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EP3818372
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EP About this file: EP3818372
| EP3818372 - METHODS AND APPARATUSES FOR PACKAGING AN ULTRASOUND-ON-A-CHIP [Right-click to bookmark this link] | Status | The patent has been granted Status updated on 27.09.2024 Database last updated on 25.12.2024 | |
| Former | Grant of patent is intended Status updated on 27.05.2024 | ||
| Former | Request for examination was made Status updated on 09.04.2021 | ||
| Former | The international publication has been made Status updated on 11.01.2020 | Most recent event Tooltip | 27.09.2024 | (Expected) grant | published on 30.10.2024 [2024/44] | Applicant(s) | For all designated states BFLY Operations, Inc. 1600 District Ave. Burlington, MA 01803 / US | [2024/44] |
| Former [2023/21] | For all designated states BFLY Operations, Inc. 1600 District Ave. Burlington, MA 01803 / US | ||
| Former [2021/19] | For all designated states Butterfly Network, Inc. 530 Old Whitfield Street Guilford, CT 06437 / US | Inventor(s) | 01 /
LIU, Jianwei 40932 Canto Place Fremont, CA 94539 / US | 02 /
FIFE, Keith, G. 635 Matadero Avenue Palo Alto, CA 94306 / US | [2021/19] | Representative(s) | Osha BWB 2, rue de la Paix 75002 Paris / FR | [2024/44] |
| Former [2021/19] | Hoffmann Eitle Patent- und Rechtsanwälte PartmbB Arabellastraße 30 81925 München / DE | Application number, filing date | 19830619.3 | 03.07.2019 | [2021/19] | WO2019US40516 | Priority number, date | US201862694810P | 06.07.2018 Original published format: US 201862694810 P | [2021/19] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2020010207 | Date: | 09.01.2020 | Language: | EN | [2020/02] | Type: | A1 Application with search report | No.: | EP3818372 | Date: | 12.05.2021 | Language: | EN | The application published by WIPO in one of the EPO official languages on 09.01.2020 takes the place of the publication of the European patent application. | [2021/19] | Type: | B1 Patent specification | No.: | EP3818372 | Date: | 30.10.2024 | Language: | EN | [2024/44] | Search report(s) | International search report - published on: | US | 09.01.2020 | (Supplementary) European search report - dispatched on: | EP | 04.03.2022 | Classification | IPC: | G01N29/22, A61B8/00, B81B7/00, G01N29/24 | [2022/14] | CPC: |
B06B1/02 (EP,KR);
H01L21/6835 (EP,KR);
H01L23/3128 (EP,KR,US);
A61B8/44 (US);
B06B1/0655 (KR);
B06B1/0688 (EP);
B81B7/007 (EP);
G01N29/24 (EP);
H01L21/56 (EP);
H01L21/568 (EP,KR,US);
H01L23/49816 (US);
H01L23/49822 (US);
H01L23/49827 (US);
H01L23/49894 (US);
H01L24/19 (EP,KR);
H01L24/32 (EP,KR,US);
H01L24/83 (EP,KR,US);
A61B8/4483 (EP,KR);
B81B2201/0271 (EP);
B81B2207/098 (EP);
G01N2291/02475 (EP);
G01S7/52079 (EP,KR);
H01L2221/68345 (EP,KR);
H01L2221/68359 (EP,KR);
H01L2221/68372 (EP,KR);
H01L2221/68381 (EP,KR);
H01L2224/16235 (US);
H01L2224/24227 (EP,KR);
H01L2224/32225 (EP,KR,US);
H01L2224/73253 (US);
H01L2224/73267 (EP,KR);
H01L2224/83192 (EP,KR);
H01L2224/8384 (US);
H01L2224/92244 (EP,KR);
H01L24/16 (US);
H01L24/73 (EP,KR,US);
|
| Former IPC [2021/19] | G01N29/22, A61B8/00 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2021/19]
| Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | VERFAHREN UND VORRICHTUNGEN ZUM VERPACKEN VON ULTRASCHALL-ON-A-CHIP | [2021/19] | English: | METHODS AND APPARATUSES FOR PACKAGING AN ULTRASOUND-ON-A-CHIP | [2021/19] | French: | PROCÉDÉS ET APPAREILS D'ENCAPSULATION D'UNE PUCE À ULTRASONS | [2021/19] | Entry into regional phase | 21.12.2020 | National basic fee paid | 21.12.2020 | Search fee paid | 21.12.2020 | Designation fee(s) paid | 21.12.2020 | Examination fee paid | Examination procedure | 21.12.2020 | Examination requested [2021/19] | 21.09.2022 | Amendment by applicant (claims and/or description) | 28.05.2024 | Communication of intention to grant the patent | 24.09.2024 | Fee for grant paid | 24.09.2024 | Fee for publishing/printing paid | 24.09.2024 | Receipt of the translation of the claim(s) | Fees paid | Renewal fee | 27.07.2021 | Renewal fee patent year 03 | 27.07.2022 | Renewal fee patent year 04 | 27.07.2023 | Renewal fee patent year 05 | 29.07.2024 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US2013237055 (FUNAYA TAKUO [JP], et al); | [XI]CN108155160 (SMIC SEMICONDUCTOR JIANGYIN CO LTD) | International search | [Y]US2006055024 (WEHRLY JAMES D JR [US]); | [Y]US2010133704 (MARIMUTHU PANDI CHELVAM [SG], et al); | [A]US2014113156 (JONCZYK RALF [US], et al); | [A]US2016038974 (GUBBINI ALESSANDRO [US], et al); | [A]US2016133600 (SHEN HONG [US], et al); | [XY]US2016280538 (ROTHBERG JONATHAN M [US], et al); | [A]US2017365774 (ROTHBERG JONATHAN M [US], et al) | Examination | US2012146153 | CN106449554 | by applicant | CN108155160 |