EP3480244 - RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, PREPREG USING SAME, AND METAL FOIL LAMINATED PLATE [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 03.09.2021 Database last updated on 03.09.2024 | |
Former | The patent has been granted Status updated on 25.09.2020 | ||
Former | Grant of patent is intended Status updated on 31.08.2020 | ||
Former | Request for examination was made Status updated on 05.04.2019 | ||
Former | The international publication has been made Status updated on 29.09.2018 | Most recent event Tooltip | 03.05.2024 | Lapse of the patent in a contracting state New state(s): MK | published on 05.06.2024 [2024/23] | Applicant(s) | For all designated states LG Chem, Ltd. 128, Yeoui-daero Yeongdeungpo-gu Seoul 07336 / KR | [2019/19] | Inventor(s) | 01 /
SHIM, Chang Bo LG Chem Research Park 188 Munji-ro Yuseong-gu Daejeon34122 / KR | 02 /
SHIM, Hee Yong LG Chem Research Park 188 Munji-ro Yuseong-gu Daejeon 34122 / KR | 03 /
MIN, Hyun Sung LG Chem Research Park 188 Munji-ro Yuseong-gu Daejeon 34122 / KR | 04 /
KIM, Young Chan LG Chem Research Park 188 Munji-ro Yuseong-gu Daejeon 34122 / KR | 05 /
SONG, Seung Hyun LG Chem Research Park 188 Munji-ro Yuseong-gu Daejeon 34122 / KR | [2019/19] | Representative(s) | Goddar, Heinz J. Boehmert & Boehmert Anwaltspartnerschaft mbB Pettenkoferstrasse 22 80336 München / DE | [2019/19] | Application number, filing date | 18770850.8 | 08.03.2018 | [2019/19] | WO2018KR02779 | Priority number, date | KR20170036104 | 22.03.2017 Original published format: KR 20170036104 | KR20180018018 | 13.02.2018 Original published format: KR 20180018018 | [2019/19] | Filing language | KO | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2018174446 | Date: | 27.09.2018 | Language: | KO | [2018/39] | Type: | A1 Application with search report | No.: | EP3480244 | Date: | 08.05.2019 | Language: | EN | [2019/19] | Type: | B1 Patent specification | No.: | EP3480244 | Date: | 28.10.2020 | Language: | EN | [2020/44] | Search report(s) | International search report - published on: | KR | 27.09.2018 | (Supplementary) European search report - dispatched on: | EP | 30.08.2019 | Classification | IPC: | C08K5/17, C08J5/24, C08J5/04, C08K3/013, C08K9/06, B32B15/14 | [2019/19] | CPC: |
C08K5/17 (EP,KR,US);
C08L63/00 (US);
B32B15/14 (EP,KR,US);
C08J5/04 (KR);
C08J5/24 (KR);
C08J5/244 (EP,US);
C08J5/249 (EP,US);
C08K3/013 (EP,KR,US);
C08K5/0025 (EP,KR,US);
C08K9/06 (EP,KR,US);
H01L23/145 (US);
H01L23/49822 (US);
H01L23/562 (US);
B32B2260/046 (US);
B32B2262/101 (US);
B32B2457/00 (US);
C08J2363/00 (EP,KR,US);
C08J2463/00 (US);
C08J2479/04 (EP,US);
C08J2479/08 (US);
C08K2201/005 (KR);
C08K2201/011 (KR);
C08K3/36 (EP,US);
C08L2203/20 (US);
| C-Set: |
C08K3/013, C08L63/00 (US,EP);
C08K3/013, C08L79/00 (US,EP);
C08K5/17, C08L63/00 (EP,US);
C08K5/17, C08L79/00 (US,EP) | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2019/19] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | HARZZUSAMMENSETZUNG FÜR HALBLEITERGEHÄUSE, PREPREG MIT VERWENDUNG DAVON UND METALLFOLIENLAMINATPLATTE | [2019/19] | English: | RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, PREPREG USING SAME, AND METAL FOIL LAMINATED PLATE | [2019/19] | French: | COMPOSITION DE RÉSINE POUR BOÎTIER DE SEMI-CONDUCTEUR, PRÉIMPREGNÉ L'UTILISANT ET PLAQUE STRATIFIÉE DE FEUILLE MÉTALLIQUE | [2019/19] | Entry into regional phase | 01.02.2019 | Translation filed | 01.02.2019 | National basic fee paid | 01.02.2019 | Search fee paid | 01.02.2019 | Designation fee(s) paid | 01.02.2019 | Examination fee paid | Examination procedure | deleted | Date on which the examining division has become responsible | 01.02.2019 | Examination requested [2019/19] | 28.02.2020 | Amendment by applicant (claims and/or description) | 01.09.2020 | Communication of intention to grant the patent | 22.09.2020 | Fee for grant paid | 22.09.2020 | Fee for publishing/printing paid | 22.09.2020 | Receipt of the translation of the claim(s) | Opposition(s) | 29.07.2021 | No opposition filed within time limit [2021/40] | Fees paid | Renewal fee | 24.03.2020 | Renewal fee patent year 03 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 08.03.2018 | AL | 28.10.2020 | AT | 28.10.2020 | CY | 28.10.2020 | CZ | 28.10.2020 | DK | 28.10.2020 | EE | 28.10.2020 | ES | 28.10.2020 | FI | 28.10.2020 | HR | 28.10.2020 | IT | 28.10.2020 | LT | 28.10.2020 | LV | 28.10.2020 | MC | 28.10.2020 | MK | 28.10.2020 | NL | 28.10.2020 | PL | 28.10.2020 | RO | 28.10.2020 | RS | 28.10.2020 | SE | 28.10.2020 | SI | 28.10.2020 | SK | 28.10.2020 | SM | 28.10.2020 | BG | 28.01.2021 | NO | 28.01.2021 | GR | 29.01.2021 | IS | 28.02.2021 | PT | 01.03.2021 | IE | 08.03.2021 | LU | 08.03.2021 | BE | 31.03.2021 | CH | 31.03.2021 | LI | 31.03.2021 | [2024/23] |
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Former [2021/20] | FI | 28.10.2020 | Documents cited: | Search | [A]JP2013104029 (SUMITOMO BAKELITE CO) [A] 1-13 * paragraphs [0002] - [0004] - [0006] , [0040] , [0047]; example 5 *; | [XPA]US2017283672 (INOUE AKINORI [JP], et al) [XP] 1,3-13 * paragraphs [0011] - [0017] - [0 66] - [0076] - [0 99] - [0116]; examples 1-6; table 1 * [A] 2; | [E]EP3480245 (LG CHEMICAL LTD [KR]) [E] 1-13 * examples 1-5; claims 1-14; table 1 *; | [A] - LAZA J M ET AL, "Thermal scanning rheometer analysis of curing kinetic of an epoxy resin: 2. An amine as curing agent", POLYMER, ELSEVIER SCIENCE PUBLISHERS B.V, GB, (19990101), vol. 40, no. 1, doi:10.1016/S0032-3861(98)00217-1, ISSN 0032-3861, pages 35 - 45, XP004145540 [A] 1-13 * the whole document * DOI: http://dx.doi.org/10.1016/S0032-3861(98)00217-1 | International search | [X]JP2002121358 (SUMITOMO BAKELITE CO) [X] 1-13 * See claims 1, 8, 9; paragraph [0021]. *; | [X]JP2002249753 (TORAY INDUSTRIES) [X] 1-13 * See claims 1-6: paragraphs [0025], [0028]-[0030], [0050], [0056]; tables 1, 2. *; | [X]JP2006303119 (KYOCERA CHEM CORP) [X] 1-13* See claim 8; paragraphs [0020], [0053]. *; | [X]KR20140087015 (HITACHI CHEMICAL CO LTD [JP]) [X] 1-13 * See claims 1, 3, 6, 7, 17-19, paragraphs [0191], [0195], [0254]-[0257], [0376]. *; | [X]WO2016017751 (NIPPON KAYAKU KK [JP]) [X] 1-13 * See claims 1, 2, 5; paragraphs [0023], [0024], [0028], [0033], [0050]. * |