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Extract from the Register of European Patents

EP About this file: EP3672744

EP3672744 - SUPERPLASTIC FORMING AND DIFFUSION BONDING PROCESS [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  29.03.2024
Database last updated on 18.11.2024
FormerThe patent has been granted
Status updated on  21.04.2023
FormerGrant of patent is intended
Status updated on  04.01.2023
FormerRequest for examination was made
Status updated on  29.05.2020
FormerThe international publication has been made
Status updated on  02.03.2019
Formerunknown
Status updated on  21.08.2018
Most recent event   Tooltip15.11.2024Lapse of the patent in a contracting state
New state(s): BG		published on 18.12.2024 [2024/51]
Applicant(s)For all designated states
BAE Systems PLC
6 Carlton Gardens
London SW1Y 5AD / GB
[2020/27]
Inventor(s)01 / AINSWORTH, Paul
BAE SYSTEMS
Samlesbury Aerodrome
Balderston Lancashire BB2 7LF / GB
 [2020/27]
Representative(s)BAE SYSTEMS plc Group IP Department
Warwick House
P.O. Box 87
Farnborough Aerospace Centre
Farnborough Hampshire GU14 6YU / GB
[2023/21]
Former [2020/27]BAE SYSTEMS plc Group IP Department
Farnborough Aerospace Centre
Farnborough
Hampshire GU14 6YU / GB
Application number, filing date18752617.310.08.2018
[2020/27]
WO2018GB52277
Priority number, dateGB2017001345522.08.2017         Original published format: GB 201713455
EP2017018730222.08.2017         Original published format: EP 17187302
[2020/27]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2019038517
Date:28.02.2019
Language:EN
[2019/09]
Type: A1 Application with search report 
No.:EP3672744
Date:01.07.2020
Language:EN
The application published by WIPO in one of the EPO official languages on 28.02.2019 takes the place of the publication of the European patent application.
[2020/27]
Type: B1 Patent specification 
No.:EP3672744
Date:24.05.2023
Language:EN
[2023/21]
Search report(s)International search report - published on:EP28.02.2019
ClassificationIPC:B21D53/78, B21D26/055, B21D26/059, B21D47/00, B21D53/92
[2020/27]
CPC:
B21D26/055 (EP,US); B23K20/023 (US); B21D26/059 (EP,US);
B21D47/00 (EP,US); B21D53/78 (EP,US); B21D53/92 (EP);
B23K20/02 (US); B23K20/04 (US) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2023/16]
Former [2020/27]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:SUPERPLASTISCHE FORMUNG UND DIFFUSIONSSCHWEISSVERFAHREN[2020/27]
English:SUPERPLASTIC FORMING AND DIFFUSION BONDING PROCESS[2020/27]
French:FORMAGE SUPERPLASTIQUE ET PROCÉDÉ DE LIAISON PAR DIFFUSION[2023/03]
Former [2020/27]PROCÉDÉ DE FORMATION SUPERPLASTIQUE ET DE LIAISON PAR DIFFUSION
Entry into regional phase04.02.2020National basic fee paid 
04.02.2020Designation fee(s) paid 
04.02.2020Examination fee paid 
Examination procedure04.02.2020Examination requested  [2020/27]
04.02.2020Date on which the examining division has become responsible
24.09.2020Amendment by applicant (claims and/or description)
05.01.2023Communication of intention to grant the patent
06.04.2023Fee for grant paid
06.04.2023Fee for publishing/printing paid
06.04.2023Receipt of the translation of the claim(s)
Opposition(s)27.02.2024No opposition filed within time limit [2024/18]
Fees paidRenewal fee
28.08.2020Renewal fee patent year 03
26.08.2021Renewal fee patent year 04
25.08.2022Renewal fee patent year 05
Opt-out from the exclusive  Tooltip
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT24.05.2023
BG24.05.2023
CZ24.05.2023
DK24.05.2023
EE24.05.2023
FI24.05.2023
HR24.05.2023
LT24.05.2023
LV24.05.2023
MC24.05.2023
NL24.05.2023
PL24.05.2023
RO24.05.2023
RS24.05.2023
SE24.05.2023
SI24.05.2023
SK24.05.2023
SM24.05.2023
IE10.08.2023
LU10.08.2023
NO24.08.2023
GR25.08.2023
BE31.08.2023
CH31.08.2023
IS24.09.2023
PT25.09.2023
[2024/51]
Former [2024/36]AT24.05.2023
CZ24.05.2023
DK24.05.2023
EE24.05.2023
FI24.05.2023
HR24.05.2023
LT24.05.2023
LV24.05.2023
MC24.05.2023
NL24.05.2023
PL24.05.2023
RO24.05.2023
RS24.05.2023
SE24.05.2023
SI24.05.2023
SK24.05.2023
SM24.05.2023
IE10.08.2023
LU10.08.2023
NO24.08.2023
GR25.08.2023
BE31.08.2023
CH31.08.2023
IS24.09.2023
PT25.09.2023
Former [2024/33]AT24.05.2023
CZ24.05.2023
DK24.05.2023
EE24.05.2023
FI24.05.2023
HR24.05.2023
LT24.05.2023
LV24.05.2023
MC24.05.2023
NL24.05.2023
PL24.05.2023
RO24.05.2023
RS24.05.2023
SE24.05.2023
SI24.05.2023
SK24.05.2023
SM24.05.2023
IE10.08.2023
LU10.08.2023
NO24.08.2023
GR25.08.2023
CH31.08.2023
IS24.09.2023
PT25.09.2023
Former [2024/24]AT24.05.2023
CZ24.05.2023
DK24.05.2023
EE24.05.2023
FI24.05.2023
HR24.05.2023
LT24.05.2023
LV24.05.2023
MC24.05.2023
NL24.05.2023
PL24.05.2023
RO24.05.2023
RS24.05.2023
SE24.05.2023
SI24.05.2023
SK24.05.2023
SM24.05.2023
LU10.08.2023
NO24.08.2023
GR25.08.2023
CH31.08.2023
IS24.09.2023
PT25.09.2023
Former [2024/21]AT24.05.2023
CZ24.05.2023
DK24.05.2023
EE24.05.2023
FI24.05.2023
HR24.05.2023
LT24.05.2023
LV24.05.2023
MC24.05.2023
NL24.05.2023
PL24.05.2023
RO24.05.2023
RS24.05.2023
SE24.05.2023
SK24.05.2023
SM24.05.2023
LU10.08.2023
NO24.08.2023
GR25.08.2023
IS24.09.2023
PT25.09.2023
Former [2024/16]AT24.05.2023
CZ24.05.2023
DK24.05.2023
EE24.05.2023
FI24.05.2023
HR24.05.2023
LT24.05.2023
LV24.05.2023
MC24.05.2023
NL24.05.2023
PL24.05.2023
RO24.05.2023
RS24.05.2023
SE24.05.2023
SK24.05.2023
SM24.05.2023
NO24.08.2023
GR25.08.2023
IS24.09.2023
PT25.09.2023
Former [2024/10]AT24.05.2023
CZ24.05.2023
DK24.05.2023
EE24.05.2023
FI24.05.2023
HR24.05.2023
LT24.05.2023
LV24.05.2023
NL24.05.2023
PL24.05.2023
RO24.05.2023
RS24.05.2023
SE24.05.2023
SK24.05.2023
SM24.05.2023
NO24.08.2023
GR25.08.2023
IS24.09.2023
PT25.09.2023
Former [2024/08]AT24.05.2023
FI24.05.2023
HR24.05.2023
LT24.05.2023
LV24.05.2023
NL24.05.2023
PL24.05.2023
RS24.05.2023
SE24.05.2023
SK24.05.2023
SM24.05.2023
NO24.08.2023
GR25.08.2023
IS24.09.2023
PT25.09.2023
Former [2024/03]AT24.05.2023
FI24.05.2023
HR24.05.2023
LT24.05.2023
LV24.05.2023
NL24.05.2023
PL24.05.2023
RS24.05.2023
SE24.05.2023
NO24.08.2023
GR25.08.2023
IS24.09.2023
PT25.09.2023
Former [2024/01]AT24.05.2023
HR24.05.2023
LT24.05.2023
LV24.05.2023
NL24.05.2023
PL24.05.2023
RS24.05.2023
SE24.05.2023
NO24.08.2023
GR25.08.2023
IS24.09.2023
PT25.09.2023
Former [2023/51]AT24.05.2023
HR24.05.2023
NL24.05.2023
PL24.05.2023
RS24.05.2023
SE24.05.2023
NO24.08.2023
GR25.08.2023
IS24.09.2023
PT25.09.2023
Former [2023/50]AT24.05.2023
NL24.05.2023
PL24.05.2023
SE24.05.2023
NO24.08.2023
GR25.08.2023
IS24.09.2023
PT25.09.2023
Former [2023/48]AT24.05.2023
NL24.05.2023
SE24.05.2023
NO24.08.2023
PT25.09.2023
Former [2023/46]PT25.09.2023
Cited inInternational search[XDA]US4304821  (HAYASE MASASHI, et al) [XD] 15 * figures 1-7 *[A] 1-14;
 [XDA]US5994666  (BULDHAUPT FREDERICK W [US], et al) [XD] 15 * figures 1,11A-11E * [A] 1-14;
 [XA]EP1455965  (BAE SYSTEMS PLC [GB]) [X] 15 * figure 1 * [A] 1-14
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.