Extract from the Register of European Patents

EP About this file: EP3811416

EP3811416 - III-NITRIDE MATERIAL SEMICONDUCTOR STRUCTURES ON CONDUCTIVE SUBSTRATES [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  26.03.2021
Database last updated on 19.03.2026
FormerThe international publication has been made
Status updated on  25.01.2020
Formerunknown
Status updated on  16.08.2019
Most recent event   Tooltip26.07.2025New entry: Renewal fee paid 
Applicant(s)For all designated states
MACOM Technology Solutions Holdings, Inc.
100 Chelmsford Street
Lowell, Massachusetts 01851 / US
[2021/17]
Inventor(s)01 / BOLES, Timothy, E.
18 Hillcrest Drive
Tyngsboro, MA 01879 / US
02 / STRUBLE, Wayne, Mack
5C Hawthorne Village
Franklin, MA 02038 / US
03 / LINTHICUM, Kevin, J.
517 Windstream Way
Cary, NC 27511 / US
 [2021/17]
Representative(s)Cabinet Beaumont
4, Place Robert Schuman
B.P. 1529
38025 Grenoble Cedex 1 / FR
[2021/17]
Application number, filing date19749925.419.07.2019
[2021/17]
WO2019US42623
Priority number, dateUS20181603988719.07.2018         Original published format: US201816039887
US20181604023019.07.2018         Original published format: US201816040230
US20181603986619.07.2018         Original published format: US201816039866
US20181603990019.07.2018         Original published format: US201816039900
US20181604025519.07.2018         Original published format: US201816040255
[2021/17]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2020018915
Date:23.01.2020
Language:EN
[2020/04]
Type: A1 Application with search report 
No.:EP3811416
Date:28.04.2021
Language:EN
The application published by WIPO in one of the EPO official languages on 23.01.2020 takes the place of the publication of the European patent application.
[2021/17]
Search report(s)International search report - published on:EP23.01.2020
ClassificationIPC:H01L29/778, H01L29/872, H01L29/417, H01L29/20
[2021/17]
CPC:
H10D30/4732 (EP); H10D64/257 (EP); H10D8/60 (EP);
H10D62/8503 (EP); H10D64/254 (EP); H10D64/256 (EP)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2021/17]
TitleGerman:HALBLEITERSTRUKTUREN AUS III-NITRID-MATERIAL AUF LEITFÄHIGEN SUBSTRATEN[2021/17]
English:III-NITRIDE MATERIAL SEMICONDUCTOR STRUCTURES ON CONDUCTIVE SUBSTRATES[2021/17]
French:STRUCTURES SEMI-CONDUCTRICES EN MATÉRIAU DE NITRURE III SUR DES SUBSTRATS CONDUCTEURS[2021/17]
Entry into regional phase06.05.2020National basic fee paid 
06.05.2020Designation fee(s) paid 
06.05.2020Examination fee paid 
Examination procedure06.05.2020Examination requested  [2021/17]
06.05.2020Date on which the examining division has become responsible
31.08.2021Amendment by applicant (claims and/or description)
Fees paidRenewal fee
26.07.2021Renewal fee patent year 03
27.07.2022Renewal fee patent year 04
26.07.2023Renewal fee patent year 05
25.07.2024Renewal fee patent year 06
25.07.2025Renewal fee patent year 07
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Cited inInternational search[XI] JP2017216257  (SHARP KK et al.)
 [I] US2008023706  (SAITO YASUNOBU et al.)
 [XI]   TAKENAKA ISAO ET AL: "High-Efficiency and High-Power Microwave Amplifier Using GaN-on-Si FET With Improved High-Temperature Operation Characteristics", IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, PLENUM, USA, vol. 62, no. 3, March 2014 (2014-03-01), pages 502 - 512, XP011541890, ISSN: 0018-9480, [retrieved on 20140303], DOI: 10.1109/TMTT.2014.2298381

DOI:   http://dx.doi.org/10.1109/TMTT.2014.2298381
 [XI]   SAITO W ET AL: "Breakdown behaviour of high-voltage GaN-HEMTs", MICROELECTRONICS AND RELIABILITY, vol. 55, no. 9, 10 July 2015 (2015-07-10), pages 1682 - 1686, XP029294642, ISSN: 0026-2714, DOI: 10.1016/J.MICROREL.2015.06.126

DOI:   http://dx.doi.org/10.1016/j.microrel.2015.06.126
by applicantUS6649287
 US7071498
 US2017301798
 US6051849
 US6265289
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