GR | 18.04.2024 | ||
IS | 17.05.2024 | ||
PT | 17.05.2024 | ||
Former [2024/35] | AT | 17.01.2024 | |
BG | 17.01.2024 | ||
ES | 17.01.2024 | ||
FI | 17.01.2024 | ||
HR | 17.01.2024 | ||
LT | 17.01.2024 | ||
NO | 17.04.2024 | ||
RS | 17.04.2024 | ||
GR | 18.04.2024 | ||
IS | 17.05.2024 | ||
Former [2024/34] | BG | 17.01.2024 | |
FI | 17.01.2024 | ||
HR | 17.01.2024 | ||
LT | 17.01.2024 | ||
NO | 17.04.2024 | ||
RS | 17.04.2024 | ||
GR | 18.04.2024 | ||
IS | 17.05.2024 | ||
Former [2024/33] | LT | 17.01.2024 | |
NO | 17.04.2024 | ||
IS | 17.05.2024 | ||
Former [2024/32] | IS | 17.05.2024 | Documents cited: | Search | [Y]JP2001057472 (HITACHI CHEMICAL CO LTD) [Y] 1-15 * abstract * * figures 1-3 ** paragraph [0005] *; | [Y]JP2005101137 (HITACHI CHEMICAL CO LTD) [Y] 1-15 * abstract * * figure 2 * * paragraphs [0033] - [0035] * * paragraphs [0040] - [0041] *; | [Y]US2007289128 (TAKANO KENJI [JP], et al) [Y] 1-15 * abstract * * figures 1-8 * * paragraphs [0034] - [0047] *; | [Y]JP2009032918 (SHINKO ELECTRIC IND CO) [Y] 1-15 * abstract * * figures 3-10 * * paragraph [0025] *; | [Y]US2010096078 (NAKAMURA TATSUYA [JP], et al) [Y] 1-15 * abstract * * figures 5-12 * * paragraphs [0079] - [0107] *; | [XY]US2010314037 (LIU CHIN-MING [TW]) [X] 1,11,15 * abstract * * figure 2 * * paragraphs [0042] - [0053] * [Y] 2-10,12-14; | [Y]JP2012094840 (HITACHI CHEMICAL CO LTD) [Y] 1-15 * abstract * * figure 3 * * paragraphs [0028] - [0030] *; | [Y]WO2015076373 (MITSUI MINING & SMELTING CO [JP]) [Y] 1-15 * abstract * * figures 3-5 * | International search | [YA]JP2001057472 (HITACHI CHEMICAL CO LTD) [Y] 20-21, 29 * , abstract (Family: none) *[A] 15; | [YA]JP2005101137 (HITACHI CHEMICAL CO LTD) [Y] 3, 7, 16-17, 22-25, 27, 30 * , paragraphs [0033] to [0035], [0040] to [0041]; fig. 2 (Family: none) * [A] 15; | [XYA]JP2007335698 (FUJITSU LTD) [X] 26, 31 * , paragraphs [0012] to [0022]; fig. 1 to 8 & US 2007/0289128 A1 paragraphs [0021], [0034] to [0047]; fig. 1 to 8 & KR 10-2007-0120013 A & CN 101090608 A & TW 200803681 A * [Y] 1-14, 16-25, 27-30, 32 [A] 15; | [YA]JP2009032918 (SHINKO ELECTRIC IND CO) [Y] 18-19, 28 * , paragraphs [0025], [0050] to [0051]; fig. 6 to 7 (Family: none) * [A] 15; | [YA]JP2012094840 (HITACHI CHEMICAL CO LTD) [Y] 1-14, 16-25, 27-30, 32 * , paragraphs [0028] to [0030]; fig. 3 & WO 2012/043742 A1 & TW 201218323 A & CN 103119710 A & KR 10-2013-0043684 A * [A] 15 | Examination | US2014020931 |