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EP3624982

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Extract from the Register of European Patents

EP About this file: EP3624982

EP3624982 - METHOD FOR PROCESSING, IN PARTICULAR SEPARATING, A SUBSTRATE BY MEANS OF LASER-INDUCED DEEP REACTIVE ETCHING [Right-click to bookmark this link]
Status	Examination is in progress Status updated on 18.12.2020 Database last updated on 14.11.2024
Former	Request for examination was made Status updated on 21.02.2020
Former	The international publication has been made Status updated on 23.11.2018
Former	unknown Status updated on 27.04.2018
Most recent event Tooltip	12.03.2024	New entry: Renewal fee paid
Applicant(s)	For all designated states LPKF Laser & Electronics SE Osteriede 7 30827 Garbsen / DE
	[2023/18]
Former [2020/13]	For all designated states LPKF Laser & Electronics AG Osteriede 7 30827 Garbsen / DE
Inventor(s)	01 / OSTHOLT, Roman Altenhorst 44 30855 Langenhagen / DE
	02 / AMBROSIUS, Norbert Wilhelm-Malsch-Weg 48 30827 Garbsen / DE
	03 / DUNKER, Daniel Bussilliatweg 17 30419 Hannover / DE
	04 / SCHNOOR, Arne Berckhusenstrasse 43 30625 Hannover / DE
	[2020/15]
Former [2020/13]	01 / OSTHOLT, Roman Altenhorst 44 30855 Langenhagen / DE
	02 / AMBROSIUS, Norbert Eilser Marsch 3 30419 Hannover / DE
	03 / DUNKER, Daniel Bussilliatweg 17 30419 Hannover / DE
	04 / SCHNOOR, Arne Berckhusenstrasse 43 30625 Hannover / DE
Representative(s)	Scheffler, Jörg Patentanwaltskanzlei Creutzburg Arnswaldtstraße 31 30159 Hannover / DE
	[N/P]
Former [2020/13]	Scheffler, Jörg Patentanwaltskanzlei Scheffler Arnswaldtstraße 31 30159 Hannover / DE
Application number, filing date	18717553.4	06.04.2018
	[2020/13]
	WO2018EP58882
Priority number, date	DE201710110542	15.05.2017 Original published format: DE102017110542
	[2020/13]
Filing language	DE
Procedural language	DE
Publication	Type:	A1 Application with search report
	No.:	WO2018210484
	Date:	22.11.2018
	Language:	DE
	[2018/47]
	Type:	A1 Application with search report
	No.:	EP3624982
	Date:	25.03.2020
	Language:	DE
	The application published by WIPO in one of the EPO official languages on 22.11.2018 takes the place of the publication of the European patent application.
	[2020/13]
Search report(s)	International search report - published on:	EP	22.11.2018
Classification	IPC:	B23K26/00, B23K26/362, B23K26/402, C03B33/02, B23K26/0622, B23K26/53, B23K103/00	[2020/13]
	CPC:	B23K26/0006 (EP,KR,US); B23K26/361 (EP,KR,US); B23K26/0622 (EP,KR,US); B23K26/00 (US); B23K26/362 (US); B23K26/402 (EP,KR,US); (+) B23K26/53 (EP,KR,US); C03B33/0222 (EP,KR,US); C03C15/00 (EP,KR,US); C03C23/0025 (EP,KR,US); B23K2103/54 (EP,US) (-)
Designated contracting states	AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2020/13]
Title	German:	VERFAHREN ZUR BEARBEITUNG, INSBESONDERE ZUM TRENNEN EINES SUBSTRATES MITTELS LASERINDUZIERTEM TIEFENÄTZEN	[2020/13]
	English:	METHOD FOR PROCESSING, IN PARTICULAR SEPARATING, A SUBSTRATE BY MEANS OF LASER-INDUCED DEEP REACTIVE ETCHING	[2020/13]
	French:	PROCÉDÉ D'USINAGE, EN PARTICULIER DE SÉPARATION, D'UN SUBSTRAT PAR GRAVURE PROFONDE INDUITE PAR LASER	[2020/13]
Entry into regional phase	16.12.2019	National basic fee paid
	16.12.2019	Designation fee(s) paid
	16.12.2019	Examination fee paid
Examination procedure	16.12.2019	Examination requested [2020/13]
	16.12.2019	Date on which the examining division has become responsible
	20.02.2020	Amendment by applicant (claims and/or description)
	18.12.2020	Despatch of a communication from the examining division (Time limit: M04)
	26.02.2021	Reply to a communication from the examining division
	28.09.2022	Despatch of a communication from the examining division (Time limit: M04)
	22.11.2022	Reply to a communication from the examining division
Fees paid	Renewal fee
	05.03.2020	Renewal fee patent year 03
	30.04.2021	Renewal fee patent year 04
	02.05.2022	Renewal fee patent year 05
	28.03.2023	Renewal fee patent year 06
	12.03.2024	Renewal fee patent year 07
Opt-out from the exclusive Tooltip competence of the Unified Patent Court	See the Register of the Unified Patent Court for opt-out data
	Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited in	International search	[A]WO2014161534 (LPKF LASER & ELECTRONICS AG [DE]);
		[X]WO2016010954 (CORNING INC [US])
	Examination	US2014248757
		WO2015018425
		WO2017038075
	by applicant	WO2014161534
		WO2016004144

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