EP3679599 - HIGH DENSITY MULTI-COMPONENT AND SERIAL PACKAGES [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 12.06.2020 Database last updated on 31.08.2024 | |
Former | The international publication has been made Status updated on 16.03.2019 | Most recent event Tooltip | 24.07.2024 | Change - representative | Applicant(s) | For all designated states Kemet Electronics Corporation 1 East Broward Blvd., 2nd. Floor Fort Lauderdale, FL 33301 / US | [2020/29] | Inventor(s) | 01 /
BURK, James, A. 2835 Kemet Way Simpsonville SC 29681 / US | 02 /
BULTITUDE, John 2835 Kemet Way Simpsonville SC 29681 / US | 03 /
MILLER, Galen, W. 2835 Kemet Way Simpsonville SC 29681 / US | 04 /
MCCONNELL, John, E. 626 Hawley Road Blountville TN 37617 / US | [2020/29] | Representative(s) | Reddie & Grose LLP The White Chapel Building 10 Whitechapel High Street London E1 8QS / GB | [N/P] |
Former [2020/29] | Goodman, Simon John Nye Reddie & Grose LLP The White Chapel Building 10 Whitechapel High Street London E1 8QS / GB | Application number, filing date | 18853638.7 | 10.09.2018 | [2020/29] | WO2018US50142 | Priority number, date | US201715699654 | 08.09.2017 Original published format: US201715699654 | US201715804515 | 06.11.2017 Original published format: US201715804515 | US201715852799 | 22.12.2017 Original published format: US201715852799 | [2020/29] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2019051346 | Date: | 14.03.2019 | Language: | EN | [2019/11] | Type: | A1 Application with search report | No.: | EP3679599 | Date: | 15.07.2020 | Language: | EN | The application published by WIPO in one of the EPO official languages on 14.03.2019 takes the place of the publication of the European patent application. | [2020/29] | Search report(s) | International search report - published on: | US | 14.03.2019 | (Supplementary) European search report - dispatched on: | EP | 23.04.2021 | Classification | IPC: | H01L21/822, H01L21/8224, H01G4/232, H01G4/38, H01L23/64, H01L25/10, H01L25/16, H01G2/06, H01G4/224, H01G4/30, H01G4/40, H01L23/00, H05K1/14, H05K1/18, H01L25/065 | [2021/21] | CPC: |
H01L25/0657 (EP);
H01G2/06 (EP);
H01G4/224 (EP);
H01G4/232 (EP);
H01G4/30 (EP);
H01G4/38 (EP);
H01G4/40 (EP);
H01L23/642 (EP);
H01L24/05 (EP);
H01L24/13 (EP);
H01L24/14 (EP);
H01L24/16 (EP);
H01L24/17 (EP);
H01L24/32 (EP);
H01L24/48 (EP);
H01L24/50 (EP);
H01L24/73 (EP);
H01L25/0652 (EP);
H01L25/10 (EP);
H01L25/16 (EP);
H05K1/141 (EP);
H05K1/147 (EP);
H05K1/181 (EP);
H01L2224/0401 (EP);
H01L2224/04026 (EP);
H01L2224/131 (EP);
H01L2224/1329 (EP);
H01L2224/133 (EP);
H01L2224/13562 (EP);
H01L2224/1369 (EP);
H01L2224/14517 (EP);
H01L2224/16058 (EP);
H01L2224/16105 (EP);
H01L2224/16145 (EP);
H01L2224/16225 (EP);
H01L2224/16227 (EP);
H01L2224/16235 (EP);
H01L2224/16265 (EP);
H01L2224/16267 (EP);
H01L2224/17181 (EP);
H01L2224/17183 (EP);
H01L2224/29021 (EP);
H01L2224/32013 (EP);
H01L2224/32105 (EP);
H01L2224/32106 (EP);
H01L2224/32147 (EP);
H01L2224/32148 (EP);
H01L2224/32227 (EP);
H01L2224/32237 (EP);
H01L2224/32257 (EP);
H01L2224/32268 (EP);
H01L2224/48227 (EP);
H01L2224/48477 (EP);
H01L2224/73203 (EP);
H01L2224/73253 (EP);
H01L2224/81825 (EP);
H01L2224/8184 (EP);
H01L2224/81895 (EP);
H01L2224/8385 (EP);
H01L2224/83862 (EP);
H01L2224/83874 (EP);
H01L2224/83877 (EP);
H01L2225/0651 (EP);
H01L2225/06513 (EP);
H01L2225/06517 (EP);
H01L2225/06572 (EP);
H01L24/29 (EP);
H01L2924/00014 (EP);
H01L2924/10155 (EP);
H01L2924/15159 (EP);
H05K2201/10515 (EP);
H05K2201/1053 (EP);
H05K2201/10636 (EP)
(-)
| C-Set: |
H01L2224/131, H01L2924/014 (EP);
H01L2224/1329, H01L2924/00014 (EP);
H01L2224/133, H01L2924/014 (EP);
H01L2224/16225, H01L2924/00012 (EP);
H01L2224/73203, H01L2924/00012 (EP);
H01L2224/81825, H01L2924/00014 (EP);
H01L2224/8184, H01L2924/00014 (EP);
H01L2224/81895, H01L2924/00014 (EP);
H01L2224/8385, H01L2924/0782 (EP);
H01L2224/83862, H01L2924/00014 (EP);
H01L2224/83874, H01L2924/00014 (EP);
H01L2224/83877, H01L2924/00014 (EP); |
Former IPC [2020/29] | H01L21/822, H01L21/8224, H01G4/232, H01G4/38 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2020/29] | Title | German: | HOCHDICHTE MEHRKOMPONENTEN- UND SERIENVERPACKUNGEN | [2020/29] | English: | HIGH DENSITY MULTI-COMPONENT AND SERIAL PACKAGES | [2020/29] | French: | BOÎTIERS MULTI-COMPOSANTS DE HAUTE DENSITÉ EN SÉRIE | [2020/29] | Entry into regional phase | 09.03.2020 | National basic fee paid | 09.03.2020 | Search fee paid | 09.03.2020 | Designation fee(s) paid | 09.03.2020 | Examination fee paid | Examination procedure | 03.07.2019 | Request for preliminary examination filed International Preliminary Examining Authority: US | 09.03.2020 | Examination requested [2020/29] | 10.11.2021 | Amendment by applicant (claims and/or description) | Fees paid | Renewal fee | 31.03.2020 | Renewal fee patent year 03 | 30.11.2021 | Renewal fee patent year 04 | 18.07.2022 | Renewal fee patent year 05 | 24.08.2023 | Renewal fee patent year 06 | 11.07.2024 | Renewal fee patent year 07 | Penalty fee | Additional fee for renewal fee | 30.09.2021 | 04   M06   Fee paid on   30.11.2021 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US2014002952 (MCCONNELL JOHN E [US], et al) [A] 1-18 * the whole document *; | [XI]US2016205769 (PARK SANG SOO [KR], et al) [X] 1-3,5-13,15-18 * paragraphs [0009] , [0062] , [0075] - [0096] - [0117] , [0121]; figures 6,7,14 * [I] 4,14; | [A]US2017099727 (SON SOO HWAN [KR]) [A] 1-18* the whole document *; | [A]US2017169956 (MILLER GALEN W [US], et al) [A] 1-18 * the whole document * | International search | [Y]US2012309121 (YONEDA YOSHIHIRO [JP], et al) [Y] 6-19, 28, 33-37, 43-47, 49, 65-81, 89-98, 102-108 and 110 * ; figures 1, 5 and 6; paragraphs [0025, 0032, 0046, 0051-0053]. *; | [Y]US2013016488 (MCCONNELL JOHN E [US], et al) [Y] 38 and 100 * ; figures 37 and 38, paragraph [0077]. *; | [XY]JP2016162939 (OMRON TATEISI ELECTRONICS CO) [X] 1-5, 21-24, 26, 29-32, 40, 48, 60-64, 82-85, 87, 101 and 109 * ; Machine translation, figures 1 and 2; paragraph [0015, 0021, 0029-0034, 0037-0039, 0047, 0051-0054]. * [Y] 6-20, 25, 27-28, 33-39, 41-47, 49-59, 65-81, 86, 88-100, 102-108, 110; | [A]US2016366765 (MARTINEZ PAUL A [US], et al) [A] 1-110* ; entire document *; | [Y]US2017025223 (BULTITUDE JOHN [US], et al) [Y] 14-18, 20, 25, 27, 39, 41, 42, 50-59, 68, 69, 76-79, 81, 86, 88, and 99 * ; figures 1, 34-40; paragraphs [0032, 0059, 0063, 0067, 0117-0119]. * | by applicant | US2016205796 | US9472342 |