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EP3407688
European procedure
Extract from the Register of European Patents
EP About this file: EP3407688
| EP3407688 - METHOD OF ASSEMBLING A CIRCUIT CARD ASSEMBLY [Right-click to bookmark this link] | |||
| Former [2018/48] | BOARD-TO-BOARD CONNECTORS AND MOUNTING STRUCTURE | ||
| [2023/49] | Status | The patent has been granted Status updated on 15.03.2024 Database last updated on 31.08.2024 | |
| Former | Grant of patent is intended Status updated on 15.11.2023 | ||
| Former | Examination is in progress Status updated on 30.04.2021 | ||
| Former | Request for examination was made Status updated on 07.06.2019 | ||
| Former | The application has been published Status updated on 26.10.2018 | Most recent event Tooltip | 15.03.2024 | (Expected) grant | published on 17.04.2024 [2024/16] | Applicant(s) | For all designated states Rosemount Aerospace Inc. 14300 Judicial Road Burnsville, MN 55306-4898 / US | [2018/48] | Inventor(s) | 01 /
DeAngelo, Tim 4616 Concord Terrace Edina, MN Minnesota 55424 / US | [2018/48] | Representative(s) | Dehns St. Bride's House 10 Salisbury Square London EC4Y 8JD / GB | [2024/16] |
| Former [2018/48] | Dehns St. Brides House 10 Salisbury Square London EC4Y 8JD / GB | Application number, filing date | 18171913.9 | 11.05.2018 | [2018/48] | Priority number, date | US201715601362 | 22.05.2017 Original published format: US201715601362 | [2018/48] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP3407688 | Date: | 28.11.2018 | Language: | EN | [2018/48] | Type: | B1 Patent specification | No.: | EP3407688 | Date: | 17.04.2024 | Language: | EN | [2024/16] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 08.10.2018 | Classification | IPC: | H05K1/11, H01R12/52, H05K3/36, B33Y80/00, H01R12/58, // H05K1/14 | [2023/49] | CPC: |
H01R12/58 (EP,US);
B33Y80/00 (EP,US);
H01R12/52 (EP,US);
H01R43/205 (US);
H05K1/11 (EP,US);
H05K1/144 (EP,US);
H05K3/007 (US);
H05K3/366 (EP,US);
H05K3/368 (EP,US);
H05K3/4644 (US);
H05K1/145 (EP,US);
H05K2201/042 (EP,US);
H05K2201/10189 (EP,US);
H05K2201/10295 (EP,US);
H05K2201/10318 (US);
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| Former IPC [2018/48] | H05K1/11, H01R12/52, H05K3/36, // H05K1/14 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2019/28] |
| Former [2018/48] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | VERFAHREN ZUR MONTAGE EINER LEITERPLATTENANORDNUNG | [2023/49] | English: | METHOD OF ASSEMBLING A CIRCUIT CARD ASSEMBLY | [2023/49] | French: | PROCÉDÉ D'ASSEMBLAGE D'UN ENSEMBLE CARTE À CIRCUIT IMPRIMÉ | [2023/49] |
| Former [2018/48] | PLATTEN-PLATTEN-VERBINDER UND MONTAGESTRUKTUR | ||
| Former [2018/48] | BOARD-TO-BOARD CONNECTORS AND MOUNTING STRUCTURE | ||
| Former [2018/48] | CONNECTEURS CARTE À CARTE ET STRUCTURE DE MONTAGE | Examination procedure | 28.05.2019 | Amendment by applicant (claims and/or description) | 28.05.2019 | Examination requested [2019/28] | 28.05.2019 | Date on which the examining division has become responsible | 29.04.2021 | Despatch of a communication from the examining division (Time limit: M04) | 07.09.2021 | Reply to a communication from the examining division | 16.11.2023 | Communication of intention to grant the patent | 12.03.2024 | Fee for grant paid | 12.03.2024 | Fee for publishing/printing paid | 12.03.2024 | Receipt of the translation of the claim(s) | Divisional application(s) | EP24160288.7 | Fees paid | Renewal fee | 17.03.2020 | Renewal fee patent year 03 | 19.05.2021 | Renewal fee patent year 04 | 18.05.2022 | Renewal fee patent year 05 | 23.05.2023 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XY]DE10107630 (CONTINENTAL TEVES AG & CO OHG [DE]); | [A]WO2008009505 (SIEMENS AG [DE], et al); | [Y]US2016120040 (ELMIEH BABACK [US], et al) | Examination | DE102014224696 |