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Extract from the Register of European Patents

EP About this file: EP3564993

EP3564993 - HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  05.08.2022
Database last updated on 02.11.2024
FormerThe patent has been granted
Status updated on  27.08.2021
FormerGrant of patent is intended
Status updated on  28.04.2021
FormerRequest for examination was made
Status updated on  04.10.2019
FormerThe international publication has been made
Status updated on  07.07.2018
Most recent event   Tooltip13.09.2024Lapse of the patent in a contracting state
New state(s): MT		published on 16.10.2024  [2024/42]
Applicant(s)For all designated states
Denka Company Limited
1-1, Nihonbashi-Muromachi 2-chome
Chuo-ku
Tokyo 103-8338 / JP
[2019/45]
Inventor(s)01 / ISHIHARA Yosuke
c/o Denka Company Limited Omuta Plant
1 Shinkai-machi
Omuta-shi Fukuoka 836-8510 / JP
02 / MIYAKAWA Takeshi
c/o Denka Company Limited Omuta Plant
1 Shinkai-machi
Omuta-shi Fukuoka 836-8510 / JP
03 / OTA Hiroaki
c/o Denka Company Limited Omuta Plant
1 Shinkai-machi
Omuta-shi Fukuoka 836-8510 / JP
04 / TSUKAMOTO Hideo
c/o Denka Company Limited Omuta Plant
1 Shinkai-machi
Omuta-shi Fukuoka 836-8510 / JP
 [2019/45]
Representative(s)Adam, Holger
Kraus & Weisert
Patentanwälte PartGmbB
Thomas-Wimmer-Ring 15
80539 München / DE
[2019/45]
Application number, filing date17888860.824.11.2017
[2019/45]
WO2017JP42209
Priority number, dateJP2016025558428.12.2016         Original published format: JP 2016255584
[2019/45]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2018123380
Date:05.07.2018
Language:JA
[2018/27]
Type: A1 Application with search report 
No.:EP3564993
Date:06.11.2019
Language:EN
[2019/45]
Type: B1 Patent specification 
No.:EP3564993
Date:29.09.2021
Language:EN
[2021/39]
Search report(s)International search report - published on:JP05.07.2018
(Supplementary) European search report - dispatched on:EP03.08.2020
ClassificationIPC:C22C1/10, C22C19/03, C22C26/00, C22C5/02, C22C21/00
[2021/17]
CPC:
C22C5/02 (EP); H01L23/373 (EP,US); B22D19/00 (EP);
C22C19/03 (EP); C22C26/00 (EP,US); C22C45/04 (EP);
C23C18/16 (EP); C23C18/32 (EP,US); H05K7/20 (EP);
C22C2026/006 (EP); C22C21/00 (EP) (-)
Former IPC [2020/36]H01L23/373, B22D19/00, C22C1/05, C22C1/10, C22C19/03, C22C26/00, C22C29/18, C22C45/04, C23C18/16, C23C18/32, C25D7/12, H05K7/20, C22C5/02, C22C21/00
Former IPC [2019/45]H01L23/373, B22D19/00, C22C1/05, C22C1/10, C22C19/03, C22C26/00, C22C29/18, C22C45/04, C23C18/16, C23C18/32, C25D7/12, H05K7/20
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2019/45]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TitleGerman:WÄRMEABLEITKOMPONENTE FÜR HALBLEITERELEMENT[2019/45]
English:HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT[2019/45]
French:COMPOSANT DE DISSIPATION DE CHALEUR POUR ÉLÉMENT SEMICONDUCTEUR[2019/45]
Entry into regional phase23.07.2019Translation filed 
23.07.2019National basic fee paid 
23.07.2019Search fee paid 
23.07.2019Designation fee(s) paid 
23.07.2019Examination fee paid 
Examination procedure23.07.2019Examination requested  [2019/45]
19.02.2021Amendment by applicant (claims and/or description)
29.04.2021Communication of intention to grant the patent
18.08.2021Fee for grant paid
18.08.2021Fee for publishing/printing paid
18.08.2021Receipt of the translation of the claim(s)
Opposition(s)30.06.2022No opposition filed within time limit [2022/36]
Fees paidRenewal fee
26.11.2019Renewal fee patent year 03
20.11.2020Renewal fee patent year 04
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU24.11.2017
AL29.09.2021
AT29.09.2021
CY29.09.2021
CZ29.09.2021
DK29.09.2021
EE29.09.2021
ES29.09.2021
FI29.09.2021
HR29.09.2021
LT29.09.2021
LV29.09.2021
MC29.09.2021
MK29.09.2021
MT29.09.2021
NL29.09.2021
PL29.09.2021
RO29.09.2021
RS29.09.2021
SE29.09.2021
SI29.09.2021
SK29.09.2021
SM29.09.2021
IE24.11.2021
LU24.11.2021
BE30.11.2021
BG29.12.2021
NO29.12.2021
GR30.12.2021
IS29.01.2022
PT31.01.2022
[2024/42]
Former [2024/23]HU24.11.2017
AL29.09.2021
AT29.09.2021
CY29.09.2021
CZ29.09.2021
DK29.09.2021
EE29.09.2021
ES29.09.2021
FI29.09.2021
HR29.09.2021
LT29.09.2021
LV29.09.2021
MC29.09.2021
MK29.09.2021
NL29.09.2021
PL29.09.2021
RO29.09.2021
RS29.09.2021
SE29.09.2021
SI29.09.2021
SK29.09.2021
SM29.09.2021
IE24.11.2021
LU24.11.2021
BE30.11.2021
BG29.12.2021
NO29.12.2021
GR30.12.2021
IS29.01.2022
PT31.01.2022
Former [2023/33]HU24.11.2017
AL29.09.2021
AT29.09.2021
CY29.09.2021
CZ29.09.2021
DK29.09.2021
EE29.09.2021
ES29.09.2021
FI29.09.2021
HR29.09.2021
LT29.09.2021
LV29.09.2021
MC29.09.2021
NL29.09.2021
PL29.09.2021
RO29.09.2021
RS29.09.2021
SE29.09.2021
SI29.09.2021
SK29.09.2021
SM29.09.2021
IE24.11.2021
LU24.11.2021
BE30.11.2021
BG29.12.2021
NO29.12.2021
GR30.12.2021
IS29.01.2022
PT31.01.2022
Former [2023/30]AL29.09.2021
AT29.09.2021
CY29.09.2021
CZ29.09.2021
DK29.09.2021
EE29.09.2021
ES29.09.2021
FI29.09.2021
HR29.09.2021
LT29.09.2021
LV29.09.2021
MC29.09.2021
NL29.09.2021
PL29.09.2021
RO29.09.2021
RS29.09.2021
SE29.09.2021
SI29.09.2021
SK29.09.2021
IE24.11.2021
LU24.11.2021
BE30.11.2021
BG29.12.2021
NO29.12.2021
GR30.12.2021
IS29.01.2022
PT31.01.2022
Former [2023/01]AL29.09.2021
AT29.09.2021
CZ29.09.2021
DK29.09.2021
EE29.09.2021
ES29.09.2021
FI29.09.2021
HR29.09.2021
LT29.09.2021
LV29.09.2021
MC29.09.2021
NL29.09.2021
PL29.09.2021
RO29.09.2021
RS29.09.2021
SE29.09.2021
SI29.09.2021
SK29.09.2021
IE24.11.2021
LU24.11.2021
BE30.11.2021
BG29.12.2021
NO29.12.2021
GR30.12.2021
IS29.01.2022
PT31.01.2022
Former [2022/48]AL29.09.2021
AT29.09.2021
CZ29.09.2021
DK29.09.2021
EE29.09.2021
ES29.09.2021
FI29.09.2021
HR29.09.2021
LT29.09.2021
LV29.09.2021
MC29.09.2021
NL29.09.2021
PL29.09.2021
RO29.09.2021
RS29.09.2021
SE29.09.2021
SK29.09.2021
IE24.11.2021
LU24.11.2021
BE30.11.2021
BG29.12.2021
NO29.12.2021
GR30.12.2021
IS29.01.2022
PT31.01.2022
Former [2022/36]AL29.09.2021
AT29.09.2021
CZ29.09.2021
DK29.09.2021
EE29.09.2021
ES29.09.2021
FI29.09.2021
HR29.09.2021
LT29.09.2021
LV29.09.2021
MC29.09.2021
NL29.09.2021
PL29.09.2021
RO29.09.2021
RS29.09.2021
SE29.09.2021
SK29.09.2021
LU24.11.2021
BE30.11.2021
BG29.12.2021
NO29.12.2021
GR30.12.2021
IS29.01.2022
PT31.01.2022
Former [2022/34]AL29.09.2021
AT29.09.2021
CZ29.09.2021
EE29.09.2021
ES29.09.2021
FI29.09.2021
HR29.09.2021
LT29.09.2021
LV29.09.2021
MC29.09.2021
NL29.09.2021
PL29.09.2021
RO29.09.2021
RS29.09.2021
SE29.09.2021
SK29.09.2021
LU24.11.2021
BE30.11.2021
BG29.12.2021
NO29.12.2021
GR30.12.2021
IS29.01.2022
PT31.01.2022
Former [2022/33]AL29.09.2021
AT29.09.2021
CZ29.09.2021
EE29.09.2021
ES29.09.2021
FI29.09.2021
HR29.09.2021
LT29.09.2021
LV29.09.2021
MC29.09.2021
NL29.09.2021
PL29.09.2021
RO29.09.2021
RS29.09.2021
SE29.09.2021
SK29.09.2021
BE30.11.2021
BG29.12.2021
NO29.12.2021
GR30.12.2021
IS29.01.2022
PT31.01.2022
Former [2022/29]AL29.09.2021
AT29.09.2021
CZ29.09.2021
EE29.09.2021
ES29.09.2021
FI29.09.2021
HR29.09.2021
LT29.09.2021
LV29.09.2021
NL29.09.2021
PL29.09.2021
RO29.09.2021
RS29.09.2021
SE29.09.2021
SK29.09.2021
BG29.12.2021
NO29.12.2021
GR30.12.2021
IS29.01.2022
PT31.01.2022
Former [2022/24]AT29.09.2021
CZ29.09.2021
EE29.09.2021
ES29.09.2021
FI29.09.2021
HR29.09.2021
LT29.09.2021
LV29.09.2021
NL29.09.2021
PL29.09.2021
RO29.09.2021
RS29.09.2021
SE29.09.2021
SK29.09.2021
BG29.12.2021
NO29.12.2021
GR30.12.2021
IS29.01.2022
PT31.01.2022
Former [2022/23]AT29.09.2021
CZ29.09.2021
EE29.09.2021
ES29.09.2021
FI29.09.2021
HR29.09.2021
LT29.09.2021
LV29.09.2021
PL29.09.2021
RS29.09.2021
SE29.09.2021
SK29.09.2021
BG29.12.2021
NO29.12.2021
GR30.12.2021
PT31.01.2022
Former [2022/21]AT29.09.2021
FI29.09.2021
HR29.09.2021
LT29.09.2021
LV29.09.2021
RS29.09.2021
SE29.09.2021
BG29.12.2021
NO29.12.2021
GR30.12.2021
Former [2022/10]FI29.09.2021
HR29.09.2021
LT29.09.2021
LV29.09.2021
RS29.09.2021
SE29.09.2021
BG29.12.2021
NO29.12.2021
GR30.12.2021
Former [2022/09]FI29.09.2021
LT29.09.2021
RS29.09.2021
SE29.09.2021
BG29.12.2021
NO29.12.2021
Former [2022/08]FI29.09.2021
LT29.09.2021
SE29.09.2021
BG29.12.2021
NO29.12.2021
Former [2022/07]LT29.09.2021
NO29.12.2021
Documents cited:Search[A]WO2013015158  (DENKI KAGAKU KOGYO KK [JP], et al) [A] 1-4 * See citations for the familz member US2014182824 *;
 US2014182824  [ ] (HIROTSURU HIDEKI [JP], et al) [ ] * paragraph [0028] * * paragraph [0033] - paragraph [0036] * * paragraph [0044] * * paragraph [0062] - paragraph [0068] *;
 [A]WO2015163395  (DENKI KAGAKU KOGYO KK [JP]) [A] 1-4 * the whole document *;
 [A]WO2016002925  (DENKI KAGAKU KOGYO KK [JP]) [A] 1-4 * See citations for the family member US2017/130300A1 *;
 [P]US2017130300  (ISHIHARA YOSUKE [JP], et al) [P] * paragraph [0030] - paragraph [0039] * * paragraph [0066] - paragraph [0067] * * paragraph [0075] - paragraph [0082] * * figure 1 *;
 [T]  - Bharat Bhushan, "Chapter 2 - Surface Roughness Analysis and Measurement Techniques", Modern Tribology Handbook Volume One, CRC Press, (20001228), pages 49 - 119, ISBN 978-0-8493-7787-7, XP055365111 [T] 3 * figure 2.48 *
International search[A]JPH01132072  (YAZAKI CORP) [A] 1-4* , page 2, upper right column, line 4 to page 3, upper left column, line 12, fig. 1 & GB 2212516 A, page 3, line 4 to page 7, line 2, fig. 1 & DE 3838971 A1 *;
 [A]JPH04294009  (AISIN SEIKI) [A] 1-4 * , paragraph [0008], fig. 1 (Family: none) *;
 [A]WO2010007922  (DENKI KAGAKU KOGYO KK [JP], et al) [A] 1-4 * , paragraph [0097] & US 2011/0123821 A1, paragraph [0115] & EP 2305400 A1 & CN 102149493 A & CN 105886825 A & KR 10-2016-0072847 A & KR 10-2011-0040923 A & TW 201009092 A *;
 [A]JP2010176863  (ALPS ELECTRIC CO LTD) [A] 1-4 * , paragraphs [0020] -[0037], fig. 1-3 (Family: none) *;
 [A]WO2013015158  (DENKI KAGAKU KOGYO KK [JP], et al) [A] 1-4 * , paragraphs [0054]-[0059] & US 2014/0182824 A1, paragraphs [0061]-[0066] & EP 2738802 A1 & CA 2843371 A & CN 103733331 A & KR 10-2014-0063618 A & TW 201314850 A *;
 [A]WO2016002925  (DENKI KAGAKU KOGYO KK [JP]) [A] 1-4 * , entire text, all drawings & US 2017/0130300 A1, entire text, all drawings & TW 201610135 A *
by applicantJPH09157773
 JP2000303126
 JP2014107468
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.