EP3646369 - MULTI-LAYER CIRCUIT BOARD USING INTERPOSER LAYER AND CONDUCTIVE PASTE [Right-click to bookmark this link] | Status | The patent has been granted Status updated on 20.06.2024 Database last updated on 02.11.2024 | |
Former | Grant of patent is intended Status updated on 20.02.2024 | ||
Former | Request for examination was made Status updated on 03.04.2020 | ||
Former | The international publication has been made Status updated on 04.01.2019 | Most recent event Tooltip | 20.06.2024 | (Expected) grant | published on 24.07.2024 [2024/30] | Applicant(s) | For all designated states Catlam LLC 1108 W. Evelyn Ave. Sunnyvale, CA 94086 / US | [2020/29] |
Former [2020/19] | For all designated states Sierra Circuits Inc. 1108 W. Evelyn Sunnyvale, CA 94086 / US | Inventor(s) | 01 /
BAHL, Kenneth S. 1108 W. Evelyn Ave. Sunnyvale California 94086 / US | 02 /
KARAVAKIS, Konstantine 1108 West Evelyn Ave. Sunnyvale California 94086 / US | [2020/19] | Representative(s) | Schneider, Andreas Oberer Markt 26 92318 Neumarkt i.d.OPf. / DE | [2020/19] | Application number, filing date | 18824491.7 | 28.06.2018 | [2020/19] | WO2018US39906 | Priority number, date | US201715635201 | 28.06.2017 Original published format: US201715635201 | [2020/19] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2019006063 | Date: | 03.01.2019 | Language: | EN | [2019/01] | Type: | A1 Application with search report | No.: | EP3646369 | Date: | 06.05.2020 | Language: | EN | The application published by WIPO in one of the EPO official languages on 03.01.2019 takes the place of the publication of the European patent application. | [2020/19] | Type: | B1 Patent specification | No.: | EP3646369 | Date: | 24.07.2024 | Language: | EN | [2024/30] | Search report(s) | International search report - published on: | US | 03.01.2019 | (Supplementary) European search report - dispatched on: | EP | 18.02.2021 | Classification | IPC: | H05K3/18, H05K3/46, // H05K3/40, H05K3/42 | [2024/09] | CPC: |
H05K3/181 (EP,KR,US);
H05K1/115 (EP,KR,US);
H05K1/0313 (KR,US);
H05K1/095 (KR,US);
H05K1/111 (KR,US);
H05K3/06 (KR,US);
H05K3/425 (KR,US);
H05K3/462 (KR,US);
H05K3/4623 (EP,KR,US);
H05K2201/0236 (EP);
H05K2201/09572 (EP,KR,US);
H05K2201/10378 (KR,US);
H05K2203/068 (KR,US);
H05K2203/085 (KR,US);
H05K3/4069 (EP);
H05K3/4626 (EP)
(-)
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Former IPC [2021/12] | H01L21/02, H01L21/48, H01L23/14, H01L51/00, H05K1/09, H05K3/46, H05K3/18, H05K3/40 | ||
Former IPC [2020/19] | H01L21/02, H01L21/48, H01L23/14, H01L51/00, H05K1/09, H05K3/46 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2020/19] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | MEHRSCHICHTIGE LEITERPLATTE MIT ZWISCHENSCHICHT UND LEITFÄHIGER PASTE | [2020/19] | English: | MULTI-LAYER CIRCUIT BOARD USING INTERPOSER LAYER AND CONDUCTIVE PASTE | [2020/19] | French: | CARTE DE CIRCUIT IMPRIMÉ MULTICOUCHE UTILISANT UNE COUCHE D'INTERPOSEUR ET UNE PÂTE CONDUCTRICE | [2020/19] | Entry into regional phase | 24.01.2020 | National basic fee paid | 24.01.2020 | Search fee paid | 24.01.2020 | Designation fee(s) paid | 24.01.2020 | Examination fee paid | Examination procedure | 27.01.2020 | Examination requested [2020/19] | 08.09.2021 | Amendment by applicant (claims and/or description) | 21.02.2024 | Communication of intention to grant the patent | 11.06.2024 | Fee for grant paid | 11.06.2024 | Fee for publishing/printing paid | 11.06.2024 | Receipt of the translation of the claim(s) | Fees paid | Renewal fee | 09.06.2020 | Renewal fee patent year 03 | 20.04.2021 | Renewal fee patent year 04 | 08.04.2022 | Renewal fee patent year 05 | 05.05.2023 | Renewal fee patent year 06 | 11.06.2024 | Renewal fee patent year 07 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]US3600330 (SCHNEBLE FREDERICK W JR, et al); | [Y]JPS5792895 (NIPPON TELEGRAPH & TELEPHONE, et al); | [Y]JPH07142867 (MURATA MANUFACTURING CO) | International search | [A]US2002079135 (YAZAKI YOSHITAROU [JP], et al); | [A]US2004201396 (PIERSON MARK VINCENT [US], et al); | [A]US2005017369 (CLAYTON GARY [US], et al); | [A]US2005218524 (JAPP ROBERT M [US], et al); | [A]US7829990 (SCANLAN CHRISTOPHER M [US], et al) |