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Extract from the Register of European Patents

EP About this file: EP3625819

EP3625819 - HYBRID BONDING METHOD FOR SEMICONDUCTOR WAFERS AND RELATED THREE-DIMENSIONAL INTEGRATED DEVICE [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  06.05.2022
Database last updated on 17.07.2024
FormerThe patent has been granted
Status updated on  28.05.2021
FormerGrant of patent is intended
Status updated on  14.01.2021
FormerRequest for examination was made
Status updated on  21.02.2020
FormerThe international publication has been made
Status updated on  23.11.2018
Formerunknown
Status updated on  25.06.2018
Most recent event   Tooltip14.06.2024Lapse of the patent in a contracting state
New state(s): TR		published on 17.07.2024  [2024/29]
Applicant(s)For all designated states
LFoundry S.r.l.
Via Pacinotti, 7
67051 Avezzano (AQ) / IT
[2020/13]
Inventor(s)01 / DE AMICIS, Giovanni
Via Avezzano 3
67100 L'Aquila (AQ) / IT
02 / DEL MONTE, Andrea
Via Rumenia 97
00071 Pomezia (RM) / IT
03 / DI COLA, Onorato
Via Della Chiusa 2
67010 Barete (AQ) / IT
 [2020/13]
Representative(s)Barbaro, Gaetano, et al
Società Italiana Brevetti S.p.A.
Via G. Carducci, 8
20123 Milano / IT
[2020/13]
Application number, filing date18730856.417.05.2018
[2020/13]
WO2018IB53472
Priority number, dateIT2017005390218.05.2017         Original published format: IT201700053902
[2020/13]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2018211447
Date:22.11.2018
Language:EN
[2018/47]
Type: A1 Application with search report 
No.:EP3625819
Date:25.03.2020
Language:EN
The application published by WIPO in one of the EPO official languages on 22.11.2018 takes the place of the publication of the European patent application.
[2020/13]
Type: B1 Patent specification 
No.:EP3625819
Date:30.06.2021
Language:EN
[2021/26]
Search report(s)International search report - published on:EP22.11.2018
ClassificationIPC:H01L21/18, H01L27/06, H01L23/00, H01L25/00, H01L27/146, H01L25/16
[2021/03]
CPC:
H01L21/187 (EP,US); H01L27/1469 (US); H01L24/05 (EP);
H01L24/08 (EP,US); H01L24/80 (EP,US); H01L24/94 (EP);
H01L25/0657 (US); H01L25/167 (EP); H01L25/50 (EP,US);
H01L27/14632 (EP); H01L27/14634 (US); H01L2224/08145 (EP,US);
H01L2224/80011 (US); H01L2224/80895 (EP,US); H01L2224/80896 (EP,US);
H01L2924/14 (EP) (-)
C-Set:
H01L2924/14, H01L2924/00012 (EP)
Former IPC [2020/13]H01L21/18, H01L23/00
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/13]
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:HYBRIDES BONDING VERFAHREN FÜR HALBLEITERWAFER UND ZUGEHÖRIGE DREIDIMENSIONALE INTEGRIERTE VORRICHTUNG[2021/03]
English:HYBRID BONDING METHOD FOR SEMICONDUCTOR WAFERS AND RELATED THREE-DIMENSIONAL INTEGRATED DEVICE[2020/13]
French:PROCÉDÉ DE COLLAGE HYBRIDE POUR TRANCHES DE SEMI-CONDUCTEUR ET DISPOSITIF INTÉGRÉ TRIDIMENSIONNEL ASSOCIÉ[2020/13]
Former [2020/13]HYBRIDES VERKLEBUNGSVERFAHREN FÜR HALBLEITERWAFER UND ZUGEHÖRIGE DREIDIMENSIONALE INTEGRIERTE VORRICHTUNG
Entry into regional phase06.12.2019National basic fee paid 
06.12.2019Designation fee(s) paid 
06.12.2019Examination fee paid 
Examination procedure15.03.2019Request for preliminary examination filed
International Preliminary Examining Authority: EP
06.12.2019Examination requested  [2020/13]
06.12.2019Date on which the examining division has become responsible
15.01.2021Communication of intention to grant the patent
12.05.2021Fee for grant paid
12.05.2021Fee for publishing/printing paid
12.05.2021Receipt of the translation of the claim(s)
Opposition(s)31.03.2022No opposition filed within time limit [2022/23]
Fees paidRenewal fee
11.03.2020Renewal fee patent year 03
20.05.2021Renewal fee patent year 04
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU17.05.2018
AL30.06.2021
AT30.06.2021
CY30.06.2021
CZ30.06.2021
DK30.06.2021
EE30.06.2021
ES30.06.2021
FI30.06.2021
HR30.06.2021
LT30.06.2021
LV30.06.2021
MC30.06.2021
MK30.06.2021
NL30.06.2021
PL30.06.2021
RO30.06.2021
RS30.06.2021
SE30.06.2021
SI30.06.2021
SK30.06.2021
SM30.06.2021
TR30.06.2021
BG30.09.2021
NO30.09.2021
GR01.10.2021
IS30.10.2021
PT02.11.2021
[2024/29]
Former [2024/24]HU17.05.2018
AL30.06.2021
AT30.06.2021
CY30.06.2021
CZ30.06.2021
DK30.06.2021
EE30.06.2021
ES30.06.2021
FI30.06.2021
HR30.06.2021
LT30.06.2021
LV30.06.2021
MC30.06.2021
MK30.06.2021
NL30.06.2021
PL30.06.2021
RO30.06.2021
RS30.06.2021
SE30.06.2021
SI30.06.2021
SK30.06.2021
SM30.06.2021
BG30.09.2021
NO30.09.2021
GR01.10.2021
IS30.10.2021
PT02.11.2021
Former [2024/23]AL30.06.2021
AT30.06.2021
CY30.06.2021
CZ30.06.2021
DK30.06.2021
EE30.06.2021
ES30.06.2021
FI30.06.2021
HR30.06.2021
LT30.06.2021
LV30.06.2021
MC30.06.2021
MK30.06.2021
NL30.06.2021
PL30.06.2021
RO30.06.2021
RS30.06.2021
SE30.06.2021
SI30.06.2021
SK30.06.2021
SM30.06.2021
BG30.09.2021
NO30.09.2021
GR01.10.2021
IS30.10.2021
PT02.11.2021
Former [2024/20]AL30.06.2021
AT30.06.2021
CY30.06.2021
CZ30.06.2021
DK30.06.2021
EE30.06.2021
ES30.06.2021
FI30.06.2021
HR30.06.2021
LT30.06.2021
LV30.06.2021
MC30.06.2021
NL30.06.2021
PL30.06.2021
RO30.06.2021
RS30.06.2021
SE30.06.2021
SI30.06.2021
SK30.06.2021
SM30.06.2021
BG30.09.2021
NO30.09.2021
GR01.10.2021
IS30.10.2021
PT02.11.2021
Former [2023/19]AL30.06.2021
AT30.06.2021
CZ30.06.2021
DK30.06.2021
EE30.06.2021
ES30.06.2021
FI30.06.2021
HR30.06.2021
LT30.06.2021
LV30.06.2021
MC30.06.2021
NL30.06.2021
PL30.06.2021
RO30.06.2021
RS30.06.2021
SE30.06.2021
SI30.06.2021
SK30.06.2021
SM30.06.2021
BG30.09.2021
NO30.09.2021
GR01.10.2021
IS30.10.2021
PT02.11.2021
Former [2023/06]AL30.06.2021
AT30.06.2021
CZ30.06.2021
DK30.06.2021
EE30.06.2021
ES30.06.2021
FI30.06.2021
HR30.06.2021
LV30.06.2021
MC30.06.2021
NL30.06.2021
PL30.06.2021
RO30.06.2021
RS30.06.2021
SE30.06.2021
SI30.06.2021
SK30.06.2021
SM30.06.2021
BG30.09.2021
NO30.09.2021
GR01.10.2021
IS30.10.2021
PT02.11.2021
Former [2022/29]AL30.06.2021
AT30.06.2021
CZ30.06.2021
DK30.06.2021
EE30.06.2021
ES30.06.2021
FI30.06.2021
HR30.06.2021
LV30.06.2021
NL30.06.2021
PL30.06.2021
RO30.06.2021
RS30.06.2021
SE30.06.2021
SI30.06.2021
SK30.06.2021
SM30.06.2021
BG30.09.2021
NO30.09.2021
GR01.10.2021
IS30.10.2021
PT02.11.2021
Former [2022/26]AL30.06.2021
AT30.06.2021
CZ30.06.2021
DK30.06.2021
EE30.06.2021
ES30.06.2021
FI30.06.2021
HR30.06.2021
LV30.06.2021
NL30.06.2021
PL30.06.2021
RO30.06.2021
RS30.06.2021
SE30.06.2021
SK30.06.2021
SM30.06.2021
BG30.09.2021
NO30.09.2021
GR01.10.2021
IS30.10.2021
PT02.11.2021
Former [2022/21]AT30.06.2021
CZ30.06.2021
DK30.06.2021
EE30.06.2021
ES30.06.2021
FI30.06.2021
HR30.06.2021
LV30.06.2021
NL30.06.2021
PL30.06.2021
RO30.06.2021
RS30.06.2021
SE30.06.2021
SK30.06.2021
SM30.06.2021
BG30.09.2021
NO30.09.2021
GR01.10.2021
IS30.10.2021
PT02.11.2021
Former [2022/11]AT30.06.2021
CZ30.06.2021
EE30.06.2021
ES30.06.2021
FI30.06.2021
HR30.06.2021
LV30.06.2021
NL30.06.2021
PL30.06.2021
RO30.06.2021
RS30.06.2021
SE30.06.2021
SK30.06.2021
SM30.06.2021
BG30.09.2021
NO30.09.2021
GR01.10.2021
IS30.10.2021
PT02.11.2021
Former [2022/09]AT30.06.2021
CZ30.06.2021
ES30.06.2021
FI30.06.2021
HR30.06.2021
LV30.06.2021
NL30.06.2021
RO30.06.2021
RS30.06.2021
SE30.06.2021
SK30.06.2021
SM30.06.2021
BG30.09.2021
NO30.09.2021
GR01.10.2021
PT02.11.2021
Former [2022/08]AT30.06.2021
CZ30.06.2021
ES30.06.2021
FI30.06.2021
HR30.06.2021
LV30.06.2021
NL30.06.2021
RS30.06.2021
SE30.06.2021
SM30.06.2021
BG30.09.2021
NO30.09.2021
GR01.10.2021
Former [2022/07]AT30.06.2021
FI30.06.2021
HR30.06.2021
LV30.06.2021
NL30.06.2021
RS30.06.2021
SE30.06.2021
SM30.06.2021
BG30.09.2021
NO30.09.2021
GR01.10.2021
Former [2021/51]FI30.06.2021
HR30.06.2021
LV30.06.2021
RS30.06.2021
SE30.06.2021
BG30.09.2021
NO30.09.2021
GR01.10.2021
Former [2021/49]FI30.06.2021
HR30.06.2021
LV30.06.2021
SE30.06.2021
BG30.09.2021
NO30.09.2021
GR01.10.2021
Former [2021/46]FI30.06.2021
BG30.09.2021
Cited inInternational search[A]US2015021785  (LIN JING-CHENG [TW]) [A] 8-10* figure 1D *;
 [I]US2016190103  (KABE TATSUYA [JP], et al) [I] 1-10 * paragraph [0066] - paragraph [0080]; figures 2A-2F *
by applicantUS2002074670
 US2007207592
 US2015021785
 US2015294963
 US2016190103
 US2017062366
    - FRANK NIKLAUS et al., "Adhesive Wafer Bonding Using Partially Cured Benzocyclobutene for Three-Dimensional Integration", J. Electrochem. Soc., (20060000), vol. 153, no. 4, pages G291 - G295
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.