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EP3745450
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EP About this file: EP3745450
| EP3745450 - CU ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | The patent has been granted Status updated on 26.07.2024 Database last updated on 14.11.2024 | |
| Former | Grant of patent is intended Status updated on 18.03.2024 | ||
| Former | Request for examination was made Status updated on 30.10.2020 | ||
| Former | The international publication has been made Status updated on 28.03.2020 | Most recent event Tooltip | 26.07.2024 | (Expected) grant | published on 28.08.2024 [2024/35] | Applicant(s) | For all designated states NIPPON STEEL Chemical & Material Co., Ltd. 13-1, Nihonbashi 1-chome Chuo-ku Tokyo 103-0027 / JP | For all designated states Nippon Micrometal Corporation 158-1, Oaza-Sayamagahara Iruma-shi Saitama 358-0032 / JP | [2020/49] | Inventor(s) | 01 /
OYAMADA Tetsuya c/o NIPPON STEEL CORPORATION, 6-1, Marunouchi 2- chome, Chiyoda-ku Tokyo 100-8071 / JP | 02 /
UNO Tomohiro c/o NIPPON STEEL CORPORATION, 6-1, Marunouchi 2- chome, Chiyoda-ku Tokyo 100-8071 / JP | 03 /
YAMADA Takashi c/o NIPPON MICROMETAL CORPORATION, 158-1 Oaza Sayamagahara Iruma-shi, Saitama 358-0032 / JP | 04 /
ODA Daizo c/o NIPPON MICROMETAL CORPORATION, 158-1 Oaza Sayamagahara Iruma-shi, Saitama 358-0032 / JP | [2020/49] | Representative(s) | Vossius & Partner Patentanwälte Rechtsanwälte mbB Siebertstrasse 3 81675 München / DE | [2020/49] | Application number, filing date | 19862668.1 | 20.09.2019 | [2020/49] | WO2019JP37023 | Priority number, date | JP20180177261 | 21.09.2018 Original published format: JP 2018177261 | [2020/49] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2020059856 | Date: | 26.03.2020 | Language: | JA | [2020/13] | Type: | A1 Application with search report | No.: | EP3745450 | Date: | 02.12.2020 | Language: | EN | [2020/49] | Type: | B1 Patent specification | No.: | EP3745450 | Date: | 28.08.2024 | Language: | EN | [2024/35] | Search report(s) | International search report - published on: | JP | 26.03.2020 | (Supplementary) European search report - dispatched on: | EP | 16.05.2023 | Classification | IPC: | C22C9/00, C22C9/06, H01L23/00, C22F1/08 | [2023/24] | CPC: |
H01L24/45 (EP,KR,US);
C22C9/00 (EP,US);
C22C9/06 (EP,KR);
C22F1/08 (EP);
H01L24/48 (EP,KR);
H01L2224/05624 (EP);
H01L2224/43848 (EP);
H01L2224/45015 (EP);
H01L2224/45105 (US);
H01L2224/45109 (US);
H01L2224/45139 (US);
H01L2224/45144 (US);
H01L2224/45147 (EP,KR,US);
H01L2224/45155 (US);
H01L2224/45164 (US);
H01L2224/45169 (US);
H01L2224/48824 (EP);
H01L2224/85065 (EP);
H01L2224/85075 (EP);
H01L23/49 (US);
H01L24/05 (EP);
H01L2924/01015 (US);
H01L2924/01032 (US);
H01L2924/10253 (EP);
| C-Set: |
H01L2224/05624, H01L2924/00014 (EP);
H01L2224/45015, H01L2924/20752 (EP);
H01L2224/45147, H01L2924/01015 (EP);
H01L2224/45147, H01L2924/01028 (EP);
H01L2224/45147, H01L2924/01031 (EP);
H01L2224/45147, H01L2924/01032 (EP);
H01L2224/45147, H01L2924/01046 (EP);
H01L2224/45147, H01L2924/01047 (EP);
H01L2224/45147, H01L2924/01049 (EP);
H01L2224/45147, H01L2924/01078 (EP);
H01L2224/45147, H01L2924/01079 (EP);
H01L2224/45147, H01L2924/01204 (EP);
H01L2224/45147, H01L2924/01205 (EP);
H01L2224/45147, H01L2924/01206 (EP); |
| Former IPC [2020/49] | H01L21/60, C22C9/00, C22C9/06 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2020/49] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | BONDDRAHT AUS CU-LEGIERUNG FÜR HALBLEITERBAUELEMENT | [2020/49] | English: | CU ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE | [2020/49] | French: | FIL DE CONNEXION EN ALLIAGE DE CUIVRE POUR DISPOSITIF À SEMI-CONDUCTEUR | [2020/49] | Entry into regional phase | 28.08.2020 | Translation filed | 28.08.2020 | National basic fee paid | 28.08.2020 | Search fee paid | 28.08.2020 | Designation fee(s) paid | 28.08.2020 | Examination fee paid | Examination procedure | 28.08.2020 | Examination requested [2020/49] | 12.12.2023 | Amendment by applicant (claims and/or description) | 19.03.2024 | Communication of intention to grant the patent | 17.07.2024 | Fee for grant paid | 17.07.2024 | Fee for publishing/printing paid | 17.07.2024 | Receipt of the translation of the claim(s) | Fees paid | Renewal fee | 23.09.2021 | Renewal fee patent year 03 | 20.09.2022 | Renewal fee patent year 04 | 21.09.2023 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JP2011035020 (NIPPON STEEL MATERIALS CO LTD, et al); | [A]EP2461358 (NIPPON STEEL MATERIALS CO LTD [JP], et al); | [A]EP2993693 (NIPPON MICROMETAL CORP [JP], et al); | [A]EP3131113 (NIPPON MICROMETAL CORP [JP], et al); | [A]WO2018155283 (NIPPON STEEL & SUMIKIN MAT CO [JP], et al) | International search | [A]JP2004228541 (NIPPON STEEL CORP); | [A]JP2011035020 (NIPPON STEEL MATERIALS CO LTD, et al); | [A]WO2015152191 (NIPPON MICROMETAL CORP [JP], et al); | [A]WO2017221434 (NIPPON MICROMETAL CORP [JP], et al) | by applicant | WO2009093554 | JP2011091404 |