EP3447109 - ETCHING SOLUTION FOR SELECTIVELY REMOVING SILICON OVER SILICON-GERMANIUM ALLOY FROM A SILICON-GERMANIUM/ SILICON STACK DURING MANUFACTURE OF A SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 11.06.2021 Database last updated on 24.08.2024 | |
Former | The patent has been granted Status updated on 03.07.2020 | ||
Former | Grant of patent is intended Status updated on 08.04.2020 | ||
Former | Request for examination was made Status updated on 28.03.2020 | ||
Former | Grant of patent is intended Status updated on 24.11.2019 | ||
Former | Request for examination was made Status updated on 25.01.2019 | Most recent event Tooltip | 15.07.2022 | Lapse of the patent in a contracting state New state(s): MK | published on 17.08.2022 [2022/33] | Applicant(s) | For all designated states Versum Materials US, LLC 8555 S. River Parkway Tempe, AZ 85284 / US | [2019/09] | Inventor(s) | 01 /
Wen, Dar Liu No. 309, Chung Shan Road Chupei City, Hsinchu Hsien 302 / TW | 02 /
Yi-Chia, Lee 2F No, 25 Lane 62, Chung Ho Street Chupei City Hsin Chu/Hsinchu County / TW | 03 /
Adamczyk, Andrew J. 305 Yukon Drive Auburn, AL 36832 / US | [2020/32] |
Former [2019/09] | 01 /
Wen Dar Liu No. 309, Chung Shan Road Chupei City, Hsinchu Hsien 302 / TW | ||
02 /
Yi-Chia Lee 2F No, 25 Lane 62, Chung Ho Street Chupei City Hsin Chu/Hsinchu County / TW | |||
03 /
Adamczyk, Andrew J. 305 Yukon Drive Auburn, AL 36832 / US | Representative(s) | Sommer, Andrea Andrea Sommer Patentanwälte PartG mbB Uhlandstraße 2 80336 München / DE | [2019/09] | Application number, filing date | 18190730.4 | 24.08.2018 | [2019/09] | Priority number, date | US201762550491P | 25.08.2017 Original published format: US 201762550491 P | US201816109172 | 22.08.2018 Original published format: US201816109172 | [2019/09] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP3447109 | Date: | 27.02.2019 | Language: | EN | [2019/09] | Type: | B1 Patent specification | No.: | EP3447109 | Date: | 05.08.2020 | Language: | EN | [2020/32] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 20.12.2018 | Classification | IPC: | C09K13/00, H01L21/3213, H01L21/306, H01L29/423, H01L29/66, H01L29/786 | [2019/48] | CPC: |
C09K13/00 (EP,CN,IL,KR,US);
C09K13/02 (IL,US);
H01L21/02057 (KR);
H01L21/30604 (IL,US);
H01L21/30608 (EP,CN,IL,US);
H01L21/31111 (IL,US);
H01L21/32134 (KR);
H01L21/823412 (IL,US);
H01L21/823431 (IL,US);
H01L21/823437 (IL,US);
H01L29/42392 (IL,US);
H01L29/66742 (EP,US);
|
Former IPC [2019/09] | C09K13/00, H01L21/3213 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2019/40] |
Former [2019/09] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | ÄTZLÖSUNG ZUR SELEKTIVEN ENTFERNUNG VON SILICIUM AUS EINER SILICIUM-GERMANIUM-LEGIERUNG AUS EINEM SILICIUM-GERMANIUM/SILICIUM-STAPEL WÄHREND DER HERSTELLUNG EINES HALBLEITERBAUELEMENTS | [2019/09] | English: | ETCHING SOLUTION FOR SELECTIVELY REMOVING SILICON OVER SILICON-GERMANIUM ALLOY FROM A SILICON-GERMANIUM/ SILICON STACK DURING MANUFACTURE OF A SEMICONDUCTOR DEVICE | [2019/09] | French: | SOLUTION DE GRAVURE POUR ÉLIMINER SÉLECTIVEMENT DU SILICIUM SUR UN ALLIAGE SILICIUM-GERMANIUM À PARTIR D'UN EMPILEMENT DE SILICIUM/SILICIUM-GERMANIUM PENDANT LA FABRICATION D'UN DISPOSITIF SEMICONDUCTEUR | [2019/09] | Examination procedure | deleted | Date on which the examining division has become responsible | 24.08.2018 | Examination requested [2019/09] | 27.08.2019 | Amendment by applicant (claims and/or description) | 25.11.2019 | Communication of intention to grant the patent | 25.03.2020 | Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO | 25.03.2020 | Fee for grant paid | 25.03.2020 | Fee for publishing/printing paid | 09.04.2020 | Communication of intention to grant the patent | 22.06.2020 | Fee for grant paid | 22.06.2020 | Fee for publishing/printing paid | 22.06.2020 | Receipt of the translation of the claim(s) | Opposition(s) | 07.05.2021 | No opposition filed within time limit [2021/28] |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 24.08.2018 | AL | 05.08.2020 | AT | 05.08.2020 | CY | 05.08.2020 | CZ | 05.08.2020 | DK | 05.08.2020 | EE | 05.08.2020 | ES | 05.08.2020 | FI | 05.08.2020 | HR | 05.08.2020 | IT | 05.08.2020 | LT | 05.08.2020 | LV | 05.08.2020 | MC | 05.08.2020 | MK | 05.08.2020 | MT | 05.08.2020 | NL | 05.08.2020 | PL | 05.08.2020 | RO | 05.08.2020 | RS | 05.08.2020 | SE | 05.08.2020 | SI | 05.08.2020 | SK | 05.08.2020 | SM | 05.08.2020 | TR | 05.08.2020 | LU | 24.08.2020 | BE | 31.08.2020 | BG | 05.11.2020 | NO | 05.11.2020 | GR | 06.11.2020 | IS | 05.12.2020 | PT | 07.12.2020 | [2022/33] |
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BG | 05.11.2020 | ||
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PT | 07.12.2020 | ||
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LT | 05.08.2020 | ||
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BG | 05.11.2020 | ||
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GR | 06.11.2020 | ||
PT | 07.12.2020 | ||
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FI | 05.08.2020 | ||
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BG | 05.11.2020 | ||
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PT | 07.12.2020 | ||
Former [2021/07] | FI | 05.08.2020 | |
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NO | 05.11.2020 | Documents cited: | Search | [A]US2010248495 (YAGUCHI KAZUYOSHI [JP], et al) [A] 1-9 * claim 1 * * examples 1-4 *; | [A]EP3040397 (AIR PROD & CHEM [US]) [A] 1-9 * claim 1 * * "Examples" *; | [XYI]US2017145311 (LIU WEN DAR [TW], et al) [X] 1,3,5 * example 2 * * examples 1,3-20 * * claims 1,11,19 * * paragraph [0051] * * paragraph [0061] * * paragraph [0073] * * paragraph [0075] * [Y] 2,10-12 [I] 4,6-9; | [Y] - V. LOUP ET AL, "Si and SiGe Alloys Wet Etching Using TMAH Chemistry", ECS TRANSACTIONS, US, (20130831), vol. 58, no. 6, doi:10.1149/05806.0047ecst, ISSN 1938-6737, pages 47 - 55, XP055530536 [Y] 2,10-12 * Introduction * * page 54 * DOI: http://dx.doi.org/10.1149/05806.0047ecst | by applicant | US2017040321 | US2017104062 | US2017133462 | US2017179248 |