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Extract from the Register of European Patents

EP About this file: EP3618102

EP3618102 - METHOD FOR PRODUCING THIN WAFER [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  25.03.2022
Database last updated on 31.08.2024
FormerThe patent has been granted
Status updated on  16.04.2021
FormerGrant of patent is intended
Status updated on  13.01.2021
FormerExamination is in progress
Status updated on  02.10.2020
FormerRequest for examination was made
Status updated on  28.08.2020
FormerThe application has been published
Status updated on  31.01.2020
Most recent event   Tooltip14.06.2024Lapse of the patent in a contracting state
New state(s): TR		published on 17.07.2024  [2024/29]
Applicant(s)For all designated states
Shin-Etsu Chemical Co., Ltd.
6-1, Ohtemachi 2-chome
Chiyoda-ku
Tokyo / JP
[2020/10]
Inventor(s)01 / YASUDA, Hiroyuki
Shin-Etsu Chemical Co., Ltd.
c/o Silicone-Electronics Materials Research Center
1-10, Hitomi, Matsuida-machi
Annaka-shi, Gunma / JP
02 / SUGO, Michihiro
Shin-Etsu Chemical Co., Ltd.
c/o Silicone-Electronics Materials Research Center
1-10, Hitomi, Matsuida-machi
Annaka-shi, Gunma / JP
 [2021/20]
Former [2020/10]01 / YASUDA, Hiroyuki
Shin-Etsu Chemical Co., Ltd.
c/o Silicone-Electronics Materials Research Center
1-10, Hitomi, Matsuida-machi
Annaka-shi, Gunma / JP
02 / SUGO, Michihiro
Shin-Etsu Chemical Co., Ltd.
c/o Silicone-Electronics Materials Research Center
1-10, Hitomi, Matsuida-machi
Annaka-shi, Gunma / JP
Representative(s)Ter Meer Steinmeister & Partner
Patentanwälte mbB
Nymphenburger Straße 4
80335 München / DE
[2020/10]
Application number, filing date19192280.619.08.2019
[2020/10]
Priority number, dateJP2018016437303.09.2018         Original published format: JP 2018164373
[2020/10]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP3618102
Date:04.03.2020
Language:EN
[2020/10]
Type: A3 Search report 
No.:EP3618102
Date:11.03.2020
Language:EN
[2020/11]
Type: B1 Patent specification 
No.:EP3618102
Date:19.05.2021
Language:EN
[2021/20]
Search report(s)(Supplementary) European search report - dispatched on:EP07.02.2020
ClassificationIPC:H01L21/683
[2020/10]
CPC:
H01L21/6835 (EP); H01L21/185 (KR); H01L21/6836 (CN,US);
B32B43/006 (US); C08G61/02 (KR); C08G77/14 (KR);
C08G77/60 (KR); C08L101/00 (KR); C08L65/00 (KR);
C08L83/04 (KR); C09J147/00 (US); H01L21/324 (KR);
H01L21/7806 (KR); B32B2457/14 (US); B32B38/10 (US);
H01L2221/68304 (CN); H01L2221/68327 (EP); H01L2221/6834 (EP);
H01L2221/68381 (EP); H01L2221/68386 (US) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/40]
Former [2020/10]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:VERFAHREN ZUR HERSTELLUNG EINES DÜNNEN WAFERS[2020/10]
English:METHOD FOR PRODUCING THIN WAFER[2020/10]
French:PROCÉDÉ DE FABRICATION D'UNE TRANCHE MINCE[2020/10]
Examination procedure20.08.2020Amendment by applicant (claims and/or description)
20.08.2020Examination requested  [2020/40]
20.08.2020Date on which the examining division has become responsible
05.10.2020Despatch of a communication from the examining division (Time limit: M02)
04.12.2020Reply to a communication from the examining division
14.01.2021Communication of intention to grant the patent
09.04.2021Fee for grant paid
09.04.2021Fee for publishing/printing paid
09.04.2021Receipt of the translation of the claim(s)
Opposition(s)22.02.2022No opposition filed within time limit [2022/17]
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU19.08.2019
AL19.05.2021
AT19.05.2021
CY19.05.2021
CZ19.05.2021
DK19.05.2021
EE19.05.2021
ES19.05.2021
FI19.05.2021
HR19.05.2021
IT19.05.2021
LT19.05.2021
LV19.05.2021
MC19.05.2021
MK19.05.2021
NL19.05.2021
PL19.05.2021
RO19.05.2021
RS19.05.2021
SE19.05.2021
SI19.05.2021
SK19.05.2021
SM19.05.2021
TR19.05.2021
BG19.08.2021
IE19.08.2021
LU19.08.2021
NO19.08.2021
GR20.08.2021
BE31.08.2021
IS19.09.2021
PT20.09.2021
[2024/29]
Former [2024/23]HU19.08.2019
AL19.05.2021
AT19.05.2021
CY19.05.2021
CZ19.05.2021
DK19.05.2021
EE19.05.2021
ES19.05.2021
FI19.05.2021
HR19.05.2021
IT19.05.2021
LT19.05.2021
LV19.05.2021
MC19.05.2021
MK19.05.2021
NL19.05.2021
PL19.05.2021
RO19.05.2021
RS19.05.2021
SE19.05.2021
SI19.05.2021
SK19.05.2021
SM19.05.2021
BG19.08.2021
IE19.08.2021
LU19.08.2021
NO19.08.2021
GR20.08.2021
BE31.08.2021
IS19.09.2021
PT20.09.2021
Former [2023/33]HU19.08.2019
AL19.05.2021
AT19.05.2021
CY19.05.2021
CZ19.05.2021
DK19.05.2021
EE19.05.2021
ES19.05.2021
FI19.05.2021
HR19.05.2021
IT19.05.2021
LT19.05.2021
LV19.05.2021
MC19.05.2021
NL19.05.2021
PL19.05.2021
RO19.05.2021
RS19.05.2021
SE19.05.2021
SI19.05.2021
SK19.05.2021
SM19.05.2021
BG19.08.2021
IE19.08.2021
LU19.08.2021
NO19.08.2021
GR20.08.2021
BE31.08.2021
IS19.09.2021
PT20.09.2021
Former [2023/30]AL19.05.2021
AT19.05.2021
CY19.05.2021
CZ19.05.2021
DK19.05.2021
EE19.05.2021
ES19.05.2021
FI19.05.2021
HR19.05.2021
IT19.05.2021
LT19.05.2021
LV19.05.2021
MC19.05.2021
NL19.05.2021
PL19.05.2021
RO19.05.2021
RS19.05.2021
SE19.05.2021
SI19.05.2021
SK19.05.2021
SM19.05.2021
BG19.08.2021
IE19.08.2021
LU19.08.2021
NO19.08.2021
GR20.08.2021
BE31.08.2021
IS19.09.2021
PT20.09.2021
Former [2022/36]AL19.05.2021
AT19.05.2021
CZ19.05.2021
DK19.05.2021
EE19.05.2021
ES19.05.2021
FI19.05.2021
HR19.05.2021
IT19.05.2021
LT19.05.2021
LV19.05.2021
MC19.05.2021
NL19.05.2021
PL19.05.2021
RO19.05.2021
RS19.05.2021
SE19.05.2021
SI19.05.2021
SK19.05.2021
SM19.05.2021
BG19.08.2021
IE19.08.2021
LU19.08.2021
NO19.08.2021
GR20.08.2021
BE31.08.2021
IS19.09.2021
PT20.09.2021
Former [2022/35]AL19.05.2021
AT19.05.2021
CZ19.05.2021
DK19.05.2021
EE19.05.2021
ES19.05.2021
FI19.05.2021
HR19.05.2021
LT19.05.2021
LV19.05.2021
MC19.05.2021
NL19.05.2021
PL19.05.2021
RO19.05.2021
RS19.05.2021
SE19.05.2021
SI19.05.2021
SK19.05.2021
SM19.05.2021
BG19.08.2021
IE19.08.2021
LU19.08.2021
NO19.08.2021
GR20.08.2021
BE31.08.2021
IS19.09.2021
PT20.09.2021
Former [2022/34]AL19.05.2021
AT19.05.2021
CZ19.05.2021
DK19.05.2021
EE19.05.2021
ES19.05.2021
FI19.05.2021
HR19.05.2021
LT19.05.2021
LV19.05.2021
MC19.05.2021
NL19.05.2021
PL19.05.2021
RO19.05.2021
RS19.05.2021
SE19.05.2021
SI19.05.2021
SK19.05.2021
SM19.05.2021
BG19.08.2021
LU19.08.2021
NO19.08.2021
GR20.08.2021
BE31.08.2021
IS19.09.2021
PT20.09.2021
Former [2022/29]AL19.05.2021
AT19.05.2021
CZ19.05.2021
DK19.05.2021
EE19.05.2021
ES19.05.2021
FI19.05.2021
HR19.05.2021
LT19.05.2021
LV19.05.2021
MC19.05.2021
NL19.05.2021
PL19.05.2021
RO19.05.2021
RS19.05.2021
SE19.05.2021
SI19.05.2021
SK19.05.2021
SM19.05.2021
BG19.08.2021
LU19.08.2021
NO19.08.2021
GR20.08.2021
IS19.09.2021
PT20.09.2021
Former [2022/26]AL19.05.2021
AT19.05.2021
CZ19.05.2021
DK19.05.2021
EE19.05.2021
ES19.05.2021
FI19.05.2021
HR19.05.2021
LT19.05.2021
LV19.05.2021
MC19.05.2021
NL19.05.2021
PL19.05.2021
RO19.05.2021
RS19.05.2021
SE19.05.2021
SK19.05.2021
SM19.05.2021
BG19.08.2021
LU19.08.2021
NO19.08.2021
GR20.08.2021
IS19.09.2021
PT20.09.2021
Former [2022/23]AT19.05.2021
CZ19.05.2021
DK19.05.2021
EE19.05.2021
ES19.05.2021
FI19.05.2021
HR19.05.2021
LT19.05.2021
LV19.05.2021
MC19.05.2021
NL19.05.2021
PL19.05.2021
RO19.05.2021
RS19.05.2021
SE19.05.2021
SK19.05.2021
SM19.05.2021
BG19.08.2021
LU19.08.2021
NO19.08.2021
GR20.08.2021
IS19.09.2021
PT20.09.2021
Former [2022/18]AT19.05.2021
CZ19.05.2021
DK19.05.2021
EE19.05.2021
ES19.05.2021
FI19.05.2021
HR19.05.2021
LT19.05.2021
LV19.05.2021
MC19.05.2021
NL19.05.2021
PL19.05.2021
RO19.05.2021
RS19.05.2021
SE19.05.2021
SK19.05.2021
SM19.05.2021
BG19.08.2021
NO19.08.2021
GR20.08.2021
PT20.09.2021
IS22.12.2021
Former [2022/10]AT19.05.2021
CZ19.05.2021
DK19.05.2021
EE19.05.2021
ES19.05.2021
FI19.05.2021
HR19.05.2021
LT19.05.2021
LV19.05.2021
NL19.05.2021
PL19.05.2021
RO19.05.2021
RS19.05.2021
SE19.05.2021
SK19.05.2021
SM19.05.2021
BG19.08.2021
NO19.08.2021
GR20.08.2021
PT20.09.2021
IS22.12.2021
Former [2022/09]AT19.05.2021
CZ19.05.2021
DK19.05.2021
ES19.05.2021
FI19.05.2021
HR19.05.2021
LT19.05.2021
LV19.05.2021
NL19.05.2021
PL19.05.2021
RO19.05.2021
RS19.05.2021
SE19.05.2021
SK19.05.2021
SM19.05.2021
BG19.08.2021
NO19.08.2021
GR20.08.2021
IS19.09.2021
PT20.09.2021
Former [2022/08]AT19.05.2021
CZ19.05.2021
DK19.05.2021
ES19.05.2021
FI19.05.2021
HR19.05.2021
LT19.05.2021
LV19.05.2021
NL19.05.2021
PL19.05.2021
RS19.05.2021
SE19.05.2021
SM19.05.2021
BG19.08.2021
NO19.08.2021
GR20.08.2021
IS19.09.2021
PT20.09.2021
Former [2022/07]AT19.05.2021
FI19.05.2021
HR19.05.2021
LT19.05.2021
LV19.05.2021
NL19.05.2021
PL19.05.2021
RS19.05.2021
SE19.05.2021
SM19.05.2021
BG19.08.2021
NO19.08.2021
GR20.08.2021
IS19.09.2021
PT20.09.2021
Former [2022/04]AT19.05.2021
FI19.05.2021
HR19.05.2021
LT19.05.2021
LV19.05.2021
NL19.05.2021
PL19.05.2021
RS19.05.2021
SE19.05.2021
BG19.08.2021
NO19.08.2021
GR20.08.2021
IS19.09.2021
PT20.09.2021
Former [2021/52]AT19.05.2021
FI19.05.2021
HR19.05.2021
LT19.05.2021
LV19.05.2021
PL19.05.2021
RS19.05.2021
SE19.05.2021
BG19.08.2021
NO19.08.2021
GR20.08.2021
IS19.09.2021
PT20.09.2021
Former [2021/51]AT19.05.2021
FI19.05.2021
HR19.05.2021
LT19.05.2021
LV19.05.2021
RS19.05.2021
SE19.05.2021
BG19.08.2021
NO19.08.2021
GR20.08.2021
IS19.09.2021
PT20.09.2021
Former [2021/50]AT19.05.2021
FI19.05.2021
HR19.05.2021
LT19.05.2021
LV19.05.2021
SE19.05.2021
BG19.08.2021
NO19.08.2021
GR20.08.2021
PT20.09.2021
Former [2021/49]AT19.05.2021
FI19.05.2021
HR19.05.2021
LT19.05.2021
LV19.05.2021
SE19.05.2021
BG19.08.2021
NO19.08.2021
GR20.08.2021
Former [2021/47]AT19.05.2021
FI19.05.2021
LT19.05.2021
BG19.08.2021
Former [2021/46]AT19.05.2021
FI19.05.2021
LT19.05.2021
Documents cited:Search[A]US2016326414  (TAGAMI SHOHEI [JP], et al) [A] 2* paragraphs [0111] , [ 112] *;
 [A]US2017110360  (TAGAMI SHOHEI [JP], et al) [A] 2 * paragraphs [0102] , [ 103] *;
 [Y]US2017198176  (KAMOCHI YOSHITAKA [JP], et al) [Y] 1-8,10 * figure 1 * * paragraphs [0069] - [0070] - [ 213] - [0226] - [ 242] - [0243] *;
 [XI]US2017352637  (YASUDA HIROYUKI [JP], et al) [X] 1,3-9 * figure 1 * * paragraphs [0035] - [0043] - [0 56] , [0 72] , [0 75] , [ 194] - [0198] - [ 236] - [0238] - [ 240] - [0275] * [I] 2;
 [Y]US2018102334  (YASUDA HIROYUKI [JP], et al) [Y] 1-8,10 * figure 1 * * paragraphs [0044] - [0052] - [0 65] , [0 68] , [0 83] , [0 84] , [0 98] , [ 102] - [0103] - [0120] - [0122] - [0149] - [0152] *
by applicantJP2003177528
 JP2013110391
 JP2013534721
 WO2015072418
 JP2018164373
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.