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Extract from the Register of European Patents

EP About this file: EP3561865

EP3561865 - SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE AND ELECTRONIC MODULE [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  27.09.2019
Database last updated on 27.07.2024
FormerThe international publication has been made
Status updated on  30.06.2018
Most recent event   Tooltip15.11.2023New entry: Renewal fee paid 
Applicant(s)For all designated states
KYOCERA Corporation
6, Takeda Tobadono-cho
Fushimi-ku
Kyoto-shi
Kyoto 612-8501 / JP
[2019/44]
Inventor(s)01 / KITAZUMI, Noboru
c/o KYOCERA CORPORATION
6 Takeda Tobadono-cho
Fushimi-ku
Kyoto-shi Kyoto 612-8501 / JP
 [2019/44]
Representative(s)Viering, Jentschura & Partner mbB Patent- und Rechtsanwälte
Am Brauhaus 8
01099 Dresden / DE
[2019/44]
Application number, filing date17882409.021.12.2017
[2019/44]
WO2017JP45979
Priority number, dateJP2016024941522.12.2016         Original published format: JP 2016249415
JP2017022690227.11.2017         Original published format: JP 2017226902
[2019/44]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2018117232
Date:28.06.2018
Language:JA
[2018/26]
Type: A1 Application with search report 
No.:EP3561865
Date:30.10.2019
Language:EN
[2019/44]
Search report(s)International search report - published on:JP28.06.2018
(Supplementary) European search report - dispatched on:EP20.07.2020
ClassificationIPC:H01L23/36, H01L23/12, H01L33/48, H01S5/022, H05K1/02, H01L23/373
[2020/34]
CPC:
H01L23/3731 (EP); H05K1/18 (CN); H01L23/3735 (EP,US);
H01L23/12 (US); H01L23/14 (CN); H01L23/15 (CN,US);
H01L23/36 (US); H01L23/367 (CN); H01L23/373 (EP);
H01L23/49833 (CN,US); H01L31/02005 (CN); H01L31/024 (CN,US);
H01L33/48 (EP,US); H01S5/0206 (US); H01S5/02218 (EP,US);
H01S5/02315 (CN); H01S5/02469 (CN,US); H01S5/02476 (CN);
H05K1/02 (EP,US); H05K1/0203 (CN); H01S5/0237 (US) (-)
Former IPC [2019/44]H01L23/36, H01L23/12, H01L33/48, H01S5/022, H05K1/02
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2019/44]
TitleGerman:SUBSTRAT ZUR MONTAGE EINES ELEKTRONISCHEN ELEMENTS, ELEKTRONISCHE VORRICHTUNG UND ELEKTRONISCHES MODUL[2019/44]
English:SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE AND ELECTRONIC MODULE[2019/44]
French:SUBSTRAT DE MONTAGE DE COMPOSANT ÉLECTRONIQUE, DISPOSITIF ÉLECTRONIQUE ET MODULE ÉLECTRONIQUE[2019/44]
Entry into regional phase12.06.2019Translation filed 
12.06.2019National basic fee paid 
12.06.2019Search fee paid 
12.06.2019Designation fee(s) paid 
12.06.2019Examination fee paid 
Examination procedure12.06.2019Examination requested  [2019/44]
04.02.2021Amendment by applicant (claims and/or description)
Fees paidRenewal fee
15.11.2019Renewal fee patent year 03
14.12.2020Renewal fee patent year 04
30.11.2021Renewal fee patent year 05
14.11.2022Renewal fee patent year 06
15.11.2023Renewal fee patent year 07
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Documents cited:Search[X]WO2011008467  (SPECIALTY MINERALS MICHIGAN [US], et al) [X] 1-5 * abstract * * figures 1,26 * * paragraphs [0053] - [0060] *;
 [X]WO2014052282  (MOMENTIVE PERFORMANCE MAT INC [US]) [X] 1-5 * abstract * * figure 2 * * paragraph [0010] * * paragraphs [0024] - [0031] * * paragraph [0039] * * paragraph [0041] *;
 [A]EP3007531  (HUAWEI TECH CO LTD [CN]) [A] 1-5 * abstract * * figures 1-3 * * paragraphs [0007] , [0008] ** paragraphs [0039] - [0044] *
International search[Y]JPH08191121  (GEN ELECTRIC) [Y] 1-5 * , [0012], [0015], [0019]-[0021] , 1, 6-7 & US 5494753 A, & EP 689244 A2 *;
 [Y]JP2012238733  (THERMO GRAPHITICS CO LTD) [Y] 1-5* , *
by applicantJP2013175508
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.