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EP3697182
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EP About this file: EP3697182
| EP3697182 - PCB ASSEMBLY AND MANUFACTURING METHOD THEREOF [Right-click to bookmark this link] | |||
| Former [2020/34] | PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING SAME | ||
| [2024/11] | Status | The patent has been granted Status updated on 24.05.2024 Database last updated on 24.08.2024 | |
| Former | Grant of patent is intended Status updated on 16.02.2024 | ||
| Former | Request for examination was made Status updated on 17.07.2020 | ||
| Former | The international publication has been made Status updated on 07.03.2020 | Most recent event Tooltip | 24.05.2024 | (Expected) grant | published on 26.06.2024 [2024/26] | Applicant(s) | For all designated states LG Energy Solution, Ltd. Tower 1, 108, Yeoui-daero Yeongdeungpo-gu Seoul 07335 / KR | [2024/26] |
| Former [2022/13] | For all designated states LG Energy Solution, Ltd. Tower 1, 108, Yeoui-daero Yeongdeungpo-gu Seoul 07335 / KR | ||
| Former [2022/03] | For all designated states LG Energy Solution Ltd. Tower 1, 108 Yeoui-daero Yeongdeungpo-gu 07335 Seoul / KR | ||
| Former [2020/34] | For all designated states LG CHEM, LTD. 128, Yeoui-daero Yeongdeungpo-gu Seoul 07336 / KR | Inventor(s) | 01 /
YANG, Seung-Min LG Chem Research Park, 188, Munji-ro, Yuseong-Gu Daejeon 34122 / KR | 02 /
KIM, Hak-In LG Chem Research Park, 188, Munji-ro, Yuseong-Gu Daejeon 34122 / KR | [2020/34] | Representative(s) | Plasseraud IP 104 Rue de Richelieu CS92104 75080 Paris Cedex 02 / FR | [N/P] |
| Former [2024/26] | Plasseraud IP 66, rue de la Chaussée d'Antin 75440 Paris Cedex 09 / FR | ||
| Former [2020/34] | Plasseraud IP 66, rue de la Chaussée d'Antin 75440 Paris Cedex 09 / FR | Application number, filing date | 19855897.5 | 08.08.2019 | [2020/34] | WO2019KR10011 | Priority number, date | KR20180101582 | 28.08.2018 Original published format: KR 20180101582 | [2020/34] | Filing language | KO | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2020045851 | Date: | 05.03.2020 | Language: | KO | [2020/10] | Type: | A1 Application with search report | No.: | EP3697182 | Date: | 19.08.2020 | Language: | EN | [2020/34] | Type: | B1 Patent specification | No.: | EP3697182 | Date: | 26.06.2024 | Language: | EN | [2024/26] | Search report(s) | International search report - published on: | KR | 05.03.2020 | (Supplementary) European search report - dispatched on: | EP | 26.05.2021 | Classification | IPC: | H05K1/14, H01R12/58, H05K3/36, H01R12/52 | [2021/09] | CPC: |
H05K3/366 (EP,KR,US);
H05K1/145 (KR);
H01R12/52 (EP,US);
H01R12/58 (EP,KR,US);
H05K1/115 (US);
H05K1/148 (EP);
H05K2201/09036 (EP);
H05K2201/0949 (EP);
H05K2201/10287 (EP);
H05K2201/10295 (EP,US);
H05K2201/10303 (KR);
H05K2201/10363 (EP);
H05K2201/10757 (EP,US);
H05K2203/0195 (EP);
H05K2203/1446 (EP,US);
Y02E60/10 (EP)
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| Former IPC [2020/34] | H05K1/14, H01R12/58, H05K3/36 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2020/34] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | LEITERPLATTEN-BAUGRUPPE UND VERFAHREN ZU DEREN HERSTELLUNG | [2024/11] | English: | PCB ASSEMBLY AND MANUFACTURING METHOD THEREOF | [2024/11] | French: | ASSEMBLAGE DE CIRCUITS IMPRIMÉS ET SON PROCÉDÉ DE FABRICATION | [2024/11] |
| Former [2020/34] | LEITERPLATTENANORDNUNG UND VERFAHREN ZU IHRER HERSTELLUNG | ||
| Former [2020/34] | PRINTED CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING SAME | ||
| Former [2020/34] | ENSEMBLE DE CARTES DE CIRCUIT IMPRIMÉ ET PROCÉDÉ DE FABRICATION DE CELLE-CI | Entry into regional phase | 13.05.2020 | Translation filed | 13.05.2020 | National basic fee paid | 13.05.2020 | Search fee paid | 13.05.2020 | Designation fee(s) paid | 13.05.2020 | Examination fee paid | Examination procedure | 13.05.2020 | Examination requested [2020/34] | 07.12.2021 | Amendment by applicant (claims and/or description) | 16.02.2024 | Communication of intention to grant the patent | 17.05.2024 | Fee for grant paid | 17.05.2024 | Fee for publishing/printing paid | 17.05.2024 | Receipt of the translation of the claim(s) | Fees paid | Renewal fee | 24.08.2021 | Renewal fee patent year 03 | 23.08.2022 | Renewal fee patent year 04 | 24.08.2023 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US4742183 (SOLOWAY RICHARD [US], et al); | [Y]GB2229129 (CHANG TED SZU); | [A]US4995156 (PINNAVAIA GIUSEPPE R [IT]); | [A]JPH10224007 (AIWA CO); | [XAYI]EP1220587 (XEROX CORP [US]); | [Y]DE102007046493 (CONTINENTAL AUTOMOTIVE GMBH [DE]) | International search | [Y]JP2000277881 (DENSO CORP); | [Y]JP2004311813 (MATSUSHITA ELECTRIC IND CO LTD); | [A]JP2005056952 (OPTREX KK); | [A]KR20130053865 (LG INNOTEK CO LTD [KR]); | [A]US2018168042 (HARTMAN JEFFREY DAVID [US]) | by applicant | KR20180101582 |