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Extract from the Register of European Patents

EP About this file: EP3642872

EP3642872 - FLEXIBLE ELECTRONIC ASSEMBLY WITH SEMICONDUCTOR DIE [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  23.06.2023
Database last updated on 12.11.2024
FormerThe patent has been granted
Status updated on  15.07.2022
FormerGrant of patent is intended
Status updated on  12.04.2022
FormerExamination is in progress
Status updated on  12.02.2021
FormerRequest for examination was made
Status updated on  27.03.2020
FormerThe international publication has been made
Status updated on  31.12.2018
Formerunknown
Status updated on  29.06.2018
Most recent event   Tooltip24.05.2024Lapse of the patent in a contracting state
New state(s): IT
published on 26.06.2024  [2024/26]
Applicant(s)For all designated states
Microsoft Technology Licensing, LLC
One Microsoft Way
Redmond, WA 98052-6399 / US
[2021/45]
Former [2020/18]For all designated states
Microsoft Technology Licensing LLC
One Microsoft Way
Redmond, Washington 98052-6399 / US
Inventor(s)01 / HOLBERY, James David
MICROSOFT TECHNOLOGY LICENSING LLC
One Microsoft Way
Redmond, Washington 98052-6399 / US
02 / MA, Siyuan
MICROSOFT TECHNOLOGY LICENSING LLC
One Microsoft Way
Redmond, Washington 98052-6399 / US
03 / SULLIVAN, Benjamin
MICROSOFT TECHNOLOGY LICENSING LLC
One Microsoft Way
Redmond, Washington 98052-6399 / US
 [2020/18]
Representative(s)CMS Cameron McKenna Nabarro Olswang LLP
Cannon Place
78 Cannon Street
London EC4N 6AF / GB
[2020/18]
Application number, filing date18731943.924.05.2018
[2020/18]
WO2018US34247
Priority number, dateUS20171562721519.06.2017         Original published format: US201715627215
[2020/18]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2018236532
Date:27.12.2018
Language:EN
[2018/52]
Type: A1 Application with search report 
No.:EP3642872
Date:29.04.2020
Language:EN
The application published by WIPO in one of the EPO official languages on 27.12.2018 takes the place of the publication of the European patent application.
[2020/18]
Type: B1 Patent specification 
No.:EP3642872
Date:17.08.2022
Language:EN
[2022/33]
Search report(s)International search report - published on:EP27.12.2018
ClassificationIPC:H01L25/075, H05K1/03, H05K1/18, H01L33/62, H01L33/20
[2020/18]
CPC:
H01L33/62 (EP,US); H01L33/483 (US); H01L25/0753 (EP,US);
H01L33/0095 (US); H01L33/505 (US); H05K3/284 (EP,US);
H01L2933/005 (EP,US); H01L2933/0066 (EP,US); H01L33/20 (EP,US);
H05K1/0366 (EP,US); H05K2201/10106 (EP,US); H05K2203/1311 (EP,US) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/18]
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:FLEXIBLE ELEKTRONISCHE ANORDNUNG MIT HALBLEITERCHIP[2020/18]
English:FLEXIBLE ELECTRONIC ASSEMBLY WITH SEMICONDUCTOR DIE[2020/18]
French:ENSEMBLE ÉLECTRONIQUE FLEXIBLE AVEC PUCE SEMI-CONDUCTRICE[2020/18]
Entry into regional phase13.11.2019National basic fee paid 
13.11.2019Designation fee(s) paid 
13.11.2019Examination fee paid 
Examination procedure13.11.2019Examination requested  [2020/18]
13.11.2019Date on which the examining division has become responsible
04.03.2020Amendment by applicant (claims and/or description)
16.02.2021Despatch of a communication from the examining division (Time limit: M04)
11.06.2021Reply to a communication from the examining division
13.04.2022Communication of intention to grant the patent
11.07.2022Fee for grant paid
11.07.2022Fee for publishing/printing paid
11.07.2022Receipt of the translation of the claim(s)
Opposition(s)19.05.2023No opposition filed within time limit [2023/30]
Fees paidRenewal fee
31.03.2020Renewal fee patent year 03
13.05.2021Renewal fee patent year 04
16.03.2022Renewal fee patent year 05
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAL17.08.2022
AT17.08.2022
CZ17.08.2022
DK17.08.2022
EE17.08.2022
ES17.08.2022
FI17.08.2022
HR17.08.2022
IT17.08.2022
LT17.08.2022
LV17.08.2022
MC17.08.2022
NL17.08.2022
PL17.08.2022
RO17.08.2022
RS17.08.2022
SE17.08.2022
SI17.08.2022
SK17.08.2022
SM17.08.2022
NO17.11.2022
GR18.11.2022
IS17.12.2022
PT19.12.2022
[2024/26]
Former [2024/08]AL17.08.2022
AT17.08.2022
CZ17.08.2022
DK17.08.2022
EE17.08.2022
ES17.08.2022
FI17.08.2022
HR17.08.2022
LT17.08.2022
LV17.08.2022
MC17.08.2022
NL17.08.2022
PL17.08.2022
RO17.08.2022
RS17.08.2022
SE17.08.2022
SI17.08.2022
SK17.08.2022
SM17.08.2022
NO17.11.2022
GR18.11.2022
IS17.12.2022
PT19.12.2022
Former [2023/37]AL17.08.2022
AT17.08.2022
CZ17.08.2022
DK17.08.2022
EE17.08.2022
ES17.08.2022
FI17.08.2022
HR17.08.2022
LT17.08.2022
LV17.08.2022
NL17.08.2022
PL17.08.2022
RO17.08.2022
RS17.08.2022
SE17.08.2022
SI17.08.2022
SK17.08.2022
SM17.08.2022
NO17.11.2022
GR18.11.2022
IS17.12.2022
PT19.12.2022
Former [2023/29]AL17.08.2022
AT17.08.2022
CZ17.08.2022
DK17.08.2022
EE17.08.2022
ES17.08.2022
FI17.08.2022
HR17.08.2022
LT17.08.2022
LV17.08.2022
NL17.08.2022
PL17.08.2022
RO17.08.2022
RS17.08.2022
SE17.08.2022
SK17.08.2022
SM17.08.2022
NO17.11.2022
GR18.11.2022
IS17.12.2022
PT19.12.2022
Former [2023/23]AT17.08.2022
CZ17.08.2022
DK17.08.2022
EE17.08.2022
ES17.08.2022
FI17.08.2022
HR17.08.2022
LT17.08.2022
LV17.08.2022
NL17.08.2022
PL17.08.2022
RO17.08.2022
RS17.08.2022
SE17.08.2022
SK17.08.2022
SM17.08.2022
NO17.11.2022
GR18.11.2022
IS17.12.2022
PT19.12.2022
Former [2023/22]AT17.08.2022
CZ17.08.2022
DK17.08.2022
ES17.08.2022
FI17.08.2022
HR17.08.2022
LT17.08.2022
LV17.08.2022
NL17.08.2022
PL17.08.2022
RO17.08.2022
RS17.08.2022
SE17.08.2022
SM17.08.2022
NO17.11.2022
GR18.11.2022
IS17.12.2022
PT19.12.2022
Former [2023/21]DK17.08.2022
FI17.08.2022
HR17.08.2022
LT17.08.2022
LV17.08.2022
NL17.08.2022
PL17.08.2022
RS17.08.2022
SE17.08.2022
SM17.08.2022
NO17.11.2022
GR18.11.2022
IS17.12.2022
PT19.12.2022
Former [2023/20]FI17.08.2022
HR17.08.2022
LT17.08.2022
LV17.08.2022
NL17.08.2022
PL17.08.2022
RS17.08.2022
SE17.08.2022
SM17.08.2022
NO17.11.2022
GR18.11.2022
IS17.12.2022
PT19.12.2022
Former [2023/12]FI17.08.2022
HR17.08.2022
LT17.08.2022
LV17.08.2022
NL17.08.2022
PL17.08.2022
RS17.08.2022
SE17.08.2022
NO17.11.2022
GR18.11.2022
IS17.12.2022
PT19.12.2022
Former [2023/11]FI17.08.2022
HR17.08.2022
LT17.08.2022
LV17.08.2022
NL17.08.2022
PL17.08.2022
RS17.08.2022
SE17.08.2022
NO17.11.2022
GR18.11.2022
PT19.12.2022
Former [2023/10]FI17.08.2022
HR17.08.2022
LT17.08.2022
LV17.08.2022
NL17.08.2022
RS17.08.2022
SE17.08.2022
NO17.11.2022
GR18.11.2022
PT19.12.2022
Former [2023/09]FI17.08.2022
LT17.08.2022
LV17.08.2022
NL17.08.2022
RS17.08.2022
SE17.08.2022
NO17.11.2022
PT19.12.2022
Former [2023/08]FI17.08.2022
LT17.08.2022
NL17.08.2022
RS17.08.2022
SE17.08.2022
NO17.11.2022
Cited inInternational search[Y]US6045575  (ROSEN DANIELLE [US], et al) [Y] 5,6,14 * column 4, paragraphs 29-38; figure - *;
 [Y]US2003194831  (NG KEE YEAN [MY], et al) [Y] 13-15* paragraph [0057]; claim - *;
 [Y]US2010065873  (BHATTACHARYA RABIN [NL], et al) [Y] 1-15 * paragraphs [0037] - [0084]; figure 1 *;
 [Y]US2013027963  (VAN HERPEN MAARTEN MARINUS JOHANNES WILHELMUS [NL], et al) [Y] 4 * paragraphs [0084] - [0089]; figures 4a-d *;
 [XY]US2013111744  (TISCHLER MICHAEL A [US], et al) [X] 1,3,7-11 * paragraphs [0091] - [0101]; figure 6B * [Y] 1-15;
 [Y]US2014334113  (VAN OS JACOBUS PETRUS JOHANNES [NL], et al) [Y] 4-6,14 * paragraphs [0054] - [0056]; figure 4a *;
 [Y]US2016240517  (KIM CHISUN [KR], et al) [Y] 1-15 * paragraphs [0045] - [0048]; figure - *
ExaminationUS2017040306
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.