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EP3799122
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EP About this file: EP3799122
| EP3799122 - SOLID-STATE IMAGE CAPTURE ELEMENT AND METHOD OF MANUFACTURING SAME [Right-click to bookmark this link] | Status | The patent has been granted Status updated on 22.08.2024 Database last updated on 02.11.2024 | |
| Former | Grant of patent is intended Status updated on 23.04.2024 | ||
| Former | Request for examination was made Status updated on 26.02.2021 | ||
| Former | The international publication has been made Status updated on 30.11.2019 | Most recent event Tooltip | 22.08.2024 | (Expected) grant | published on 25.09.2024 [2024/39] | Applicant(s) | For all designated states Sony Group Corporation 1-7-1 Konan Minato-ku Tokyo 108-0075 / JP | For all designated states Sony Semiconductor Solutions Corporation 4-14-1 Asahi-cho Atsugi-shi, Kanagawa 243-0014 / JP | [2021/30] |
| Former [2021/13] | For all designated states Sony Corporation 1-7-1 Konan Minato-ku 108-0075 Tokyo / JP | ||
| For all designated states Sony Semiconductor Solutions Corporation 4-14-1 Asahi-cho Atsugi-shi, Kanagawa 243-0014 / JP | Inventor(s) | 01 /
JOEI, Masahiro c/o SONY SEMICONDUCTOR SOLUTIONS CORPORATION, 4- 14-1, Asahi-cho Atsugi-shi, Kanagawa 243-0014 / JP | 02 /
MURATA, Kenichi c/o SONY SEMICONDUCTOR SOLUTIONS CORPORATION, 4-14-1, Asahi-cho Atsugi-shi, Kanagawa 243-0014 / JP | 03 /
KOGA, Fumihiko c/o SONY SEMICONDUCTOR SOLUTIONS CORPORATION, 4-14-1, Asahi-cho Atsugi-shi, Kanagawa 243-0014 / JP | 04 /
YAGI, Iwao c/o SONY SEMICONDUCTOR SOLUTIONS CORPORATION, 4-14-1, Asahi-cho Atsugi-shi, Kanagawa 243-0014 / JP | 05 /
HIRATA, Shintarou c/o SONY SEMICONDUCTOR SOLUTIONS CORPORATION, 4-14-1, Asahi-cho Atsugi-shi, Kanagawa 243-0014 / JP | 06 /
TOGASHI, Hideaki c/o SONY SEMICONDUCTOR MANUFACTURING CORPORATION 4000-1, Ooaza-Haramizu, Kikuyo-machi Kikuchi-gun, Kumamoto 869-1102 / JP | 07 /
SAITO, Yosuke c/o SONY CORPORATION, 1-7-1, Konan, Minato-ku Tokyo 108-0075 / JP | [2021/13] | Representative(s) | Müller Hoffmann & Partner Patentanwälte mbB St.-Martin-Straße 58 81541 München / DE | [2024/39] |
| Former [2021/13] | Müller Hoffmann & Partner Patentanwälte mbB St.-Martin-Strasse 58 81541 München / DE | Application number, filing date | 19807172.2 | 19.04.2019 | [2021/13] | WO2019JP16889 | Priority number, date | JP20180097228 | 21.05.2018 Original published format: JP 2018097228 | [2021/13] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2019225250 | Date: | 28.11.2019 | Language: | JA | [2019/48] | Type: | A1 Application with search report | No.: | EP3799122 | Date: | 31.03.2021 | Language: | EN | [2021/13] | Type: | B1 Patent specification | No.: | EP3799122 | Date: | 25.09.2024 | Language: | EN | [2024/39] | Search report(s) | International search report - published on: | JP | 28.11.2019 | (Supplementary) European search report - dispatched on: | EP | 26.05.2021 | Classification | IPC: | H01L27/146 | [2024/17] | CPC: |
H01L27/14667 (EP);
H01L27/14616 (EP,KR);
H01L27/14612 (US);
H01L21/3205 (EP);
H01L21/768 (EP);
H01L21/8234 (EP);
H01L23/522 (EP);
H01L27/088 (EP);
H01L27/14636 (EP,KR,US);
H01L27/14638 (EP);
H01L27/1464 (EP,KR);
H01L27/14647 (EP);
H01L27/14683 (KR);
H01L27/14685 (US);
H01L29/41 (US);
H01L29/423 (EP);
H01L29/43 (EP);
H01L29/49 (EP);
H01L29/786 (EP);
H04N25/76 (EP,KR);
H04N25/771 (US);
H10K39/32 (EP,KR,US)
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| Former IPC [2021/25] | H01L27/146, H01L27/30 | ||
| Former IPC [2021/13] | H01L27/146, H01L21/3205, H01L21/768, H01L21/8234, H01L23/522, H01L27/088, H01L27/30, H01L29/423, H01L29/43, H01L29/49, H01L29/786, H04N5/374 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2021/13] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | FESTKÖRPERBILDAUFNAHMEELEMENT UND VERFAHREN ZUR HERSTELLUNG DAVON | [2021/13] | English: | SOLID-STATE IMAGE CAPTURE ELEMENT AND METHOD OF MANUFACTURING SAME | [2021/13] | French: | ÉLÉMENT DE CAPTURE D'IMAGE À SEMI-CONDUCTEUR ET SON PROCÉDÉ DE FABRICATION | [2021/13] | Entry into regional phase | 06.11.2020 | Translation filed | 06.11.2020 | National basic fee paid | 06.11.2020 | Search fee paid | 06.11.2020 | Designation fee(s) paid | 06.11.2020 | Examination fee paid | Examination procedure | 06.11.2020 | Examination requested [2021/13] | 15.12.2021 | Amendment by applicant (claims and/or description) | 24.04.2024 | Communication of intention to grant the patent | 19.08.2024 | Fee for grant paid | 19.08.2024 | Fee for publishing/printing paid | 19.08.2024 | Receipt of the translation of the claim(s) | Fees paid | Renewal fee | 21.04.2021 | Renewal fee patent year 03 | 20.04.2022 | Renewal fee patent year 04 | 20.04.2023 | Renewal fee patent year 05 | 18.04.2024 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US2007120045 (YOKOYAMA DAISUKE [JP]); | [XA]US2015349008 (YAMAGUCHI TETSUJI [JP]); | [A]JP2018060910 (SONY SEMICONDUCTOR SOLUTIONS CORP); | US2019259815 [ ] (KATAOKA TOYOTAKA [JP], et al) | International search | [Y]JPH1065137 (SONY CORP); | [Y]JP2014053553 (SHARP KK); | [XYA]WO2014112279 (SONY CORP [JP]); | [Y]JP2017055085 (TOSHIBA CORP); | [Y]WO2017169314 (SONY CORP [JP]); | [Y]JP2018060910 (SONY SEMICONDUCTOR SOLUTIONS CORP) | by applicant | JP2003332551 | JP2005051115 | JP2009105381 | JP2009535819 | JP2009267912 | JP2011029337 | JP2017157816 |