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Extract from the Register of European Patents

EP About this file: EP3646369

EP3646369 - MULTI-LAYER CIRCUIT BOARD USING INTERPOSER LAYER AND CONDUCTIVE PASTE [Right-click to bookmark this link]
StatusThe patent has been granted
Status updated on  20.06.2024
Database last updated on 02.11.2024
FormerGrant of patent is intended
Status updated on  20.02.2024
FormerRequest for examination was made
Status updated on  03.04.2020
FormerThe international publication has been made
Status updated on  04.01.2019
Most recent event   Tooltip20.06.2024(Expected) grantpublished on 24.07.2024  [2024/30]
Applicant(s)For all designated states
Catlam LLC
1108 W. Evelyn Ave.
Sunnyvale, CA 94086 / US
[2020/29]
Former [2020/19]For all designated states
Sierra Circuits Inc.
1108 W. Evelyn
Sunnyvale, CA 94086 / US
Inventor(s)01 / BAHL, Kenneth S.
1108 W. Evelyn Ave.
Sunnyvale California 94086 / US
02 / KARAVAKIS, Konstantine
1108 West Evelyn Ave.
Sunnyvale California 94086 / US
 [2020/19]
Representative(s)Schneider, Andreas
Oberer Markt 26
92318 Neumarkt i.d.OPf. / DE
[2020/19]
Application number, filing date18824491.728.06.2018
[2020/19]
WO2018US39906
Priority number, dateUS20171563520128.06.2017         Original published format: US201715635201
[2020/19]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2019006063
Date:03.01.2019
Language:EN
[2019/01]
Type: A1 Application with search report 
No.:EP3646369
Date:06.05.2020
Language:EN
The application published by WIPO in one of the EPO official languages on 03.01.2019 takes the place of the publication of the European patent application.
[2020/19]
Type: B1 Patent specification 
No.:EP3646369
Date:24.07.2024
Language:EN
[2024/30]
Search report(s)International search report - published on:US03.01.2019
(Supplementary) European search report - dispatched on:EP18.02.2021
ClassificationIPC:H05K3/18, H05K3/46, // H05K3/40, H05K3/42
[2024/09]
CPC:
H05K3/181 (EP,KR,US); H05K1/115 (EP,KR,US); H05K1/0313 (KR,US);
H05K1/095 (KR,US); H05K1/111 (KR,US); H05K3/06 (KR,US);
H05K3/425 (KR,US); H05K3/462 (KR,US); H05K3/4623 (EP,KR,US);
H05K2201/0236 (EP); H05K2201/09572 (EP,KR,US); H05K2201/10378 (KR,US);
H05K2203/068 (KR,US); H05K2203/085 (KR,US); H05K3/4069 (EP);
H05K3/4626 (EP) (-)
Former IPC [2021/12]H01L21/02, H01L21/48, H01L23/14, H01L51/00, H05K1/09, H05K3/46, H05K3/18, H05K3/40
Former IPC [2020/19]H01L21/02, H01L21/48, H01L23/14, H01L51/00, H05K1/09, H05K3/46
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/19]
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:MEHRSCHICHTIGE LEITERPLATTE MIT ZWISCHENSCHICHT UND LEITFÄHIGER PASTE[2020/19]
English:MULTI-LAYER CIRCUIT BOARD USING INTERPOSER LAYER AND CONDUCTIVE PASTE[2020/19]
French:CARTE DE CIRCUIT IMPRIMÉ MULTICOUCHE UTILISANT UNE COUCHE D'INTERPOSEUR ET UNE PÂTE CONDUCTRICE[2020/19]
Entry into regional phase24.01.2020National basic fee paid 
24.01.2020Search fee paid 
24.01.2020Designation fee(s) paid 
24.01.2020Examination fee paid 
Examination procedure27.01.2020Examination requested  [2020/19]
08.09.2021Amendment by applicant (claims and/or description)
21.02.2024Communication of intention to grant the patent
11.06.2024Fee for grant paid
11.06.2024Fee for publishing/printing paid
11.06.2024Receipt of the translation of the claim(s)
Fees paidRenewal fee
09.06.2020Renewal fee patent year 03
20.04.2021Renewal fee patent year 04
08.04.2022Renewal fee patent year 05
05.05.2023Renewal fee patent year 06
11.06.2024Renewal fee patent year 07
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Documents cited:Search[Y]US3600330  (SCHNEBLE FREDERICK W JR, et al);
 [Y]JPS5792895  (NIPPON TELEGRAPH & TELEPHONE, et al);
 [Y]JPH07142867  (MURATA MANUFACTURING CO)
International search[A]US2002079135  (YAZAKI YOSHITAROU [JP], et al);
 [A]US2004201396  (PIERSON MARK VINCENT [US], et al);
 [A]US2005017369  (CLAYTON GARY [US], et al);
 [A]US2005218524  (JAPP ROBERT M [US], et al);
 [A]US7829990  (SCANLAN CHRISTOPHER M [US], et al)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.