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Extract from the Register of European Patents

EP About this file: EP3533836

EP3533836 - THERMAL CONDUCTIVE SILICONE COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  30.09.2022
Database last updated on 02.11.2024
FormerThe patent has been granted
Status updated on  22.10.2021
FormerGrant of patent is intended
Status updated on  16.09.2021
FormerRequest for examination was made
Status updated on  18.06.2021
FormerGrant of patent is intended
Status updated on  30.03.2021
FormerRequest for examination was made
Status updated on  02.08.2019
FormerThe international publication has been made
Status updated on  05.05.2018
Most recent event   Tooltip13.09.2024Lapse of the patent in a contracting state
New state(s): MT		published on 16.10.2024  [2024/42]
Applicant(s)For all designated states
Shin-Etsu Chemical Co., Ltd.
6-1, Ohtemachi 2-chome Chiyoda-ku
Tokyo 100-0004 / JP
[2019/36]
Inventor(s)01 / AKIBA, Shota
c/o Silicone-Electronics Materials Research Center
Shin-Etsu Chemical Co. Ltd.
1-10 Hitomi
Matsuida-machi
Annaka-shi Gunma 379-0224 / JP
02 / TSUJI, Kenichi
c/o Silicone-Electronics Materials Research Center
Shin-Etsu Chemical Co. Ltd.
1-10 Hitomi
Matsuida-machi
Annaka-shi Gunma 379-0224 / JP
03 / YAMADA, Kunihiro
c/o Silicone-Electronics Materials Research Center
Shin-Etsu Chemical Co. Ltd.
1-10 Hitomi
Matsuida-machi
Annaka-shi Gunma 379-0224 / JP
 [2019/36]
Representative(s)Angerhausen, Christoph
Boehmert & Boehmert
Anwaltspartnerschaft mbB
Pettenkoferstrasse 22
80336 München / DE
[2019/36]
Application number, filing date17864026.418.10.2017
[2019/36]
WO2017JP37633
Priority number, dateJP2016021363231.10.2016         Original published format: JP 2016213632
[2019/36]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2018079362
Date:03.05.2018
Language:JA
[2018/18]
Type: A1 Application with search report 
No.:EP3533836
Date:04.09.2019
Language:EN
[2019/36]
Type: B1 Patent specification 
No.:EP3533836
Date:24.11.2021
Language:EN
[2021/47]
Search report(s)International search report - published on:JP03.05.2018
(Supplementary) European search report - dispatched on:EP05.06.2020
ClassificationIPC:C08L83/04, C08K3/08, C08K5/5415, C09K5/14, H01L23/36, H01L23/373, C08G77/12, C08G77/16, C08G77/20, C09J9/02, C09J11/04, C09J183/04
[2020/28]
CPC:
C08G77/12 (EP,KR,US); C08K3/08 (EP,KR,US); C08G77/16 (EP,US);
C08G77/08 (US); C08G77/20 (EP,KR,US); C08K5/005 (KR);
C08K5/14 (US); C08K5/5415 (EP,KR); C08L83/04 (EP,KR);
C09J183/04 (EP); C09J9/02 (EP); C09K5/14 (EP);
H01L23/36 (EP); H01L23/373 (EP,KR,US); C08K2003/0806 (EP,KR,US);
C08K2201/001 (EP,KR,US); C08K2201/005 (US); C08K2201/006 (KR,US);
C08K2201/011 (EP,KR,US); H01L2224/16225 (EP); H01L2224/32225 (EP);
H01L2224/73204 (EP); H01L2224/73253 (EP); H01L2924/16152 (EP) (-)
C-Set:
C08L83/04, C08K3/08, C08L83/00 (EP);
C08L83/04, C08K3/22, C08L83/00 (EP);
C08L83/04, C08K5/14, C08L83/00 (EP);
C08L83/04, C08K5/56, C08L83/00 (EP);
C09J183/04, C08L83/00 (EP);
H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (EP)
(-)
Former IPC [2019/36]C08L83/04, C08K3/08, C08K5/5415, C09K5/14, H01L23/36, H01L23/373
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2019/36]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TitleGerman:WÄRMELEITENDE SILIKONZUSAMMENSETZUNG, HALBLEITERBAUELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERBAUELEMENTS[2019/36]
English:THERMAL CONDUCTIVE SILICONE COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE[2019/36]
French:COMPOSITION DE SILICONE THERMOCONDUCTRICE, DISPOSITIF À SEMI-CONDUCTEUR ET PROCÉDÉ DE FABRICATION DE DISPOSITIF À SEMI-CONDUCTEUR[2019/36]
Entry into regional phase22.02.2019Translation filed 
22.02.2019National basic fee paid 
22.02.2019Search fee paid 
22.02.2019Designation fee(s) paid 
22.02.2019Examination fee paid 
Examination procedure22.02.2019Examination requested  [2019/36]
30.11.2020Amendment by applicant (claims and/or description)
31.03.2021Communication of intention to grant the patent
17.06.2021Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO
17.06.2021Fee for grant paid
17.06.2021Fee for publishing/printing paid
23.09.2021Communication of intention to grant the patent
18.10.2021Receipt of the translation of the claim(s)
Opposition(s)25.08.2022No opposition filed within time limit [2022/44]
Fees paidRenewal fee
15.10.2019Renewal fee patent year 03
14.10.2020Renewal fee patent year 04
29.09.2021Renewal fee patent year 05
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU18.10.2017
AL24.11.2021
AT24.11.2021
CY24.11.2021
CZ24.11.2021
DK24.11.2021
EE24.11.2021
ES24.11.2021
FI24.11.2021
HR24.11.2021
IT24.11.2021
LT24.11.2021
LV24.11.2021
MC24.11.2021
MK24.11.2021
MT24.11.2021
NL24.11.2021
PL24.11.2021
RO24.11.2021
RS24.11.2021
SE24.11.2021
SI24.11.2021
SK24.11.2021
SM24.11.2021
TR24.11.2021
BG24.02.2022
NO24.02.2022
GR25.02.2022
IS24.03.2022
PT24.03.2022
[2024/42]
Former [2024/29]HU18.10.2017
AL24.11.2021
AT24.11.2021
CY24.11.2021
CZ24.11.2021
DK24.11.2021
EE24.11.2021
ES24.11.2021
FI24.11.2021
HR24.11.2021
IT24.11.2021
LT24.11.2021
LV24.11.2021
MC24.11.2021
MK24.11.2021
NL24.11.2021
PL24.11.2021
RO24.11.2021
RS24.11.2021
SE24.11.2021
SI24.11.2021
SK24.11.2021
SM24.11.2021
TR24.11.2021
BG24.02.2022
NO24.02.2022
GR25.02.2022
IS24.03.2022
PT24.03.2022
Former [2024/27]HU18.10.2017
AL24.11.2021
AT24.11.2021
CY24.11.2021
CZ24.11.2021
DK24.11.2021
EE24.11.2021
ES24.11.2021
FI24.11.2021
HR24.11.2021
IT24.11.2021
LT24.11.2021
LV24.11.2021
MC24.11.2021
MK24.11.2021
NL24.11.2021
PL24.11.2021
RO24.11.2021
RS24.11.2021
SE24.11.2021
SI24.11.2021
SK24.11.2021
SM24.11.2021
BG24.02.2022
NO24.02.2022
GR25.02.2022
IS24.03.2022
PT24.03.2022
Former [2024/21]HU18.10.2017
AL24.11.2021
AT24.11.2021
CY24.11.2021
CZ24.11.2021
DK24.11.2021
EE24.11.2021
ES24.11.2021
FI24.11.2021
HR24.11.2021
IT24.11.2021
LT24.11.2021
LV24.11.2021
MC24.11.2021
NL24.11.2021
PL24.11.2021
RO24.11.2021
RS24.11.2021
SE24.11.2021
SI24.11.2021
SK24.11.2021
SM24.11.2021
BG24.02.2022
NO24.02.2022
GR25.02.2022
IS24.03.2022
PT24.03.2022
Former [2024/18]HU18.10.2017
AL24.11.2021
AT24.11.2021
CZ24.11.2021
DK24.11.2021
EE24.11.2021
ES24.11.2021
FI24.11.2021
HR24.11.2021
IT24.11.2021
LT24.11.2021
LV24.11.2021
MC24.11.2021
NL24.11.2021
PL24.11.2021
RO24.11.2021
RS24.11.2021
SE24.11.2021
SI24.11.2021
SK24.11.2021
SM24.11.2021
BG24.02.2022
NO24.02.2022
GR25.02.2022
IS24.03.2022
PT24.03.2022
Former [2023/25]AL24.11.2021
AT24.11.2021
CZ24.11.2021
DK24.11.2021
EE24.11.2021
ES24.11.2021
FI24.11.2021
HR24.11.2021
IT24.11.2021
LT24.11.2021
LV24.11.2021
MC24.11.2021
NL24.11.2021
PL24.11.2021
RO24.11.2021
RS24.11.2021
SE24.11.2021
SI24.11.2021
SK24.11.2021
SM24.11.2021
BG24.02.2022
NO24.02.2022
GR25.02.2022
IS24.03.2022
PT24.03.2022
Former [2023/01]AL24.11.2021
AT24.11.2021
CZ24.11.2021
DK24.11.2021
EE24.11.2021
ES24.11.2021
FI24.11.2021
HR24.11.2021
LT24.11.2021
LV24.11.2021
NL24.11.2021
PL24.11.2021
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SM24.11.2021
BG24.02.2022
NO24.02.2022
GR25.02.2022
IS24.03.2022
PT24.03.2022
Former [2022/49]AL24.11.2021
AT24.11.2021
CZ24.11.2021
DK24.11.2021
EE24.11.2021
ES24.11.2021
FI24.11.2021
HR24.11.2021
LT24.11.2021
LV24.11.2021
NL24.11.2021
PL24.11.2021
RO24.11.2021
RS24.11.2021
SE24.11.2021
SK24.11.2021
SM24.11.2021
BG24.02.2022
NO24.02.2022
GR25.02.2022
IS24.03.2022
PT24.03.2022
Former [2022/35]AT24.11.2021
CZ24.11.2021
DK24.11.2021
EE24.11.2021
ES24.11.2021
FI24.11.2021
HR24.11.2021
LT24.11.2021
LV24.11.2021
NL24.11.2021
PL24.11.2021
RO24.11.2021
RS24.11.2021
SE24.11.2021
SK24.11.2021
SM24.11.2021
BG24.02.2022
NO24.02.2022
GR25.02.2022
IS24.03.2022
PT24.03.2022
Former [2022/34]AT24.11.2021
EE24.11.2021
ES24.11.2021
FI24.11.2021
HR24.11.2021
LT24.11.2021
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NL24.11.2021
PL24.11.2021
RO24.11.2021
RS24.11.2021
SE24.11.2021
SM24.11.2021
BG24.02.2022
NO24.02.2022
GR25.02.2022
IS24.03.2022
PT24.03.2022
Former [2022/33]AT24.11.2021
ES24.11.2021
FI24.11.2021
HR24.11.2021
LT24.11.2021
LV24.11.2021
NL24.11.2021
PL24.11.2021
RS24.11.2021
SE24.11.2021
SM24.11.2021
BG24.02.2022
NO24.02.2022
GR25.02.2022
IS24.03.2022
PT24.03.2022
Former [2022/25]AT24.11.2021
ES24.11.2021
FI24.11.2021
HR24.11.2021
LT24.11.2021
LV24.11.2021
NL24.11.2021
PL24.11.2021
RS24.11.2021
SE24.11.2021
BG24.02.2022
NO24.02.2022
GR25.02.2022
IS24.03.2022
PT24.03.2022
Former [2022/24]AT24.11.2021
ES24.11.2021
FI24.11.2021
HR24.11.2021
LT24.11.2021
LV24.11.2021
NL24.11.2021
PL24.11.2021
RS24.11.2021
SE24.11.2021
BG24.02.2022
GR25.02.2022
IS24.03.2022
PT24.03.2022
Former [2022/23]AT24.11.2021
ES24.11.2021
FI24.11.2021
HR24.11.2021
LT24.11.2021
LV24.11.2021
PL24.11.2021
RS24.11.2021
BG24.02.2022
PT24.03.2022
Former [2022/22]AT24.11.2021
FI24.11.2021
LT24.11.2021
RS24.11.2021
BG24.02.2022
Former [2022/21]AT24.11.2021
RS24.11.2021
BG24.02.2022
Former [2022/19]BG24.02.2022
Documents cited:Search[XY]US2007131912  (SIMONE DAVIDE L [US], et al) [X] 1-4,6,7 * page 1, paragraphs 9-10 * * page 3, paragraph 24 * * page 4, paragraphs 33-34,37 * * page 5, paragraph 40 * * page 6, paragraphs 48,51,53 * * examples 4,10 * [Y] 5,8,9;
 [YA]US2008057325  (SAKURAI IKUO [JP], et al) [Y] 8,9 * page 1, paragraphs 1-4,19 * * page 2, paragraphs 21-30 * * page 13, paragraph 131 - page 14, paragraph 141 * * page 15, paragraphs 151-156 * * examples 4-6; table 2 * [A] 1-7;
 [YA]US2009186219  (INABA AKIRA [JP]) [Y] 8,9 * column 1, lines 5-12 * * column 3, line 32 - column 4, line 29 * * column 5, lines 29-50 * * column 8, lines 37-51 * * examples 1-12; table 1 *[A] 1-7;
 [YA]WO2014099639  (DOW CORNING [US]) [Y] 5 * page 3, paragraph 16 * * page 53, paragraph 126 - page 54, paragraph 136 * [A] 1-4,6-9
International search[A]JP2008056761  (SHINETSU CHEMICAL CO) [A] 1-9 * , entire text & US 2008/0057325 A1, entire text & TW 200817474 A *;
 [A]JP2009108312  (DOW CORNING TORAY CO LTD) [A] 1-9 * , entire text & US 2010/0267885 A1, entire text & WO 2009/048169 A1 & CN 101821339 A & TW 200925199 A *;
 [A]JP2013538924  (DOW CORNING CORPORATION) [A] 1-9* , entire text & US 2013/0177658 A1, entire text & WO 2012/045004 A1 & EP 2622023 A1 & CN 103119103 A *;
 [A]JP2014181316  (GUNZE KK, et al) [A] 1-9 * , entire text (Family: none) *;
 [A]WO2016116959  (KYOCERA CHEM CORP [JP]) [A] 1-9 * , entire text & CN 107207835 A *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.