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Extract from the Register of European Patents

EP About this file: EP3740340

EP3740340 - METHOD FOR CURING SOLDER PASTE ON A THERMALLY FRAGILE SUBSTRATE [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  23.10.2020
Database last updated on 05.10.2024
FormerThe international publication has been made
Status updated on  27.07.2019
Most recent event   Tooltip29.01.2024New entry: Renewal fee paid 
Applicant(s)For all designated states
NCC Nano, LLC
Three Forest Plaza Suite 930
12221 Merit Drive
Dallas, TX 75251 / US
[2020/48]
Inventor(s)01 / HENDRIKS, Rob, Jacob
Holstraat 49
5654BN Eindhoven / NL
 [2020/48]
Representative(s)Mewburn Ellis LLP
Aurora Building
Counterslip
Bristol BS1 6BX / GB
[N/P]
Former [2020/48]Mewburn Ellis LLP
Aurora Building
Counterslip
Bristol BS1 6BX / GB
Application number, filing date18901662.919.01.2018
[2020/48]
WO2018US14501
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2019143358
Date:25.07.2019
Language:EN
[2019/30]
Type: A1 Application with search report 
No.:EP3740340
Date:25.11.2020
Language:EN
The application published by WIPO in one of the EPO official languages on 25.07.2019 takes the place of the publication of the European patent application.
[2020/48]
Search report(s)International search report - published on:US25.07.2019
(Supplementary) European search report - dispatched on:EP11.11.2021
ClassificationIPC:H01L21/60, H01L23/498, H01L23/14, H05K3/34, H05K3/32, B23K1/005
[2021/36]
CPC:
B23K1/0016 (EP,KR); B23K35/025 (EP,KR); B23K1/005 (EP,KR);
B23K1/19 (EP,KR); B23K35/36 (EP,KR); H01L23/145 (EP);
H01L23/49816 (EP); H01L24/13 (EP); H01L24/81 (EP);
H05K3/321 (EP); H05K3/3494 (EP,KR); B23K2101/42 (EP,KR);
B23K2103/40 (EP,KR); B23K2103/42 (EP,KR); B23K2103/54 (EP,KR);
B23K35/262 (EP); H01L2224/131 (EP); H01L2224/13111 (EP);
H01L2224/1329 (EP); H01L2224/133 (EP); H01L2224/16227 (EP);
H01L2224/7526 (EP); H01L2224/75262 (EP); H01L2224/75263 (EP);
H01L2224/81192 (EP); H01L2224/8123 (EP); H01L2224/81234 (EP);
H01L2224/81815 (EP); H01L24/16 (EP); H01L2924/1579 (EP);
H01L2924/351 (EP); H01L2924/3511 (EP); H01L2924/3512 (EP);
H05K1/0274 (EP); H05K2201/0108 (EP,KR); H05K2201/0112 (EP,KR);
H05K2201/2054 (EP,KR) (-)
C-Set:
H01L2224/13111, H01L2924/01029, H01L2924/01047, H01L2924/00012 (EP);
H01L2224/131, H01L2924/014 (EP);
H01L2224/1329, H01L2924/0665 (EP);
H01L2224/133, H01L2924/00014 (EP)
Former IPC [2020/48]B23K35/02, B23K35/26, B23K35/36
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/48]
TitleGerman:VERFAHREN ZUM AUSHÄRTEN EINER LÖTPASTE AUF EINEM THERMISCH ZERBRECHLICHEN SUBSTRAT[2020/48]
English:METHOD FOR CURING SOLDER PASTE ON A THERMALLY FRAGILE SUBSTRATE[2020/48]
French:PROCÉDÉ DE DURCISSEMENT DE PÂTE À SOUDER SUR UN SUBSTRAT THERMIQUEMENT FRAGILE[2020/48]
Entry into regional phase17.07.2020National basic fee paid 
17.07.2020Search fee paid 
17.07.2020Designation fee(s) paid 
17.07.2020Examination fee paid 
Examination procedure17.07.2020Examination requested  [2020/48]
10.02.2022Amendment by applicant (claims and/or description)
Fees paidRenewal fee
17.07.2020Renewal fee patent year 03
26.01.2021Renewal fee patent year 04
27.01.2022Renewal fee patent year 05
21.03.2023Renewal fee patent year 06
29.01.2024Renewal fee patent year 07
Penalty fee
Additional fee for renewal fee
31.01.202306   M06   Fee paid on   21.03.2023
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[Y]JPH05109824  (OMRON TATEISI ELECTRONICS CO) [Y] 1-4,6 * paragraph [0001] - paragraph [0011] * * paragraph [0016] - paragraph [0018] * * figures 1, 2, 6 *;
 [Y]EP0758145  (TAIYO YUDEN KK [JP]) [Y] 1-4,6 * column 7, lines 1-30 * * column 8, lines 38-54 * * column 10, line 19 - column 11, line 15 * * figures 7, 11, 16 *;
 [Y]US2011300676  (SCHRODER KURT A [US], et al) [Y] 4 * paragraph [0006] - paragraph [0007] * * paragraph [0020] - paragraph [0023] * * paragraph [0033] * * figure 1 *;
 [Y]US2015221602  (ALIANE ABDELKADER [FR], et al) [Y] 4 * paragraph [0003] - paragraph [0004] * * paragraph [0049] - paragraph [0052] ** figure 14 *;
 [Y]  - VAN DEN ENDE D A ET AL, "Photonic Flash Soldering of Thin Chips and SMD Components on Foils for Flexible Electronics", IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, IEEE, USA, vol. 4, no. 11, doi:10.1109/TCPMT.2014.2360410, ISSN 2156-3950, (20141013), pages 1879 - 1886, (20141031), XP011563124 [Y] 1-4,6 * sections I-II; figures 1(a),(c) * * section IV, subsection A, second paragraph * * section IV, subsection B, third paragraph * * section V *

DOI:   http://dx.doi.org/10.1109/TCPMT.2014.2360410
International search[A]US3509317  (VALSAMAKIS CHRISTOPHER, et al) [A] 1-21* Entire document *;
 [A]US5088189  (BROWN JOHN E [US]) [A] 1-21 * Abstract, Col 1 lines 8-10, 16-17, 32-34; Col 2 lines 12-14; Col 4 lines 6-11, 13-15; Col 7 lines 1-3; *;
 [A]US6388187  (TAKEYAMA YOSHIFUMI [JP], et al) [A] 1-21 * Col 2 lines 49-52; Col 4 lines 1-6; Col 10 lines 43-46; Col 12 lines 31-35; Col 13 lines 11-13; Col 17 lines 8-11; Col 20 lines 24-26 *;
 [A]US2014369038  (TISCHLER MICHAEL A [CA], et al) [A] 1-21 * Entire document *;
 [A]US2015176133  (POPE DAVE S [US], et al) [A] 1-21 * para[0004], [0006], [0017], [0019], [0031], [0033]; Figure 2 *;
 [A]US2017027063  (SCHRODER KURT A [US], et al) [A] 1-21 * Entire document *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.