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Extract from the Register of European Patents

EP About this file: EP3787012

EP3787012 - MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  29.01.2021
Database last updated on 25.09.2024
FormerThe international publication has been made
Status updated on  02.11.2019
Most recent event   Tooltip15.03.2024New entry: Renewal fee paid 
Applicant(s)For all designated states
NITTO DENKO CORPORATION
1-2, Shimohozumi 1-chome
Ibaraki-shi
Osaka 567-8680 / JP
[2021/09]
Inventor(s)01 / MITA, Ryota
c/o NITTO DENKO CORPORATION,
1-2, Shimohozumi 1- chome
Ibaraki-shi, Osaka 567-8680 / JP
02 / ICHIKAWA, Tomoaki
c/o NITTO DENKO CORPORATION,
1-2, Shimohozumi 1- chome
Ibaraki-shi, Osaka 567-8680 / JP
 [2021/09]
Representative(s)Grünecker Patent- und Rechtsanwälte PartG mbB
Leopoldstraße 4
80802 München / DE
[2021/09]
Application number, filing date19792041.627.03.2019
[2021/09]
WO2019JP13138
Priority number, dateJP2018008647527.04.2018         Original published format: JP 2018086475
JP2018016883210.09.2018         Original published format: JP 2018168832
[2021/09]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2019208071
Date:31.10.2019
Language:JA
[2019/44]
Type: A1 Application with search report 
No.:EP3787012
Date:03.03.2021
Language:EN
[2021/09]
Search report(s)International search report - published on:JP31.10.2019
(Supplementary) European search report - dispatched on:EP11.04.2022
ClassificationIPC:H01L21/52, C09J7/10, C09J7/30, C09J9/02, C09J11/04, C09J201/00, H01L21/301, H01L23/00, H01L21/78, H01L21/67, H01L21/683
[2022/06]
CPC:
H01L21/6836 (EP,US); H01L24/83 (EP,US); H01L21/4853 (US);
H01L21/565 (US); H01L21/67132 (EP); H01L21/67144 (EP);
H01L21/78 (EP,US); H01L24/27 (EP); H01L24/29 (EP,US);
H01L24/32 (EP,US); H01L24/48 (EP,US); H01L24/73 (US);
H01L24/85 (EP); H01L24/92 (EP); H01L24/94 (EP);
H01L24/95 (EP); H01L2221/68322 (EP); H01L2221/68327 (EP);
H01L2221/68336 (EP,US); H01L2221/6834 (EP); H01L2221/68368 (EP);
H01L2221/68381 (EP); H01L2224/27002 (EP); H01L2224/27436 (EP);
H01L2224/29239 (US); H01L2224/29247 (US); H01L2224/29286 (US);
H01L2224/29294 (EP); H01L2224/293 (EP); H01L2224/32225 (US);
H01L2224/32227 (EP); H01L2224/32245 (EP); H01L2224/48091 (EP);
H01L2224/48225 (US); H01L2224/48227 (EP); H01L2224/48247 (EP);
H01L2224/73265 (EP,US); H01L2224/75745 (EP); H01L2224/83065 (EP);
H01L2224/83075 (EP); H01L2224/8309 (EP); H01L2224/83191 (EP);
H01L2224/83204 (EP); H01L2224/8384 (EP,US); H01L2224/83907 (EP);
H01L2224/83986 (EP); H01L2224/85207 (EP); H01L2224/92 (EP);
H01L2224/92247 (EP); H01L2224/94 (EP); H01L2224/95 (EP);
H01L23/49513 (EP); H01L24/45 (EP); H01L2924/01029 (US);
H01L2924/01047 (US); H01L2924/0541 (US); H01L2924/10272 (EP,US);
H01L2924/1033 (EP,US); H01L2924/181 (EP) (-)
C-Set:
H01L2224/27436, H01L2924/00012 (EP);
H01L2224/48091, H01L2924/00014 (EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (EP);
H01L2224/73265, H01L2224/32245, H01L2224/48247, H01L2924/00 (EP);
H01L2224/92, H01L2221/68304, H01L21/78, H01L2224/27, H01L2221/68368, H01L2221/68381, H01L2224/83 (EP);
H01L2224/92, H01L2221/68304, H01L21/78, H01L2224/27, H01L2221/68381, H01L2224/83 (EP);
H01L2224/92, H01L2221/68304, H01L2224/27, H01L21/78, H01L2221/68381, H01L2224/83 (EP);
H01L2224/92, H01L2221/68304, H01L2224/27, H01L2221/68368, H01L21/78, H01L2221/68381, H01L2224/83 (EP);
H01L2224/94, H01L2224/27 (EP);
H01L2224/95, H01L2224/27 (EP);
H01L2924/181, H01L2924/00012 (EP)
(-)
Former IPC [2021/09]H01L21/52, C09J7/10, C09J7/30, C09J9/02, C09J11/04, C09J201/00, H01L21/301
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2021/09]
TitleGerman:HERSTELLUNGSVERFAHREN FÜR HALBLEITERBAUELEMENT[2021/09]
English:MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE[2021/09]
French:PROCÉDÉ DE FABRICATION POUR DISPOSITIF À SEMI-CONDUCTEUR[2021/09]
Entry into regional phase05.11.2020Translation filed 
05.11.2020National basic fee paid 
05.11.2020Search fee paid 
05.11.2020Designation fee(s) paid 
05.11.2020Examination fee paid 
Examination procedure05.11.2020Examination requested  [2021/09]
08.11.2022Amendment by applicant (claims and/or description)
Fees paidRenewal fee
05.11.2020Renewal fee patent year 03
24.03.2022Renewal fee patent year 04
24.03.2023Renewal fee patent year 05
14.03.2024Renewal fee patent year 06
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Documents cited:Search[A]DE102006033073  (DANFOSS SILICON POWER GMBH [DE]) [A] 1-6,9-15 * paragraphs [0029] - [0033]; figures 1-3 *;
 [A]US2012037688  (KOCK MATHIAS [DE], et al) [A] 1 * figures 1-3 * * paragraphs [0007] - [0009] - [0 38] - [0041] *;
 [XAI]US2014057396  (BEHRENS THOMAS [DE], et al) [X] 1,2,4,6,15 * figures 1, 2 * * paragraphs [0018] - [0037] * [A] 3,9-14 [I] 5;
 [A]US2014061909  (SPECKELS ROLAND [DE], et al) [A] 1 * figures 1-3 * * paragraphs [0022] - [0025] *;
 [A]US2014131898  (SHEARER CATHERINE [US], et al) [A] 1-6,9-15 * figure 1 * * paragraphs [0009] - [0016] - [0 52] - [0063] * * example 3 *;
 [A]US2016365323  (VISWANATHAN LAKSHMINARAYAN [US], et al) [A] 1-6,9-15 * figures 6, 11-14 ** paragraphs [0041] - [0044] - [0 52] - [0056] *;
 [A]JP6147176B  (MITSUBISHI ELECTRIC CORP) [A] 1 * figures 1-3 * * paragraphs [0016] - [0027] *
International search[XY]JP2011119767  (SONY CHEM & INF DEVICE CORP) [X] 1-2, 4, 6, 15- 18 * , paragraphs [0001], [0029]-[0056], fig. 3-6 * [Y] 5, 9;
 [X]JP2011171688  (SONY CHEM & INF DEVICE CORP) [X] 10-11, 13 * , paragraphs [0001], [0020]-[0063], fig. 3-10 *;
 [A]JP2011253939  (SONY CHEM & INF DEVICE CORP) [A] 1-18 * , paragraphs [0001], [0017]-[0064], fig. 2-10 *;
 [A]JP2011253940  (SONY CHEM & INF DEVICE CORP) [A] 1-18* , paragraphs [0001], [0014]-[0071], fig. 2-11 *;
 [Y]JP2017147293  (HITACHI CHEMICAL CO LTD) [Y] 5, 9 * , paragraphs [0001], [0054]-[0057], [0062], [0063], fig. 2, 6 (Family: none) *;
 [Y]JP2018060850  (NITTO DENKO CORP) [Y] 5, 9 * , paragraphs [0001], [0091]-[0097], fig. 2-4 *
by applicantJP2002192370
 WO2008065728
 JP2013039580
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.