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Extract from the Register of European Patents

EP About this file: EP3671836

EP3671836 - 3D CIRCUIT WITH A MESA ISOLATION FOR THE GROUND PLANE REGION [Right-click to bookmark this link]
Former [2020/26]3D CIRCUIT WITH A MESA ISOLATION FOR THE GROUND PLANE REGION
[2020/28]
StatusThe patent has been granted
Status updated on  10.05.2024
Database last updated on 05.10.2024
FormerGrant of patent is intended
Status updated on  02.01.2024
FormerExamination is in progress
Status updated on  03.02.2022
FormerRequest for examination was made
Status updated on  22.05.2020
Most recent event   Tooltip27.09.2024Change - applicantpublished on 30.10.2024 [2024/44]
Applicant(s)For all designated states
Commissariat à l'Energie Atomique et aux Energies Alternatives
25 Rue Leblanc
Bat Le Ponant
75015 Paris / FR
[2024/44]
Former [2020/26]For all designated states
Commissariat à l'énergie atomique et aux énergies alternatives
Bâtiment le Ponant
25, rue Leblanc
75015 Paris / FR
Inventor(s)01 / BATUDE, Perrine
CEA GRENOBLE 17 rue des Martyrs
38054 GRENOBLE CEDEX 09 / FR
02 / ANDRIEU, François
CEA GRENOBLE 17 rue des Martyrs
38054 GRENOBLE CEDEX 09 / FR
 [2020/26]
Representative(s)Brevalex
Tour Trinity
1 B Place de la Défense
92400 Courbevoie / FR
[2024/24]
Former [2020/26]Brevalex
95, rue d'Amsterdam
75378 Paris Cedex 8 / FR
Application number, filing date19213818.805.12.2019
[2020/26]
Priority number, dateFR2018007396519.12.2018         Original published format: FR 1873965
[2020/26]
Filing languageFR
Procedural languageFR
PublicationType: A1 Application with search report 
No.:EP3671836
Date:24.06.2020
Language:FR
[2020/26]
Type: B1 Patent specification 
No.:EP3671836
Date:12.06.2024
Language:FR
[2024/24]
Search report(s)(Supplementary) European search report - dispatched on:EP29.04.2020
ClassificationIPC:H01L27/12, H01L27/06, H01L21/822, H01L21/8234
[2020/26]
CPC:
H01L27/1207 (EP); H01L21/8221 (EP,US); H01L21/02126 (US);
H01L21/02164 (US); H01L21/02667 (US); H01L21/26513 (US);
H01L21/30604 (US); H01L21/31111 (US); H01L21/32053 (US);
H01L21/324 (US); H01L21/76254 (US); H01L21/76895 (US);
H01L21/823437 (EP); H01L21/84 (US); H01L21/0217 (US);
H01L21/02181 (US); H01L21/022 (US) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/26]
TitleGerman:3D SCHALTUNG MIT EINER MESA-ISOLATION FÜR DEN GRUNDPLATTENBEREICH[2024/01]
English:3D CIRCUIT WITH A MESA ISOLATION FOR THE GROUND PLANE REGION[2024/01]
French:CIRCUIT 3D DOTE D'UNE ISOLATION MESA POUR LA ZONE DE PLAN DE MASSE[2020/26]
Former [2020/26]3D SCHALTUNG MIT EINEM MESA-ISOLATION FÜR DEN GRUNDPLATTENBEREICH
Former [2020/26]3D CIRCUIT WITH A MESA ISOLATION FOR THE GROUND PLANE REGION
Examination procedure05.12.2019Examination requested  [2020/26]
10.08.2020Amendment by applicant (claims and/or description)
02.02.2022Despatch of a communication from the examining division (Time limit: M04)
14.03.2022Reply to a communication from the examining division
03.01.2024Communication of intention to grant the patent
30.04.2024Fee for grant paid
30.04.2024Fee for publishing/printing paid
30.04.2024Receipt of the translation of the claim(s)
Fees paidRenewal fee
30.11.2021Renewal fee patent year 03
21.12.2022Renewal fee patent year 04
28.12.2023Renewal fee patent year 05
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Documents cited:Search[A]US2011298021  (TADA MUNEHIRO [JP], et al);
 [A]US2013193550  (SKLENARD BENOIT [FR], et al);
 [XI]US9023688  (OR-BACH ZVI [US], et al)
by applicantUS9761593
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.