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Extract from the Register of European Patents

EP About this file: EP3679599

EP3679599 - HIGH DENSITY MULTI-COMPONENT AND SERIAL PACKAGES [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  12.06.2020
Database last updated on 31.08.2024
FormerThe international publication has been made
Status updated on  16.03.2019
Most recent event   Tooltip24.07.2024Change - representative 
Applicant(s)For all designated states
Kemet Electronics Corporation
1 East Broward Blvd., 2nd. Floor
Fort Lauderdale, FL 33301 / US
[2020/29]
Inventor(s)01 / BURK, James, A.
2835 Kemet Way
Simpsonville SC 29681 / US
02 / BULTITUDE, John
2835 Kemet Way
Simpsonville SC 29681 / US
03 / MILLER, Galen, W.
2835 Kemet Way
Simpsonville SC 29681 / US
04 / MCCONNELL, John, E.
626 Hawley Road
Blountville TN 37617 / US
 [2020/29]
Representative(s)Reddie & Grose LLP
The White Chapel Building
10 Whitechapel High Street
London E1 8QS / GB
[N/P]
Former [2020/29]Goodman, Simon John Nye
Reddie & Grose LLP The White Chapel Building
10 Whitechapel High Street
London E1 8QS / GB
Application number, filing date18853638.710.09.2018
[2020/29]
WO2018US50142
Priority number, dateUS20171569965408.09.2017         Original published format: US201715699654
US20171580451506.11.2017         Original published format: US201715804515
US20171585279922.12.2017         Original published format: US201715852799
[2020/29]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2019051346
Date:14.03.2019
Language:EN
[2019/11]
Type: A1 Application with search report 
No.:EP3679599
Date:15.07.2020
Language:EN
The application published by WIPO in one of the EPO official languages on 14.03.2019 takes the place of the publication of the European patent application.
[2020/29]
Search report(s)International search report - published on:US14.03.2019
(Supplementary) European search report - dispatched on:EP23.04.2021
ClassificationIPC:H01L21/822, H01L21/8224, H01G4/232, H01G4/38, H01L23/64, H01L25/10, H01L25/16, H01G2/06, H01G4/224, H01G4/30, H01G4/40, H01L23/00, H05K1/14, H05K1/18, H01L25/065
[2021/21]
CPC:
H01L25/0657 (EP); H01G2/06 (EP); H01G4/224 (EP);
H01G4/232 (EP); H01G4/30 (EP); H01G4/38 (EP);
H01G4/40 (EP); H01L23/642 (EP); H01L24/05 (EP);
H01L24/13 (EP); H01L24/14 (EP); H01L24/16 (EP);
H01L24/17 (EP); H01L24/32 (EP); H01L24/48 (EP);
H01L24/50 (EP); H01L24/73 (EP); H01L25/0652 (EP);
H01L25/10 (EP); H01L25/16 (EP); H05K1/141 (EP);
H05K1/147 (EP); H05K1/181 (EP); H01L2224/0401 (EP);
H01L2224/04026 (EP); H01L2224/131 (EP); H01L2224/1329 (EP);
H01L2224/133 (EP); H01L2224/13562 (EP); H01L2224/1369 (EP);
H01L2224/14517 (EP); H01L2224/16058 (EP); H01L2224/16105 (EP);
H01L2224/16145 (EP); H01L2224/16225 (EP); H01L2224/16227 (EP);
H01L2224/16235 (EP); H01L2224/16265 (EP); H01L2224/16267 (EP);
H01L2224/17181 (EP); H01L2224/17183 (EP); H01L2224/29021 (EP);
H01L2224/32013 (EP); H01L2224/32105 (EP); H01L2224/32106 (EP);
H01L2224/32147 (EP); H01L2224/32148 (EP); H01L2224/32227 (EP);
H01L2224/32237 (EP); H01L2224/32257 (EP); H01L2224/32268 (EP);
H01L2224/48227 (EP); H01L2224/48477 (EP); H01L2224/73203 (EP);
H01L2224/73253 (EP); H01L2224/81825 (EP); H01L2224/8184 (EP);
H01L2224/81895 (EP); H01L2224/8385 (EP); H01L2224/83862 (EP);
H01L2224/83874 (EP); H01L2224/83877 (EP); H01L2225/0651 (EP);
H01L2225/06513 (EP); H01L2225/06517 (EP); H01L2225/06572 (EP);
H01L24/29 (EP); H01L2924/00014 (EP); H01L2924/10155 (EP);
H01L2924/15159 (EP); H05K2201/10515 (EP); H05K2201/1053 (EP);
H05K2201/10636 (EP) (-)
C-Set:
H01L2224/131, H01L2924/014 (EP);
H01L2224/1329, H01L2924/00014 (EP);
H01L2224/133, H01L2924/014 (EP);
H01L2224/16225, H01L2924/00012 (EP);
H01L2224/73203, H01L2924/00012 (EP);
H01L2224/81825, H01L2924/00014 (EP);
H01L2224/8184, H01L2924/00014 (EP);
H01L2224/81895, H01L2924/00014 (EP);
H01L2224/8385, H01L2924/0782 (EP);
H01L2224/83862, H01L2924/00014 (EP);
H01L2224/83874, H01L2924/00014 (EP);
H01L2224/83877, H01L2924/00014 (EP);
H01L2924/00014, H01L2224/45099 (EP)
(-)
Former IPC [2020/29]H01L21/822, H01L21/8224, H01G4/232, H01G4/38
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/29]
TitleGerman:HOCHDICHTE MEHRKOMPONENTEN- UND SERIENVERPACKUNGEN[2020/29]
English:HIGH DENSITY MULTI-COMPONENT AND SERIAL PACKAGES[2020/29]
French:BOÎTIERS MULTI-COMPOSANTS DE HAUTE DENSITÉ EN SÉRIE[2020/29]
Entry into regional phase09.03.2020National basic fee paid 
09.03.2020Search fee paid 
09.03.2020Designation fee(s) paid 
09.03.2020Examination fee paid 
Examination procedure03.07.2019Request for preliminary examination filed
International Preliminary Examining Authority: US
09.03.2020Examination requested  [2020/29]
10.11.2021Amendment by applicant (claims and/or description)
Fees paidRenewal fee
31.03.2020Renewal fee patent year 03
30.11.2021Renewal fee patent year 04
18.07.2022Renewal fee patent year 05
24.08.2023Renewal fee patent year 06
11.07.2024Renewal fee patent year 07
Penalty fee
Additional fee for renewal fee
30.09.202104   M06   Fee paid on   30.11.2021
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]US2014002952  (MCCONNELL JOHN E [US], et al) [A] 1-18 * the whole document *;
 [XI]US2016205769  (PARK SANG SOO [KR], et al) [X] 1-3,5-13,15-18 * paragraphs [0009] , [0062] , [0075] - [0096] - [0117] , [0121]; figures 6,7,14 * [I] 4,14;
 [A]US2017099727  (SON SOO HWAN [KR]) [A] 1-18* the whole document *;
 [A]US2017169956  (MILLER GALEN W [US], et al) [A] 1-18 * the whole document *
International search[Y]US2012309121  (YONEDA YOSHIHIRO [JP], et al) [Y] 6-19, 28, 33-37, 43-47, 49, 65-81, 89-98, 102-108 and 110 * ; figures 1, 5 and 6; paragraphs [0025, 0032, 0046, 0051-0053]. *;
 [Y]US2013016488  (MCCONNELL JOHN E [US], et al) [Y] 38 and 100 * ; figures 37 and 38, paragraph [0077]. *;
 [XY]JP2016162939  (OMRON TATEISI ELECTRONICS CO) [X] 1-5, 21-24, 26, 29-32, 40, 48, 60-64, 82-85, 87, 101 and 109 * ; Machine translation, figures 1 and 2; paragraph [0015, 0021, 0029-0034, 0037-0039, 0047, 0051-0054]. * [Y] 6-20, 25, 27-28, 33-39, 41-47, 49-59, 65-81, 86, 88-100, 102-108, 110;
 [A]US2016366765  (MARTINEZ PAUL A [US], et al) [A] 1-110* ; entire document *;
 [Y]US2017025223  (BULTITUDE JOHN [US], et al) [Y] 14-18, 20, 25, 27, 39, 41, 42, 50-59, 68, 69, 76-79, 81, 86, 88, and 99 * ; figures 1, 34-40; paragraphs [0032, 0059, 0063, 0067, 0117-0119]. *
by applicantUS2016205796
 US9472342
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.