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Extract from the Register of European Patents

EP About this file: EP3447109

EP3447109 - ETCHING SOLUTION FOR SELECTIVELY REMOVING SILICON OVER SILICON-GERMANIUM ALLOY FROM A SILICON-GERMANIUM/ SILICON STACK DURING MANUFACTURE OF A SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  11.06.2021
Database last updated on 24.08.2024
FormerThe patent has been granted
Status updated on  03.07.2020
FormerGrant of patent is intended
Status updated on  08.04.2020
FormerRequest for examination was made
Status updated on  28.03.2020
FormerGrant of patent is intended
Status updated on  24.11.2019
FormerRequest for examination was made
Status updated on  25.01.2019
Most recent event   Tooltip15.07.2022Lapse of the patent in a contracting state
New state(s): MK		published on 17.08.2022  [2022/33]
Applicant(s)For all designated states
Versum Materials US, LLC
8555 S. River Parkway
Tempe, AZ 85284 / US
[2019/09]
Inventor(s)01 / Wen, Dar Liu
No. 309, Chung Shan Road
Chupei City, Hsinchu Hsien 302 / TW
02 / Yi-Chia, Lee
2F No, 25 Lane 62, Chung Ho Street
Chupei City Hsin Chu/Hsinchu County / TW
03 / Adamczyk, Andrew J.
305 Yukon Drive
Auburn, AL 36832 / US
 [2020/32]
Former [2019/09]01 / Wen Dar Liu
No. 309, Chung Shan Road
Chupei City, Hsinchu Hsien 302 / TW
02 / Yi-Chia Lee
2F No, 25 Lane 62, Chung Ho Street
Chupei City Hsin Chu/Hsinchu County / TW
03 / Adamczyk, Andrew J.
305 Yukon Drive
Auburn, AL 36832 / US
Representative(s)Sommer, Andrea
Andrea Sommer
Patentanwälte PartG mbB
Uhlandstraße 2
80336 München / DE
[2019/09]
Application number, filing date18190730.424.08.2018
[2019/09]
Priority number, dateUS201762550491P25.08.2017         Original published format: US 201762550491 P
US20181610917222.08.2018         Original published format: US201816109172
[2019/09]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP3447109
Date:27.02.2019
Language:EN
[2019/09]
Type: B1 Patent specification 
No.:EP3447109
Date:05.08.2020
Language:EN
[2020/32]
Search report(s)(Supplementary) European search report - dispatched on:EP20.12.2018
ClassificationIPC:C09K13/00, H01L21/3213, H01L21/306, H01L29/423, H01L29/66, H01L29/786
[2019/48]
CPC:
C09K13/00 (EP,CN,IL,KR,US); C09K13/02 (IL,US); H01L21/02057 (KR);
H01L21/30604 (IL,US); H01L21/30608 (EP,CN,IL,US); H01L21/31111 (IL,US);
H01L21/32134 (KR); H01L21/823412 (IL,US); H01L21/823431 (IL,US);
H01L21/823437 (IL,US); H01L29/42392 (IL,US); H01L29/66742 (EP,US);
H01L29/78684 (EP,US); H01L29/78696 (EP,US) (-)
Former IPC [2019/09]C09K13/00, H01L21/3213
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2019/40]
Former [2019/09]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:ÄTZLÖSUNG ZUR SELEKTIVEN ENTFERNUNG VON SILICIUM AUS EINER SILICIUM-GERMANIUM-LEGIERUNG AUS EINEM SILICIUM-GERMANIUM/SILICIUM-STAPEL WÄHREND DER HERSTELLUNG EINES HALBLEITERBAUELEMENTS[2019/09]
English:ETCHING SOLUTION FOR SELECTIVELY REMOVING SILICON OVER SILICON-GERMANIUM ALLOY FROM A SILICON-GERMANIUM/ SILICON STACK DURING MANUFACTURE OF A SEMICONDUCTOR DEVICE[2019/09]
French:SOLUTION DE GRAVURE POUR ÉLIMINER SÉLECTIVEMENT DU SILICIUM SUR UN ALLIAGE SILICIUM-GERMANIUM À PARTIR D'UN EMPILEMENT DE SILICIUM/SILICIUM-GERMANIUM PENDANT LA FABRICATION D'UN DISPOSITIF SEMICONDUCTEUR[2019/09]
Examination proceduredeletedDate on which the examining division has become responsible
24.08.2018Examination requested  [2019/09]
27.08.2019Amendment by applicant (claims and/or description)
25.11.2019Communication of intention to grant the patent
25.03.2020Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO
25.03.2020Fee for grant paid
25.03.2020Fee for publishing/printing paid
09.04.2020Communication of intention to grant the patent
22.06.2020Fee for grant paid
22.06.2020Fee for publishing/printing paid
22.06.2020Receipt of the translation of the claim(s)
Opposition(s)07.05.2021No opposition filed within time limit [2021/28]
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU24.08.2018
AL05.08.2020
AT05.08.2020
CY05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
MK05.08.2020
MT05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
TR05.08.2020
LU24.08.2020
BE31.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
[2022/33]
Former [2022/27]HU24.08.2018
AL05.08.2020
AT05.08.2020
CY05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
MT05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
TR05.08.2020
LU24.08.2020
BE31.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/36]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SI05.08.2020
SK05.08.2020
SM05.08.2020
LU24.08.2020
BE31.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/34]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
IT05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SK05.08.2020
SM05.08.2020
LU24.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/28]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SK05.08.2020
SM05.08.2020
LU24.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/27]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
MC05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SM05.08.2020
LU24.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/25]AL05.08.2020
AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SM05.08.2020
LU24.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/22]AT05.08.2020
CZ05.08.2020
DK05.08.2020
EE05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RO05.08.2020
RS05.08.2020
SE05.08.2020
SM05.08.2020
LU24.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/20]AT05.08.2020
DK05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RS05.08.2020
SE05.08.2020
LU24.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/12]AT05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
NL05.08.2020
PL05.08.2020
RS05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/10]AT05.08.2020
ES05.08.2020
FI05.08.2020
HR05.08.2020
LT05.08.2020
LV05.08.2020
PL05.08.2020
RS05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
IS05.12.2020
PT07.12.2020
Former [2021/09]AT05.08.2020
ES05.08.2020
FI05.08.2020
LT05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
GR06.11.2020
PT07.12.2020
Former [2021/08]ES05.08.2020
FI05.08.2020
LT05.08.2020
SE05.08.2020
BG05.11.2020
NO05.11.2020
PT07.12.2020
Former [2021/07]FI05.08.2020
LT05.08.2020
NO05.11.2020
Documents cited:Search[A]US2010248495  (YAGUCHI KAZUYOSHI [JP], et al) [A] 1-9 * claim 1 * * examples 1-4 *;
 [A]EP3040397  (AIR PROD & CHEM [US]) [A] 1-9 * claim 1 * * "Examples" *;
 [XYI]US2017145311  (LIU WEN DAR [TW], et al) [X] 1,3,5 * example 2 * * examples 1,3-20 * * claims 1,11,19 * * paragraph [0051] * * paragraph [0061] * * paragraph [0073] * * paragraph [0075] * [Y] 2,10-12 [I] 4,6-9;
 [Y]  - V. LOUP ET AL, "Si and SiGe Alloys Wet Etching Using TMAH Chemistry", ECS TRANSACTIONS, US, (20130831), vol. 58, no. 6, doi:10.1149/05806.0047ecst, ISSN 1938-6737, pages 47 - 55, XP055530536 [Y] 2,10-12 * Introduction * * page 54 *

DOI:   http://dx.doi.org/10.1149/05806.0047ecst
by applicantUS2017040321
 US2017104062
 US2017133462
 US2017179248
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.