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Extract from the Register of European Patents

EP About this file: EP3553129

EP3553129 - CURING RESIN COMPOSITION, CURED PRODUCT OF, AND CURING METHOD FOR, CURING RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  27.09.2024
Database last updated on 18.01.2025
FormerThe patent has been granted
Status updated on  20.10.2023
FormerGrant of patent is intended
Status updated on  11.06.2023
FormerExamination is in progress
Status updated on  23.10.2020
FormerRequest for examination was made
Status updated on  13.09.2019
FormerThe international publication has been made
Status updated on  16.06.2018
Most recent event   Tooltip01.11.2024Lapse of the patent in a contracting state
New state(s): SI
published on 04.12.2024  [2024/49]
Applicant(s)For all designated states
ENEOS Corporation
1-2, Otemachi 1-chome
Chiyoda-ku
Tokyo / JP
[2023/42]
Former [2019/42]For all designated states
JXTG Nippon Oil & Energy Corporation
1-2, Otemachi 1-chome
Chiyoda-ku
Tokyo 100-8162 / JP
Inventor(s)01 / NISHITANI, Yoshinori
c/o JXTG Nippon Oil & Energy Corporation
1-2 Otemachi 1-chome
Chiyoda-ku
Tokyo 100-8162 / JP
02 / MINAMI, Masaki
c/o JXTG Nippon Oil & Energy Corporation
1-2 Otemachi 1-chome
Chiyoda-ku
Tokyo 100-8162 / JP
 [2019/42]
Representative(s)Carpmaels & Ransford LLP
One Southampton Row
London WC1B 5HA / GB
[2023/47]
Former [2019/42]Cockerton, Bruce Roger
Carpmaels & Ransford LLP
One Southampton Row
London WC1B 5HA / GB
Application number, filing date17879410.308.12.2017
[2019/42]
WO2017JP44250
Priority number, dateJP2016023989409.12.2016         Original published format: JP 2016239894
[2019/42]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2018105743
Date:14.06.2018
Language:JA
[2018/24]
Type: A1 Application with search report 
No.:EP3553129
Date:16.10.2019
Language:EN
[2019/42]
Type: B1 Patent specification 
No.:EP3553129
Date:22.11.2023
Language:EN
[2023/47]
Search report(s)International search report - published on:JP14.06.2018
(Supplementary) European search report - dispatched on:EP08.04.2020
ClassificationIPC:C08L63/00, C08G59/24, C08K3/36, C08K5/375, C08K5/50, C08L61/34, H01L23/29, H01L23/31, C08G59/64, C08G59/50, C08G59/56, C08G59/62, C08G59/68, C08L61/00
[2020/19]
CPC:
C08G59/24 (EP); C08K5/357 (KR); C08L79/06 (US);
C08G59/245 (KR); C08G59/5033 (EP,KR); C08G59/5073 (KR);
C08G59/56 (EP); C08G59/621 (EP,KR); C08G59/623 (EP);
C08G59/688 (EP); C08K3/36 (EP,US); C08K5/50 (KR,US);
C08L63/00 (KR,US); H01L23/293 (EP); H01L23/295 (KR);
H01L23/31 (KR); C08G14/06 (EP); C08K2003/2227 (US);
C08K5/0025 (US); C08L2205/05 (US); C08L61/34 (EP);
H01L23/3107 (EP); H01L23/3121 (EP) (-)
C-Set:
C08L61/34, C08K3/36, C08L63/00 (EP)
Former IPC [2019/42]C08L63/00, C08G59/24, C08K3/36, C08K5/375, C08K5/50, C08L61/34, H01L23/29, H01L23/31
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2019/42]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:HÄRTENDE HARZZUSAMMENSETZUNG, GEHÄRTETES PRODUKT AUS DER HÄRTBAREN HARZZUSAMMENSETZUNG UND HÄRTUNGSVERFAHREN FÜR DIE HÄRTBARE HARZZUSAMMENSETZUNG SOWIE HALBLEITERBAUELEMENT[2019/42]
English:CURING RESIN COMPOSITION, CURED PRODUCT OF, AND CURING METHOD FOR, CURING RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE[2019/42]
French:COMPOSITION DE RÉSINE DE DURCISSEMENT, PRODUIT DURCI DE, ET PROCÉDÉ DE DURCISSEMENT DESTINÉ À, LA COMPOSITION DE RÉSINE DE DURCISSEMENT, ET DISPOSITIF SEMI-CONDUCTEUR[2019/42]
Entry into regional phase05.07.2019Translation filed 
05.07.2019National basic fee paid 
05.07.2019Search fee paid 
05.07.2019Designation fee(s) paid 
05.07.2019Examination fee paid 
Examination procedure05.07.2019Examination requested  [2019/42]
21.09.2020Amendment by applicant (claims and/or description)
27.10.2020Despatch of a communication from the examining division (Time limit: M04)
04.03.2021Reply to a communication from the examining division
12.06.2023Communication of intention to grant the patent
18.10.2023Fee for grant paid
18.10.2023Fee for publishing/printing paid
18.10.2023Receipt of the translation of the claim(s)
Opposition(s)23.08.2024No opposition filed within time limit [2024/44]
Fees paidRenewal fee
05.07.2019Renewal fee patent year 03
14.12.2020Renewal fee patent year 04
30.11.2021Renewal fee patent year 05
14.11.2022Renewal fee patent year 06
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See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT22.11.2023
CZ22.11.2023
DK22.11.2023
EE22.11.2023
ES22.11.2023
HR22.11.2023
IT22.11.2023
LT22.11.2023
LV22.11.2023
MC22.11.2023
PL22.11.2023
RO22.11.2023
RS22.11.2023
SE22.11.2023
SI22.11.2023
SK22.11.2023
SM22.11.2023
IE08.12.2023
LU08.12.2023
FR22.01.2024
BG22.02.2024
NO22.02.2024
GR23.02.2024
IS22.03.2024
[2024/49]
Former [2024/47]AT22.11.2023
CZ22.11.2023
DK22.11.2023
EE22.11.2023
ES22.11.2023
HR22.11.2023
IT22.11.2023
LT22.11.2023
LV22.11.2023
MC22.11.2023
PL22.11.2023
RO22.11.2023
RS22.11.2023
SE22.11.2023
SK22.11.2023
SM22.11.2023
IE08.12.2023
LU08.12.2023
FR22.01.2024
BG22.02.2024
NO22.02.2024
GR23.02.2024
IS22.03.2024
Former [2024/46]AT22.11.2023
CZ22.11.2023
DK22.11.2023
EE22.11.2023
ES22.11.2023
HR22.11.2023
IT22.11.2023
LT22.11.2023
LV22.11.2023
MC22.11.2023
PL22.11.2023
RO22.11.2023
RS22.11.2023
SE22.11.2023
SK22.11.2023
SM22.11.2023
IE08.12.2023
LU08.12.2023
BG22.02.2024
NO22.02.2024
GR23.02.2024
IS22.03.2024
Former [2024/40]AT22.11.2023
CZ22.11.2023
DK22.11.2023
EE22.11.2023
ES22.11.2023
HR22.11.2023
IT22.11.2023
LT22.11.2023
LV22.11.2023
MC22.11.2023
PL22.11.2023
RO22.11.2023
RS22.11.2023
SE22.11.2023
SK22.11.2023
SM22.11.2023
LU08.12.2023
BG22.02.2024
NO22.02.2024
GR23.02.2024
IS22.03.2024
Former [2024/36]AT22.11.2023
CZ22.11.2023
DK22.11.2023
EE22.11.2023
ES22.11.2023
HR22.11.2023
IT22.11.2023
LT22.11.2023
LV22.11.2023
PL22.11.2023
RO22.11.2023
RS22.11.2023
SE22.11.2023
SK22.11.2023
SM22.11.2023
BG22.02.2024
NO22.02.2024
GR23.02.2024
IS22.03.2024
Former [2024/35]AT22.11.2023
CZ22.11.2023
DK22.11.2023
EE22.11.2023
ES22.11.2023
HR22.11.2023
LT22.11.2023
LV22.11.2023
PL22.11.2023
RO22.11.2023
RS22.11.2023
SE22.11.2023
SM22.11.2023
BG22.02.2024
NO22.02.2024
GR23.02.2024
IS22.03.2024
Former [2024/34]AT22.11.2023
DK22.11.2023
EE22.11.2023
ES22.11.2023
HR22.11.2023
LT22.11.2023
LV22.11.2023
PL22.11.2023
RS22.11.2023
SE22.11.2023
SM22.11.2023
BG22.02.2024
NO22.02.2024
GR23.02.2024
IS22.03.2024
Former [2024/33]AT22.11.2023
DK22.11.2023
ES22.11.2023
HR22.11.2023
LT22.11.2023
LV22.11.2023
PL22.11.2023
RS22.11.2023
SE22.11.2023
SM22.11.2023
BG22.02.2024
NO22.02.2024
GR23.02.2024
IS22.03.2024
Former [2024/26]AT22.11.2023
ES22.11.2023
HR22.11.2023
LT22.11.2023
LV22.11.2023
PL22.11.2023
RS22.11.2023
SE22.11.2023
BG22.02.2024
NO22.02.2024
GR23.02.2024
IS22.03.2024
Former [2024/25]AT22.11.2023
ES22.11.2023
HR22.11.2023
LT22.11.2023
PL22.11.2023
RS22.11.2023
SE22.11.2023
BG22.02.2024
NO22.02.2024
GR23.02.2024
IS22.03.2024
Former [2024/24]AT22.11.2023
ES22.11.2023
HR22.11.2023
LT22.11.2023
RS22.11.2023
SE22.11.2023
BG22.02.2024
NO22.02.2024
GR23.02.2024
IS22.03.2024
Former [2024/23]AT22.11.2023
ES22.11.2023
LT22.11.2023
BG22.02.2024
GR23.02.2024
IS22.03.2024
Former [2024/21]LT22.11.2023
BG22.02.2024
GR23.02.2024
IS22.03.2024
Former [2024/20]GR23.02.2024
IS22.03.2024
Documents cited:Search[I]US2013161080  (LIN YU-TE [TW]) [I] 1-6* table 1 *;
 [I]US2016222204  (WANG RONGTAO [CN], et al) [I] 1-6 * example E14 *
International search[YA]JP2006233188  (TORAY INDUSTRIES) [Y] 1-4, 6 * , claims, paragraphs [0049], [0054], example 2 (Family: none) * [A] 5;
 [XY]JP2015535865  (ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD.) [X] 1-4, 6 * , claims, paragraphs [0030]-[0036], [0042]-[0046], [0055], [0058], example 14 & US 2016/0222204 A1, claims, paragraphs [0046]-[0050] , [0058]-[0064] , [0077] , [0080] , example 14 & CN104583309 A & KR 10-2015-0037835 A & WO 2015/024256 A1 * [Y] 1-6;
 [A]WO2016074291  (SHENGYI TECHNOLOGY CO LTD [CN]) [A] 1-6* , claims, examples 1-9 & EP 3219757 Al, claims, examples 1-9 & CN 104371273 A & JP 2018-502937 A & KR 10-2017-0085076 A *;
 [YA]JP2016536403  (SHENGYI TECHNOLOGY CO., LTD.) [Y] 1-4, 6 * , claims, examples 1-3 & US 2016/0272808 A1, claims, examples 1-3 & CN 104974520 A & EP 3053963 A1 & KR 10-2015-0114872 A & WO 2015/149449 A1 * [A] 5;
 [Y]JP2016207898  (SEKISUI CHEMICAL CO LTD) [Y] 1-6 * , claims, paragraphs [0003], [0016], [0022], [0023], [0052], examples 1, 2 (Family: none) *
by applicantJPS55157594
 JP2012036318
 JP2013060407
    - SHOICHI TSUCHIDA, "Diels-Alder Reaction between Butadiene and Cyclopentadiene, Determination of Trimers", Journal of The Japan Petroleum Institute, (19720000), vol. 15, no. 3, pages 189 - 192
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.