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Extract from the Register of European Patents

EP About this file: EP3720259

EP3720259 - SWITCH MODULE ASSEMBLY, AND METHOD FOR MANUFACTURING THE SAME [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  05.04.2024
Database last updated on 27.07.2024
FormerThe patent has been granted
Status updated on  28.04.2023
FormerGrant of patent is intended
Status updated on  18.12.2022
FormerRequest for examination was made
Status updated on  03.04.2021
FormerThe application has been published
Status updated on  04.09.2020
Most recent event   Tooltip24.05.2024Lapse of the patent in a contracting state
New state(s): IT		published on 26.06.2024  [2024/26]
Applicant(s)For all designated states
ABB Schweiz AG
Bruggerstrasse 66
5400 Baden / CH
[2023/16]
Former [2020/41]For all designated states
ABB Schweiz AG
Brown Boveri Strasse 6
5400 Baden / CH
Inventor(s)01 / Nygren, Toni
ABB Oy
Hiomotie 13
00380 Helsinki / FI
02 / Mielonen, Asko
ABB Oy
Hiomotie 13
00380 Helsinki / FI
03 / Tervo, Hermanni
ABB Oy
Hiomotie 13
00380 Helsinki / FI
 [2020/41]
Representative(s)Kolster Oy Ab
(Salmisaarenaukio 1)
P.O. Box 204
00181 Helsinki / FI
[2020/41]
Application number, filing date19166969.603.04.2019
[2020/41]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP3720259
Date:07.10.2020
Language:EN
[2020/41]
Type: B1 Patent specification 
No.:EP3720259
Date:31.05.2023
Language:EN
[2023/22]
Search report(s)(Supplementary) European search report - dispatched on:EP26.09.2019
ClassificationIPC:H05K7/14, H01G2/04, H01G4/38, H01G4/40
[2023/01]
CPC:
H01G2/04 (EP,CN); H02M7/003 (CN,US); H02M1/34 (US);
H01G4/38 (EP); H01G4/40 (EP); H02B1/04 (US);
H02B1/20 (US); H02B1/24 (US); H02M7/5387 (CN);
H05K7/14329 (EP); H02M1/346 (US); Y02B70/10 (EP) (-)
Former IPC [2020/41]H05K7/14, H01G2/04
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2021/18]
Former [2020/41]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:SCHALTMODULANORDNUNG UND VERFAHREN ZUR HERSTELLUNG DAVON[2020/41]
English:SWITCH MODULE ASSEMBLY, AND METHOD FOR MANUFACTURING THE SAME[2020/41]
French:ENSEMBLE MODULE DE COMMUTATION ET SON PROCÉDÉ DE FABRICATION[2020/41]
Examination procedure29.03.2021Amendment by applicant (claims and/or description)
29.03.2021Examination requested  [2021/18]
29.03.2021Date on which the examining division has become responsible
19.12.2022Communication of intention to grant the patent
19.04.2023Fee for grant paid
19.04.2023Fee for publishing/printing paid
19.04.2023Receipt of the translation of the claim(s)
Opposition(s)01.03.2024No opposition filed within time limit [2024/19]
Fees paidRenewal fee
29.04.2021Renewal fee patent year 03
25.04.2022Renewal fee patent year 04
25.04.2023Renewal fee patent year 05
Opt-out from the exclusive  Tooltip
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT31.05.2023
CZ31.05.2023
DK31.05.2023
EE31.05.2023
ES31.05.2023
FI31.05.2023
HR31.05.2023
IT31.05.2023
LT31.05.2023
LV31.05.2023
NL31.05.2023
PL31.05.2023
RO31.05.2023
RS31.05.2023
SE31.05.2023
SI31.05.2023
SK31.05.2023
SM31.05.2023
NO31.08.2023
GR01.09.2023
IS30.09.2023
PT02.10.2023
[2024/26]
Former [2024/25]AT31.05.2023
CZ31.05.2023
DK31.05.2023
EE31.05.2023
ES31.05.2023
FI31.05.2023
HR31.05.2023
LT31.05.2023
LV31.05.2023
NL31.05.2023
PL31.05.2023
RO31.05.2023
RS31.05.2023
SE31.05.2023
SI31.05.2023
SK31.05.2023
SM31.05.2023
NO31.08.2023
GR01.09.2023
IS30.09.2023
PT02.10.2023
Former [2024/10]AT31.05.2023
CZ31.05.2023
DK31.05.2023
EE31.05.2023
ES31.05.2023
FI31.05.2023
HR31.05.2023
LT31.05.2023
LV31.05.2023
NL31.05.2023
PL31.05.2023
RO31.05.2023
RS31.05.2023
SE31.05.2023
SK31.05.2023
SM31.05.2023
NO31.08.2023
GR01.09.2023
IS30.09.2023
PT02.10.2023
Former [2024/08]AT31.05.2023
ES31.05.2023
FI31.05.2023
HR31.05.2023
LT31.05.2023
LV31.05.2023
NL31.05.2023
PL31.05.2023
RS31.05.2023
SE31.05.2023
SK31.05.2023
SM31.05.2023
NO31.08.2023
GR01.09.2023
IS30.09.2023
Former [2024/03]AT31.05.2023
ES31.05.2023
FI31.05.2023
HR31.05.2023
LT31.05.2023
LV31.05.2023
NL31.05.2023
PL31.05.2023
RS31.05.2023
SE31.05.2023
NO31.08.2023
GR01.09.2023
IS30.09.2023
Former [2024/01]AT31.05.2023
ES31.05.2023
HR31.05.2023
LT31.05.2023
LV31.05.2023
NL31.05.2023
PL31.05.2023
RS31.05.2023
SE31.05.2023
NO31.08.2023
GR01.09.2023
IS30.09.2023
Former [2023/52]AT31.05.2023
ES31.05.2023
HR31.05.2023
NL31.05.2023
PL31.05.2023
RS31.05.2023
SE31.05.2023
NO31.08.2023
GR01.09.2023
IS30.09.2023
Former [2023/51]AT31.05.2023
ES31.05.2023
HR31.05.2023
PL31.05.2023
RS31.05.2023
SE31.05.2023
NO31.08.2023
GR01.09.2023
IS30.09.2023
Former [2023/50]AT31.05.2023
ES31.05.2023
PL31.05.2023
SE31.05.2023
NO31.08.2023
GR01.09.2023
IS30.09.2023
Former [2023/48]AT31.05.2023
ES31.05.2023
SE31.05.2023
NO31.08.2023
Former [2023/46]ES31.05.2023
Documents cited:Search[A]EP2418764  (YASKAWA DENKI SEISAKUSHO KK [JP]);
 [A]WO2012131754  (MITSUBISHI ELECTRIC CORP [JP], et al);
 [A]DE102014101022  (SEMIKRON ELEKTRONIK GMBH [DE]);
 [A]WO2015064408  (NTN TOYO BEARING CO LTD [JP], et al)
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.