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Extract from the Register of European Patents

EP About this file: EP3533847

EP3533847 - DIELECTRIC-HEATING BONDING FILM AND JOINING METHOD USING DIELECTRIC-HEATING BONDING FILM [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  02.08.2024
Database last updated on 26.04.2025
FormerThe patent has been granted
Status updated on  25.08.2023
FormerGrant of patent is intended
Status updated on  22.05.2023
FormerExamination is in progress
Status updated on  20.05.2021
FormerRequest for examination was made
Status updated on  02.08.2019
FormerThe international publication has been made
Status updated on  05.05.2018
Most recent event   Tooltip15.11.2024Lapse of the patent in a contracting state
New state(s): BG		published on 18.12.2024  [2024/51]
Applicant(s)For all designated states
LINTEC Corporation
23-23, Honcho
Itabashi-ku
Tokyo 173-0001 / JP
[2019/36]
Inventor(s)01 / ISHIKAWA, Masakazu
c/o LINTEC Corporation
23-23 Honcho
Itabashi-ku
Tokyo 173-0001 / JP
02 / IZUMI, Tatsuya
c/o LINTEC Corporation
23-23 Honcho
Itabashi-ku
Tokyo 173-0001 / JP
 [2019/36]
Representative(s)Gille Hrabal Partnerschaftsgesellschaft mbB Patentanwälte
Brucknerstraße 20
40593 Düsseldorf / DE
[2023/39]
Former [2019/36]Gille Hrabal
Brucknerstrasse 20
40593 Düsseldorf / DE
Application number, filing date17863456.418.10.2017
[2019/36]
WO2017JP37616
Priority number, dateJP2016021021827.10.2016         Original published format: JP 2016210218
JP2017002180609.02.2017         Original published format: JP 2017021806
JP2017002180309.02.2017         Original published format: JP 2017021803
[2019/36]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2018079354
Date:03.05.2018
Language:JA
[2018/18]
Type: A1 Application with search report 
No.:EP3533847
Date:04.09.2019
Language:EN
[2019/36]
Type: B1 Patent specification 
No.:EP3533847
Date:27.09.2023
Language:EN
[2023/39]
Search report(s)International search report - published on:JP03.05.2018
(Supplementary) European search report - dispatched on:EP02.06.2020
ClassificationIPC:C09J7/00, B29C65/04, B29C65/40, C09J11/04, C09J123/00, C09J123/10, H05B6/46, H05B6/64, C08K3/22, C09J5/06, C09J7/10, B23K13/00, C09J125/04, C09J167/00, C09J177/00, C09J201/00
[2020/27]
CPC:
C09J7/10 (EP); C09J7/00 (KR,US); B29C65/04 (US);
B23K13/00 (EP); B29C65/40 (US); B29C65/425 (US);
B29C65/50 (US); C08K3/22 (EP,US); C09J11/04 (KR,US);
C09J123/00 (EP,US); C09J123/10 (EP,US); C09J123/12 (KR);
C09J123/26 (US); C09J125/04 (EP,US); C09J129/14 (US);
C09J131/04 (US); C09J167/00 (EP,US); C09J177/00 (EP,US);
C09J201/00 (EP,US); C09J5/06 (EP,US); C09J7/35 (US);
C09J9/00 (US); H01B17/56 (US); H01B3/441 (US);
H05B6/46 (EP,KR,US); H05B6/50 (US); H05B6/64 (EP,US);
C08K2003/2237 (EP); C08K2003/2296 (KR,US); C08K2201/005 (EP,US);
C08K3/14 (US); C09J2203/326 (US); C09J2301/304 (EP);
C09J2301/312 (EP,KR); C09J2301/408 (EP,US); C09J2301/416 (US);
C09J2423/00 (EP); C09J2423/10 (US); C09J2423/106 (EP);
C09J2451/00 (EP); C09J2467/00 (EP) (-)
Former IPC [2019/36]C09J7/00, B29C65/04, B29C65/40, C09J11/04, C09J123/00, C09J123/10, H05B6/46, H05B6/64
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2019/36]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TitleGerman:DIELEKTRISCH ERWÄRMENDE KLEBEFOLIE UND VERBINDUNGSVERFAHREN MIT DER DIELEKTRISCH ERWÄRMENDEN KLEBEFOLIE[2019/36]
English:DIELECTRIC-HEATING BONDING FILM AND JOINING METHOD USING DIELECTRIC-HEATING BONDING FILM[2019/36]
French:FILM DE LIAISON À CHAUFFAGE DIÉLECTRIQUE ET PROCÉDÉ DE JONCTION UTILISANT UN FILM DE LIAISON À CHAUFFAGE DIÉLECTRIQUE[2019/36]
Entry into regional phase12.04.2019Translation filed 
12.04.2019National basic fee paid 
12.04.2019Search fee paid 
12.04.2019Designation fee(s) paid 
12.04.2019Examination fee paid 
Examination procedure12.04.2019Examination requested  [2019/36]
16.12.2020Amendment by applicant (claims and/or description)
19.05.2021Despatch of a communication from the examining division (Time limit: M04)
17.09.2021Reply to a communication from the examining division
27.01.2022Despatch of a communication from the examining division (Time limit: M04)
24.05.2022Reply to a communication from the examining division
23.05.2023Communication of intention to grant the patent
21.08.2023Fee for grant paid
21.08.2023Fee for publishing/printing paid
21.08.2023Receipt of the translation of the claim(s)
Opposition(s)28.06.2024No opposition filed within time limit [2024/36]
Fees paidRenewal fee
25.10.2019Renewal fee patent year 03
23.10.2020Renewal fee patent year 04
25.10.2021Renewal fee patent year 05
25.10.2022Renewal fee patent year 06
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT27.09.2023
BG27.09.2023
CZ27.09.2023
DK27.09.2023
EE27.09.2023
ES27.09.2023
FI27.09.2023
HR27.09.2023
IT27.09.2023
LT27.09.2023
LV27.09.2023
MC27.09.2023
NL27.09.2023
PL27.09.2023
RO27.09.2023
RS27.09.2023
SE27.09.2023
SI27.09.2023
SK27.09.2023
SM27.09.2023
IE18.10.2023
LU18.10.2023
BE31.10.2023
CH31.10.2023
GB27.12.2023
NO27.12.2023
GR28.12.2023
IS27.01.2024
PT29.01.2024
[2024/51]
Former [2024/49]AT27.09.2023
CZ27.09.2023
DK27.09.2023
EE27.09.2023
ES27.09.2023
FI27.09.2023
HR27.09.2023
IT27.09.2023
LT27.09.2023
LV27.09.2023
MC27.09.2023
NL27.09.2023
PL27.09.2023
RO27.09.2023
RS27.09.2023
SE27.09.2023
SI27.09.2023
SK27.09.2023
SM27.09.2023
IE18.10.2023
LU18.10.2023
BE31.10.2023
CH31.10.2023
GB27.12.2023
NO27.12.2023
GR28.12.2023
IS27.01.2024
PT29.01.2024
Former [2024/47]AT27.09.2023
CZ27.09.2023
DK27.09.2023
EE27.09.2023
ES27.09.2023
FI27.09.2023
HR27.09.2023
IT27.09.2023
LT27.09.2023
LV27.09.2023
MC27.09.2023
NL27.09.2023
PL27.09.2023
RO27.09.2023
RS27.09.2023
SE27.09.2023
SK27.09.2023
SM27.09.2023
IE18.10.2023
LU18.10.2023
BE31.10.2023
CH31.10.2023
GB27.12.2023
NO27.12.2023
GR28.12.2023
IS27.01.2024
PT29.01.2024
Former [2024/46]AT27.09.2023
CZ27.09.2023
DK27.09.2023
EE27.09.2023
ES27.09.2023
FI27.09.2023
HR27.09.2023
IT27.09.2023
LT27.09.2023
LV27.09.2023
MC27.09.2023
NL27.09.2023
PL27.09.2023
RO27.09.2023
RS27.09.2023
SE27.09.2023
SK27.09.2023
SM27.09.2023
IE18.10.2023
LU18.10.2023
BE31.10.2023
CH31.10.2023
NO27.12.2023
GR28.12.2023
IS27.01.2024
PT29.01.2024
Former [2024/36]AT27.09.2023
CZ27.09.2023
DK27.09.2023
EE27.09.2023
ES27.09.2023
FI27.09.2023
HR27.09.2023
IT27.09.2023
LT27.09.2023
LV27.09.2023
MC27.09.2023
NL27.09.2023
PL27.09.2023
RO27.09.2023
RS27.09.2023
SE27.09.2023
SK27.09.2023
SM27.09.2023
LU18.10.2023
BE31.10.2023
CH31.10.2023
NO27.12.2023
GR28.12.2023
IS27.01.2024
PT29.01.2024
Former [2024/34]AT27.09.2023
CZ27.09.2023
DK27.09.2023
EE27.09.2023
ES27.09.2023
FI27.09.2023
HR27.09.2023
IT27.09.2023
LT27.09.2023
LV27.09.2023
MC27.09.2023
NL27.09.2023
PL27.09.2023
RO27.09.2023
RS27.09.2023
SE27.09.2023
SK27.09.2023
SM27.09.2023
LU18.10.2023
CH31.10.2023
NO27.12.2023
GR28.12.2023
IS27.01.2024
PT29.01.2024
Former [2024/33]AT27.09.2023
CZ27.09.2023
DK27.09.2023
EE27.09.2023
ES27.09.2023
FI27.09.2023
HR27.09.2023
IT27.09.2023
LT27.09.2023
LV27.09.2023
MC27.09.2023
NL27.09.2023
PL27.09.2023
RO27.09.2023
RS27.09.2023
SE27.09.2023
SK27.09.2023
SM27.09.2023
LU18.10.2023
NO27.12.2023
GR28.12.2023
IS27.01.2024
PT29.01.2024
Former [2024/32]AT27.09.2023
CZ27.09.2023
EE27.09.2023
ES27.09.2023
FI27.09.2023
HR27.09.2023
IT27.09.2023
LT27.09.2023
LV27.09.2023
MC27.09.2023
NL27.09.2023
PL27.09.2023
RO27.09.2023
RS27.09.2023
SE27.09.2023
SK27.09.2023
SM27.09.2023
LU18.10.2023
NO27.12.2023
GR28.12.2023
IS27.01.2024
PT29.01.2024
Former [2024/30]AT27.09.2023
CZ27.09.2023
EE27.09.2023
ES27.09.2023
FI27.09.2023
HR27.09.2023
IT27.09.2023
LT27.09.2023
LV27.09.2023
NL27.09.2023
PL27.09.2023
RO27.09.2023
RS27.09.2023
SE27.09.2023
SK27.09.2023
SM27.09.2023
LU18.10.2023
NO27.12.2023
GR28.12.2023
IS27.01.2024
PT29.01.2024
Former [2024/26]AT27.09.2023
CZ27.09.2023
EE27.09.2023
ES27.09.2023
FI27.09.2023
HR27.09.2023
IT27.09.2023
LT27.09.2023
LV27.09.2023
NL27.09.2023
PL27.09.2023
RO27.09.2023
RS27.09.2023
SE27.09.2023
SK27.09.2023
SM27.09.2023
NO27.12.2023
GR28.12.2023
IS27.01.2024
PT29.01.2024
Former [2024/25]AT27.09.2023
CZ27.09.2023
EE27.09.2023
ES27.09.2023
FI27.09.2023
HR27.09.2023
LT27.09.2023
LV27.09.2023
NL27.09.2023
PL27.09.2023
RO27.09.2023
RS27.09.2023
SE27.09.2023
SK27.09.2023
SM27.09.2023
NO27.12.2023
GR28.12.2023
IS27.01.2024
PT29.01.2024
Former [2024/23]AT27.09.2023
CZ27.09.2023
EE27.09.2023
ES27.09.2023
FI27.09.2023
HR27.09.2023
LT27.09.2023
LV27.09.2023
NL27.09.2023
RO27.09.2023
RS27.09.2023
SE27.09.2023
SK27.09.2023
SM27.09.2023
NO27.12.2023
GR28.12.2023
IS27.01.2024
PT29.01.2024
Former [2024/20]FI27.09.2023
HR27.09.2023
LT27.09.2023
LV27.09.2023
NL27.09.2023
RS27.09.2023
SE27.09.2023
SM27.09.2023
NO27.12.2023
GR28.12.2023
IS27.01.2024
Former [2024/14]FI27.09.2023
HR27.09.2023
LT27.09.2023
LV27.09.2023
NL27.09.2023
RS27.09.2023
SE27.09.2023
NO27.12.2023
GR28.12.2023
Former [2024/10]FI27.09.2023
HR27.09.2023
LT27.09.2023
LV27.09.2023
RS27.09.2023
SE27.09.2023
NO27.12.2023
GR28.12.2023
Former [2024/09]FI27.09.2023
LT27.09.2023
SE27.09.2023
NO27.12.2023
GR28.12.2023
Former [2024/08]LT27.09.2023
NO27.12.2023
GR28.12.2023
Documents cited:Search[A]JP2014037489  ;
 [X]EP2029664  (DOW GLOBAL TECHNOLOGIES INC [US]) [X] 1-5,9 * paragraphs [0051] , [0052] , [0070] , [0084]; example 2; claim -; tables 1,2 *;
 [E]EP3608380  (LINTEC CORP [JP]) [E] 1-11 * paragraphs [0001] , [0013] , [0133] - [0138] - [0150] - [0152] - [0269] , [0270]; examples 1,2; claim -; table 1 *;
 [A]  - DATABASE WPI, 0, Derwent World Patents Index, (20140227), vol. 2014, no. 17, Database accession no. 2014-D73667, XP002799039 & JP2014037489 A 20140227 (SAITAMA KEN) [A] 1-11 * abstract *
 [A]  - SANO MASARU ET AL, "High-frequency welding of glass-fibre-reinforced polypropylene with a thermoplastic adhesive layer: Effects of ceramic type and long-term exposure on lap shear stre", INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, ELSEVIER, AMSTERDAM, NL, (20150207), vol. 59, doi:10.1016/J.IJADHADH.2015.01.012, ISSN 0143-7496, pages 7 - 13, XP029213460 [A] 1-11 * the whole document *

DOI:   http://dx.doi.org/10.1016/j.ijadhadh.2015.01.012
International search[XY]JPS58174474  (MITSUI TOATSU CHEMICALS) [X] 1-2, 5-8 * , claims, page 2, upper left column, line 7 to upper right column, line 17, page 2, lower left column, lines 10-12, examples (Family: none) * [Y] 6;
 [A]JPH0415282  (DAINIPPON PRINTING CO LTD) [A] 1-8* , entire text (Family: none) *;
 [XY]JPH0872055  (MITSUI TOATSU CHEMICALS) [X] 1-8 * , claims, paragraphs [0003], [0006]-[0008], [0011]-[0012], examples (Family: none) * [Y] 5-6;
 [XY]JPH08258173  (OJI YUKA SYNT PAPER CO LTD) [X] 1-4, 6-8 * , claims, paragraphs [0003], [0017]-[0019], [0029], examples (Family: none) * [Y] 6;
 [XY]JPH0967461  (SEKISUI CHEMICAL CO LTD) [X] 1-4, 6-8 * , claims, paragraphs [0001], [0004], [0006]-[0009], [0012], [0023], examples (Family: none) * [Y] 5-6;
 [Y]JPH11157398  (HAYASHI GIJUTSU KENKYUSHO KK) [Y] 6 * , claims, paragraphs [0005], [0007], examples (Family: none) *;
 [XY]JP2001146524  (SEKISUI CHEMICAL CO LTD) [X] 1-4, 6-8 * , claims, paragraphs [0002], [0006], [0010]-[0013], examples (Family: none) * [Y] 6;
 [XY]JP2001260231  (MITSUBISHI PLASTICS IND) [X] 1-2, 2-8 * , claims, paragraphs [0005], [0008]-[0009], [0016]-[0028], fig. 1-3 (Family: none) * [Y] 6;
 [Y]JP2003238745  (TOYO BOSEKI) [Y] 6 * , claims, paragraphs [0007], [0014], [0026], [0030], examples (Family: none) *;
 [XY]JP2009538971  (DOW GLOBAL TECHNOLOGIES INC.) [X] 1-8 * , claims, paragraphs [0013]-[0014], [0049]-[0053] , [0065]-[0073] , [0084]-[0085], examples & US 2009/0286013 A1, paragraphs [0014]-[0015], [0039]-[0053], examples &WO2007/143019 A2 & EP2029664 A2 & CN 101490146 A * [Y] 5-6;
 [Y]JP2014037489  (SAITAMA PREFECTURE) [Y] 5 * , claims, paragraphs [0011]-[0017], [0049], examples (Family: none) *
Examination   - Agilent, "Agilent | Keysight | Electronic Measurement Products", (20170824), URL: https://web.archive.org/web/20170824085723/https://www.agilent.com/en/keysight-electronic-measurement-products, (20210511), XP055803870
by applicantJP2003193009
 JP2003238745
 JP2008156510
 JP2010006908
 JP2014037489
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.