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Extract from the Register of European Patents

EP About this file: EP3748672

EP3748672 - CHIP AND PACKAGING METHOD [Right-click to bookmark this link]
StatusExamination is in progress
Status updated on  27.04.2024
Database last updated on 13.07.2024
FormerRequest for examination was made
Status updated on  06.11.2020
FormerThe international publication has been made
Status updated on  31.08.2019
Most recent event   Tooltip01.05.2024New entry: Despatch of examination report + time limit 
Applicant(s)For all designated states
HUAWEI TECHNOLOGIES CO., LTD.
Huawei Administration Building
Bantian, Longgang District
Shenzhen, Guangdong 518129 / CN
[2020/50]
Inventor(s)01 / ZHAO, Nan
Huawei Administration Building Bantian, Longgang
District
Shenzhen, Guangdong 518129 / CN
02 / XIE, Wenxu
Huawei Administration Building Bantian, Longgang
District
Shenzhen, Guangdong 518129 / CN
03 / TAO, Junlei
Huawei Administration Building Bantian, Longgang
District
Shenzhen, Guangdong 518129 / CN
04 / CHIANG, Shanghsuan
Huawei Administration Building Bantian, Longgang
District
Shenzhen, Guangdong 518129 / CN
05 / FU, HuiLi
Huawei Administration Building Bantian, Longgang
District
Shenzhen, Guangdong 518129 / CN
 [2020/50]
Representative(s)Maiwald GmbH
Elisenhof
Elisenstraße 3
80335 München / DE
[N/P]
Former [2020/50]Maiwald Patent- und Rechtsanwaltsgesellschaft mbH
Elisenhof
Elisenstraße 3
80335 München / DE
Application number, filing date18906810.906.08.2018
[2020/50]
WO2018CN99006
Priority number, dateCN20181015725924.02.2018         Original published format: CN201810157259
[2020/50]
Filing languageZH
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2019161641
Date:29.08.2019
Language:ZH
[2019/35]
Type: A1 Application with search report 
No.:EP3748672
Date:09.12.2020
Language:EN
[2020/50]
Search report(s)International search report - published on:CN29.08.2019
(Supplementary) European search report - dispatched on:EP19.03.2021
ClassificationIPC:H01L21/60, H01L25/065, H01L21/56, H01L23/538, H01L23/31, H01L23/498
[2021/10]
CPC:
H01L25/0652 (EP); H01L23/492 (CN); H01L23/5381 (US);
H01L21/4853 (US); H01L21/4857 (US); H01L21/56 (CN);
H01L21/563 (EP,US); H01L21/60 (CN); H01L23/293 (CN);
H01L23/31 (CN); H01L23/3128 (EP); H01L23/3185 (US);
H01L23/3675 (US); H01L23/49811 (US); H01L23/49816 (EP,US);
H01L23/49827 (EP); H01L23/5383 (EP,US); H01L23/5385 (EP,US);
H01L23/5386 (US); H01L23/562 (US); H01L24/14 (EP,US);
H01L24/16 (EP,US); H01L24/17 (EP); H01L24/96 (EP);
H01L25/0655 (EP); H01L25/50 (US); H01L2224/0401 (EP);
H01L2224/04105 (EP); H01L2224/0557 (EP); H01L2224/12105 (EP);
H01L2224/13082 (EP); H01L2224/131 (EP); H01L2224/13147 (EP);
H01L2224/1403 (EP,US); H01L2224/14181 (EP); H01L2224/16145 (EP);
H01L2224/16227 (EP,US); H01L2224/32145 (EP); H01L2224/32225 (EP);
H01L2224/32245 (EP); H01L2224/73204 (EP); H01L2224/73209 (EP);
H01L2224/73267 (EP); H01L2224/92125 (EP); H01L2224/96 (EP);
H01L2225/06513 (EP); H01L2225/06527 (EP); H01L2225/06541 (EP);
H01L23/13 (EP); H01L23/5384 (EP); H01L24/81 (EP);
H01L2924/1431 (EP,US); H01L2924/15192 (EP); H01L2924/15311 (EP);
H01L2924/157 (EP); H01L2924/15788 (EP); H01L2924/1579 (EP);
H01L2924/18161 (EP,US); H01L2924/18162 (EP); H01L2924/19105 (EP);
H01L2924/351 (EP); H01L2924/3511 (EP,US) (-)
C-Set:
H01L2224/13147, H01L2924/00014 (EP);
H01L2224/131, H01L2924/014, H01L2924/00014 (EP);
H01L2224/73204, H01L2224/16145, H01L2224/32145, H01L2924/00 (EP);
H01L2224/73204, H01L2224/16225, H01L2224/32225, H01L2924/00 (EP);
H01L2224/96, H01L2224/11 (EP);
H01L2224/96, H01L2224/81 (EP)
(-)
Former IPC [2020/50]H01L23/485, H01L23/49, H01L21/60
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/50]
TitleGerman:CHIP UND VERPACKUNGSVERFAHREN[2020/50]
English:CHIP AND PACKAGING METHOD[2020/50]
French:PUCE ET PROCÉDÉ D'ENCAPSULATION[2020/50]
Entry into regional phase02.09.2020Translation filed 
02.09.2020National basic fee paid 
02.09.2020Search fee paid 
02.09.2020Designation fee(s) paid 
02.09.2020Examination fee paid 
Examination procedure02.09.2020Examination requested  [2020/50]
09.08.2021Amendment by applicant (claims and/or description)
30.04.2024Despatch of a communication from the examining division (Time limit: M04)
Fees paidRenewal fee
02.09.2020Renewal fee patent year 03
30.08.2021Renewal fee patent year 04
29.08.2022Renewal fee patent year 05
30.08.2023Renewal fee patent year 06
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[X]US2017110407  (CHAWARE RAGHUNANDAN [US], et al) [X] 1,3,9-12,14,15 * paragraphs [0032] - [0033] - [0069]; figures 1-3,12,13 *;
 [X]US2017125379  (CHEN WEI-MING [TW], et al) [X] 1,3,8,9,14,15,20 * paragraphs [0014] - [0016] - [0036] , [0046]; figures 1-14 *;
 [XYI]US9653428  (HINER DAVID [US], et al) [X] 1,2,8,9,15,20 * column 50 - column 55; figures 12a-12m * [Y] 5,6 [I] 4,7,13;
 [X]WO2017114323  (HUAWEI TECH CO LTD [CN]) [X] 1,2,5,8-12,15,20 * paragraphs [0033] , [0037] , [0038] , [0042] , [0044]; figures 1-7 *;
 [Y]CN107104096  (HUAWEI TECH CO LTD) [Y] 5,6* figures 7-9 *
International search[A]CN102709202  (BROADCOM CORP) [A] 1-26* entire document *;
 [A]CN203774286U  (SHENZHEN FASTPRINT CIRCUIT TECH CO LTD, et al) [A] 1-26 * entire document *;
 [X]CN105655310  (HUAWEI TECH CO LTD) [X] 1-26 * description, paragraphs [0042]-[0069], and figures 1-7 *;
 [A]CN107479283  (XIAMEN TIANMA MICRO ELECTRONICS CO LTD) [A] 1-26 * entire document *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.