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Extract from the Register of European Patents

EP About this file: EP3513900

EP3513900 - SOLDER ALLOY FOR BONDING CU PIPES AND/OR FE PIPES, PREFORM SOLDER, RESIN FLUX CORED SOLDER, AND SOLDER JOINT [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  24.04.2020
Database last updated on 19.07.2024
FormerRequest for examination was made
Status updated on  21.06.2019
FormerThe international publication has been made
Status updated on  30.03.2019
Most recent event   Tooltip24.04.2020Withdrawal of applicationpublished on 27.05.2020  [2020/22]
Applicant(s)For all designated states
Senju Metal Industry Co., Ltd
23 Senju-Hashido-cho Adachi-ku
Tokyo 120-8555 / JP
[2019/30]
Inventor(s)01 / KAMEDA Naoto
c/o SENJU METAL INDUSTRY Co. Ltd.
23 Senju-Hashido-cho
Adachi-ku
Tokyo 120-8555 / JP
02 / MUNEKATA Osamu
c/o SENJU METAL INDUSTRY Co. Ltd.
23 Senju-Hashido-cho
Adachi-ku
Tokyo 120-8555 / JP
03 / TSURUTA Kaichi
c/o SENJU METAL INDUSTRY Co. Ltd.
23 Senju-Hashido-cho
Adachi-ku
Tokyo 120-8555 / JP
04 / SATO Isamu
c/o SENJU METAL INDUSTRY Co. Ltd.
23 Senju-Hashido-cho
Adachi-ku
Tokyo 120-8555 / JP
 [2019/30]
Representative(s)Grünecker Patent- und Rechtsanwälte PartG mbB
Leopoldstraße 4
80802 München / DE
[2019/30]
Application number, filing date18857692.007.06.2018
[2019/30]
WO2018JP21812
Priority number, dateJP2017018066020.09.2017         Original published format: JP 2017180660
[2019/30]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2019058650
Date:28.03.2019
Language:JA
[2019/13]
Type: A1 Application with search report 
No.:EP3513900
Date:24.07.2019
Language:EN
[2019/30]
Search report(s)International search report - published on:JP28.03.2019
(Supplementary) European search report - dispatched on:EP19.11.2019
ClassificationIPC:B23K35/26, B23K35/14, C22C13/00, C22C13/02, B23K35/00, B23K35/02
[2019/51]
CPC:
C22C13/00 (EP); B23K35/262 (EP,US); B23K35/007 (EP);
B23K35/0244 (EP,US); B23K35/0266 (EP); C22C13/02 (EP,US);
B23K2101/06 (EP); B23K2103/02 (EP); B23K2103/12 (EP);
B23K2103/22 (EP) (-)
Former IPC [2019/30]B23K35/26, B23K35/14, C22C13/00, C22C13/02
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2019/30]
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:LÖTLEGIERUNG ZUM VERBINDEN VON CU-ROHREN UND/ODER FE-ROHREN, VORFORMLOT, HARZFLUSSMITTELGEFÜLLTES LOT UND LÖTVERBINDUNG[2019/30]
English:SOLDER ALLOY FOR BONDING CU PIPES AND/OR FE PIPES, PREFORM SOLDER, RESIN FLUX CORED SOLDER, AND SOLDER JOINT[2019/30]
French:ALLIAGE DE BRASURE DESTINÉ À LIER DES TUYAUX DE CU ET/OU DES TUYAUX DE FE, BRASURE DE PRÉFORME, BRASURE FOURRÉE DE FLUX DE RÉSINE ET JOINT DE BRASURE[2019/30]
Entry into regional phase17.04.2019Translation filed 
17.04.2019National basic fee paid 
17.04.2019Search fee paid 
17.04.2019Designation fee(s) paid 
17.04.2019Examination fee paid 
Examination procedure17.04.2019Examination requested  [2019/30]
21.04.2020Application withdrawn by applicant  [2020/22]
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Documents cited:Search[A]US4758407  (BALLENTINE RICHARD E [US], et al) [A] 1* example E; claims 1,9 *;
 [A]US2006263234  (SEELIG KARL F [US]) [A] 1 * paragraph [0019] *;
 [A]EP3112080  (KOKI KK [JP]) [A] 1 * claims 1-5 *;
 [XA]EP3127652  (SENJU METAL INDUSTRY CO [JP]) [X] 1-5 * paragraphs [0040] , [0041] , [0054] - [0056]; example 1; table 1 * [A] 6-8
International search[A]WO2012128356  (SENJU METAL INDUSTRY CO [JP], et al) [A] 1-8 * & US 2014/0141273 A1 & WO 2012/127642 A1 & EP 2689885 A1 & TW 201343312 A & CN 103561903 A & KR 10-2014-0044801 A & TW 201706068 A & BR 112013024398 A2 *;
 [A]WO2012141331  (NIHON SUPERIOR CO LTD [JP], et al) [A] 1-8* & US 2014/0037369 A1 & EP 2698225 A1 & CN 103476541 A *;
 [A]WO2014084242  (NIHON SUPERIOR CO LTD [JP]) [A] 1-8 * (Family: none) *;
 [A]WO2015152387  (SENJU METAL INDUSTRY CO [JP]) [A] 1-8 * & US 2017/0014955 A1 & EP 3127652 A1 & EP 3278920 A1 & CN 106163732 A & CN 108311812 A *;
 [A]WO2016052124  (MURATA MANUFACTURING CO [JP]) [A] 1-8 * (Family: none) *
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