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Extract from the Register of European Patents

EP About this file: EP3712932

EP3712932 - PACKAGE AND SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  21.08.2020
Database last updated on 03.10.2024
FormerThe international publication has been made
Status updated on  28.05.2019
Most recent event   Tooltip02.10.2023New entry: Renewal fee paid 
Applicant(s)For all designated states
NGK Insulators, Ltd.
2-56, Suda-cho Mizuho-ku
Nagoya-shi, Aichi 467-8530 / JP
[2020/39]
Inventor(s)01 / WAKAZONO, Yoshitsugu
c/o NGK INSULATORS LTD.
2-56 Suda-cho
Mizuho-ku
Nagoya-shi, Aichi 467-8530 / JP
 [2020/39]
Representative(s)Mewburn Ellis LLP
Aurora Building
Counterslip
Bristol BS1 6BX / GB
[N/P]
Former [2020/39]Mewburn Ellis LLP
Aurora Building
Counterslip
Bristol BS1 6BX / GB
Application number, filing date17931880.314.11.2017
[2020/39]
WO2017JP40854
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2019097564
Date:23.05.2019
Language:JA
[2019/21]
Type: A1 Application with search report 
No.:EP3712932
Date:23.09.2020
Language:EN
[2020/39]
Search report(s)International search report - published on:JP23.05.2019
(Supplementary) European search report - dispatched on:EP15.06.2021
ClassificationIPC:H01L23/047, H01L23/66, H01L23/64, H01L23/15
[2021/28]
CPC:
H01L23/047 (EP,US); H01L23/15 (EP); H01L23/64 (EP,US);
H01L23/66 (EP); H01L24/48 (EP,US); H01L2223/6611 (EP);
H01L2223/6644 (EP); H01L2223/6655 (EP,US); H01L2224/32245 (EP);
H01L2224/45099 (EP); H01L2224/48157 (US); H01L2224/48195 (EP);
H01L2224/48227 (EP); H01L2224/49175 (EP); H01L2224/73265 (EP);
H01L24/32 (EP); H01L24/49 (EP); H01L2924/15192 (EP);
H01L2924/161 (EP); H01L2924/171 (EP); H01L2924/30111 (EP,US) (-)
C-Set:
H01L2224/45099, H01L2924/00014 (EP)
Former IPC [2020/39]H01L23/08, H01L23/04, H01L23/12
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/39]
TitleGerman:GEHÄUSE UND HALBLEITERBAUELEMENT[2020/39]
English:PACKAGE AND SEMICONDUCTOR DEVICE[2020/39]
French:DISPOSITIF À SEMI-CONDUCTEUR ET BOÎTIER[2020/39]
Entry into regional phase06.05.2020Translation filed 
06.05.2020National basic fee paid 
06.05.2020Search fee paid 
06.05.2020Designation fee(s) paid 
06.05.2020Examination fee paid 
Examination procedure06.05.2020Examination requested  [2020/39]
22.11.2021Amendment by applicant (claims and/or description)
Fees paidRenewal fee
06.05.2020Renewal fee patent year 03
25.11.2020Renewal fee patent year 04
19.10.2021Renewal fee patent year 05
13.10.2022Renewal fee patent year 06
29.09.2023Renewal fee patent year 07
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]US5387888  (EDA KAZUO [JP], et al) [A] 1* column 5, line 35 - column 7, line 11; figure 3 *;
 [A]US5717249  (YOSHIKAWA NORIYUKI [JP], et al) [A] 1 * column 5, lines 1-37; figure 1a * * column 9, lines 11-26 *;
 [A]US2012032190  (TAKAGI KAZUTAKA [JP]) [A] 1-8 * paragraphs [0035] , [0061] - [0068]; figure 3 *;
 [IA]US2016373085  (BARBIERI TRAVIS A [US], et al) [I] 1,3,5-8 * paragraphs [0034] - [0050]; figure 3 * [A] 2,4;
 [A]  - ISHITSUKA F ET AL, "A NEW MULTILAYER CERAMIC-FRAME PACKAGE FOR HIGH-FREQUENCY MMIC MODULES", IEICE TRANSACTIONS, INSTITUTE OF ELECTRONICS INFORMATION AND COMM. ENG. TOKYO, JP, (19910801), vol. E74, no. 8, ISSN 0917-1673, pages 2344 - 2348, XP000268470 [A] 1-8 * "2. Structure"; page 2344; figure 1 *
International search[A]JPS63257255  (SUMITOMO ELECTRIC INDUSTRIES, et al) [A] 1-9 * , *;
 [A]JP2000312103  (MITSUBISHI ELECTRIC CORP) [A] 1-9* , *;
 [XA]JP2004311568  (SUMITOMO METAL ELECTRONICS DEV) [X] 3-8 * , * [A] 1-2, 9;
 [A]JP2014107398  (MITSUBISHI ELECTRIC CORP) [A] 1-9 * , *
by applicantJP2014107398
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.