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Extract from the Register of European Patents

EP About this file: EP3496300

EP3496300 - INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY [Right-click to bookmark this link]
StatusExamination is in progress
Status updated on  22.01.2021
Database last updated on 12.07.2024
FormerRequest for examination was made
Status updated on  20.12.2019
FormerThe application has been published
Status updated on  10.05.2019
Most recent event   Tooltip16.05.2024New entry: Date of oral proceedings 
Applicant(s)For all designated states
INTEL Corporation
2200 Mission College Blvd.
Santa Clara, CA 95054 / US
[2019/24]
Inventor(s)01 / LI, Peng
2200 Mission College Boulevard
Santa Clara, California 95054 / US
02 / MARTINEZ, Joel
2200 Mission College Boulevard
Santa Clara, California 95054 / US
03 / LONG, Jon
2200 Mission College Boulevard
Santa Clara, California 95054 / US
 [2019/24]
Representative(s)Goddar, Heinz J.
Boehmert & Boehmert
Anwaltspartnerschaft mbB
Pettenkoferstrasse 22
80336 München / DE
[2019/24]
Application number, filing date18204765.406.11.2018
[2019/24]
Priority number, dateUS20171583517707.12.2017         Original published format: US201715835177
[2019/24]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP3496300
Date:12.06.2019
Language:EN
[2019/24]
Search report(s)(Supplementary) European search report - dispatched on:EP03.05.2019
ClassificationIPC:H04B10/40
[2019/24]
CPC:
H04B10/40 (EP,US); G02B6/43 (US); H01L23/49816 (US);
H01L23/49827 (US); H01L23/49833 (US); H01L23/5385 (US);
H01L24/14 (US); H01L24/48 (US); H01L24/81 (US);
H01L25/0655 (EP,US); G02B6/4246 (EP); G02B6/4292 (EP);
H01L2224/13101 (EP,US); H01L2224/1403 (EP,US); H01L2224/16225 (EP,US);
H01L24/13 (EP,US); H01L24/16 (EP,US); H01L2924/10253 (EP,US);
H01L2924/15311 (EP,US); H01L2924/3511 (EP,US) (-)
C-Set:
H01L2224/13101, H01L2924/014, H01L2924/00014 (US,EP);
H01L2924/10253, H01L2924/00012 (US,EP);
H01L2924/3511, H01L2924/00 (EP,US)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/04]
Former [2019/24]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:INTEGRIERTES SCHALTUNGSPAKET MIT ELEKTROOPTISCHER VERBINDUNGSSCHALTUNG[2019/24]
English:INTEGRATED CIRCUIT PACKAGE WITH ELECTRO-OPTICAL INTERCONNECT CIRCUITRY[2019/24]
French:BOÎTIER DE CIRCUIT INTÉGRÉ COMPORTANT DES CIRCUITS D'INTERCONNEXION ÉLECTRO-OPTIQUES[2019/24]
Examination procedure12.12.2019Amendment by applicant (claims and/or description)
12.12.2019Examination requested  [2020/04]
12.12.2019Date on which the examining division has become responsible
25.01.2021Despatch of a communication from the examining division (Time limit: M04)
20.05.2021Reply to a communication from the examining division
06.03.2023Despatch of a communication from the examining division (Time limit: M04)
17.07.2023Reply to a communication from the examining division
17.10.2024Date of oral proceedings
Fees paidRenewal fee
30.09.2020Renewal fee patent year 03
26.10.2021Renewal fee patent year 04
26.10.2022Renewal fee patent year 05
13.09.2023Renewal fee patent year 06
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XI]WO02063800  (FINISAR CORP [US]) [X] 1,11 * abstract * * page 4, line 25 - page 6, line 2 * * page 6, line 18 - page 9, line 23 * * figures 2, 3 * [I] 2-10,12-15;
 [XI]US2003053170  (LEVINSON FRANK H [US], et al) [X] 1,11 * abstract * * paragraphs [0028] - [0031] * * paragraph [0064] * * figures 2A, 2B, * [I] 2-10,12-15;
 [XI]US2007258551  (SEFIDVASH KHORVISH [US], et al) [X] 1,11 * abstract * * paragraphs [0012] - [0015] * * paragraphs [0022] - [0036] * * figures 1-3 * [I] 2-10,12-15;
 [XI]US2008292322  (DAGHIGHIAN HENRY MEYER [US], et al) [X] 1,11 * abstract * * paragraphs [0011] - [0012] * * paragraphs [0046] - [0063] * * figures 2-4, 14A, 14B * [I] 2-10,12-15;
 [XI]US2009116845  (LI WEN [US], et al) [X] 1,11 * abstract * * paragraphs [0003] - [0010] * * paragraphs [0036] - [0041] * * figures 4, 5 * [I] 2-10,12-15;
 [XI]WO2014014846  (PACKET PHOTONICS INC [US]) [X] 1,11 * abstract * * page 5, line 15 - page 8, line 16 * * page 9 * * page 11, line 27 - page 12, line 32 * * page 14 - page 15 * * figures 1, 4 *[I] 2-10,12-15
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.