blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...
blank Related links

Extract from the Register of European Patents

EP About this file: EP3734467

EP3734467 - DATA PROCESSING DEVICE, DATA PROCESSING METHOD, AND RECORDING MEDIUM [Right-click to bookmark this link]
Former [2020/45]DATA PROCESSING DEVICE, DATA PROCESSING METHOD, AND PROGRAM
[2024/17]
StatusThe patent has been granted
Status updated on  29.03.2024
Database last updated on 24.08.2024
FormerGrant of patent is intended
Status updated on  04.12.2023
FormerExamination is in progress
Status updated on  01.07.2022
FormerRequest for examination was made
Status updated on  02.10.2020
FormerThe international publication has been made
Status updated on  05.07.2019
Most recent event   Tooltip29.03.2024(Expected) grantpublished on 01.05.2024  [2024/18]
Applicant(s)For all designated states
Tokyo Electron Limited
Akasaka Biz Tower
3-1, Akasaka 5-chome
107-6325 Minato-ku, Tokyo / JP
[2020/45]
Inventor(s)01 / SUZUKI, Atsushi
c/o Tokyo Electron Limited, 2F, Ohdori Bus-Center
Bldg. No.1, Minami 1-jo Higashi 1-chome, Chuo-ku
Sapporo City, Hokkaido 0600051 / JP
02 / KATO, Takahiko
c/o Tokyo Electron Miyagi Limited, 1 Techno Hills
Taiwa-cho
Kurokawa-gun, Miyagi 9813629 / JP
 [2020/45]
Representative(s)Diehl & Partner
Patent- und Rechtsanwaltskanzlei mbB
Erika-Mann-Straße 9
80636 München / DE
[2020/45]
Application number, filing date18893557.125.12.2018
[2020/45]
WO2018JP47519
Priority number, dateJP2017025369428.12.2017         Original published format: JP 2017253694
[2020/45]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2019131608
Date:04.07.2019
Language:JA
[2019/27]
Type: A1 Application with search report 
No.:EP3734467
Date:04.11.2020
Language:EN
[2020/45]
Type: B1 Patent specification 
No.:EP3734467
Date:01.05.2024
Language:EN
[2024/18]
Search report(s)International search report - published on:JP04.07.2019
(Supplementary) European search report - dispatched on:EP19.08.2021
ClassificationIPC:G06F16/28
[2021/38]
CPC:
G06F16/285 (EP,US); G06F30/20 (KR); G05B19/042 (EP);
G06F16/22 (KR); G06F16/248 (KR); G06F16/284 (KR);
G06F16/906 (KR); G06F18/15 (US); G06F18/2163 (US);
G06F18/231 (US); G06F18/24765 (US); G06V30/242 (US);
G05B2219/45031 (EP,US); G06F18/23 (US); G06F2119/02 (KR);
G06F2119/18 (KR,US) (-)
Former IPC [2020/45]G06F16/00
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/45]
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:DATENVERARBEITUNGSVORRICHTUNG, DATENVERARBEITUNGSVERFAHREN, UND AUFZEICHNUNGSMEDIUM[2024/17]
English:DATA PROCESSING DEVICE, DATA PROCESSING METHOD, AND RECORDING MEDIUM[2024/17]
French:DISPOSITIF DE TRAITEMENT DE DONNÉES, PROCÉDÉ DE TRAITEMENT DE DONNÉES, ET SUPPORT D'ENREGISTREMENT[2024/17]
Former [2020/45]DATENVERARBEITUNGSVORRICHTUNG, DATENVERARBEITUNGSVERFAHREN UND PROGRAMM
Former [2020/45]DATA PROCESSING DEVICE, DATA PROCESSING METHOD, AND PROGRAM
Former [2020/45]DISPOSITIF DE TRAITEMENT DE DONNÉES, PROCÉDÉ DE TRAITEMENT DE DONNÉES ET PROGRAMME
Entry into regional phase23.07.2020Translation filed 
23.07.2020National basic fee paid 
23.07.2020Search fee paid 
23.07.2020Designation fee(s) paid 
23.07.2020Examination fee paid 
Examination procedure23.07.2020Examination requested  [2020/45]
04.01.2022Amendment by applicant (claims and/or description)
05.07.2022Despatch of a communication from the examining division (Time limit: M04)
14.11.2022Reply to a communication from the examining division
07.11.2023Date of oral proceedings
28.11.2023Minutes of oral proceedings despatched
05.12.2023Communication of intention to grant the patent
19.03.2024Fee for grant paid
19.03.2024Fee for publishing/printing paid
19.03.2024Receipt of the translation of the claim(s)
Fees paidRenewal fee
05.11.2020Renewal fee patent year 03
02.12.2021Renewal fee patent year 04
02.12.2022Renewal fee patent year 05
06.12.2023Renewal fee patent year 06
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XI]US2016357840  (ODASHIMA SHIGEYUKI [JP], et al) [X] 1,7,8 * abstract * * paragraphs [0013] , [0064] * * paragraph [0104] - paragraph [0110] * [I] 2-6;
 [A]  - KOH J ET AL, "A MULTI-LAYER KOHONEN'S SELF-ORGANIZING FEATURE MAP FOR RANGE IMAGE SEGMENTATION", PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON NEURAL NETWORKS (ICNN). SAN FRANCISCO, MAR. 28 - APR. 1, 1993; [PROCEEDINGS OF THE INTERNATIONAL CONFERENCE ON NEURAL NETWORKS (ICNN)], NEW YORK, IEEE, US, (19930328), vol. 3, doi:10.1109/ICNN.1993.298740, ISBN 978-0-7803-0999-9, pages 1270 - 1276, XP000379462 [A] 1-8 * abstract * * page 1271, paragraph 2.1 * * page 1273, paragraph 2.2.2 *

DOI:   http://dx.doi.org/10.1109/ICNN.1993.298740
 [A]  - YONGCHUL KWON ET AL, "Skew-resistant parallel processing of feature-extracting scientific user-defined functions", PROCEEDINGS OF THE 1ST ACM SYMPOSIUM ON CLOUD COMPUTING, SOCC '10, ACM PRESS, NEW YORK, NEW YORK, USA, (20100610), doi:10.1145/1807128.1807140, ISBN 978-1-4503-0036-0, pages 75 - 86, XP058190167 [A] 1-8 * abstract * * page 80, paragraph 3.3 - page 82 *

DOI:   http://dx.doi.org/10.1145/1807128.1807140
International search[A]JP2001256480  (HITACHI LTD) [A] 1-8 * , *;
 [A]WO2012016594  (FRAUNHOFER GES FORSCHUNG [DE], et al) [A] 1-8 * , eta & EP 2601618 A1 *;
 [A]JP2016206784  (IHI CORP) [A] 1-8 * , *;
 [A]  - Kaoru SAKAI and Shunji MAEDA, "LSI wafer inspection method using recursive splitting of feature space", IPSJ SIG Technical Reports, (20060909), vol. 2006, no. 93, ISSN 0913-5685, pages 65 - 72, XP009521997 [A] 1-8
 [A]  - SAKATA et al, "Successive Pattern Learning based on Test Feature Classifier and its application to time-series recognition problem", Documents of Research group of the Institute of Electrical of Japan, (20060811), pages 1 - 6, XP055624047 [A] 1-8
by applicantJP2009152269
 US2015211122
 US2017177997
 JP20170253694
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.