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Extract from the Register of European Patents

EP About this file: EP3876522

EP3876522 - ELECTRONIC CIRCUIT, SOLID-STATE IMAGING ELEMENT, AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT [Right-click to bookmark this link]
StatusExamination is in progress
Status updated on  31.03.2023
Database last updated on 02.11.2024
FormerRequest for examination was made
Status updated on  06.08.2021
FormerThe international publication has been made
Status updated on  09.05.2020
Most recent event   Tooltip19.09.2024New entry: Renewal fee paid 
Applicant(s)For all designated states
Sony Semiconductor Solutions Corporation
4-14-1 Asahi-cho
Atsugi-shi, Kanagawa 243-0014 / JP
[2021/36]
Inventor(s)01 / ZHU, Hongbo
c/o Sony Semiconductor
Solutions Corporation
4-14-1 Asahi-cho
Atsugi-shi, Kanagawa 243-0014 / JP
 [2021/36]
Representative(s)Müller Hoffmann & Partner
Patentanwälte mbB
St.-Martin-Straße 58
81541 München / DE
[N/P]
Former [2021/36]Müller Hoffmann & Partner
Patentanwälte mbB
St.-Martin-Strasse 58
81541 München / DE
Application number, filing date19878858.018.09.2019
[2021/36]
WO2019JP36628
Priority number, dateJP2018020342030.10.2018         Original published format: JP 2018203420
[2021/36]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2020090272
Date:07.05.2020
Language:JA
[2020/19]
Type: A1 Application with search report 
No.:EP3876522
Date:08.09.2021
Language:EN
[2021/36]
Search report(s)International search report - published on:JP07.05.2020
(Supplementary) European search report - dispatched on:EP15.11.2021
ClassificationIPC:H04N5/335, H04N5/363, H04N5/3745, G06G7/18, H03F3/45, H03F3/08
[2021/50]
CPC:
H03F3/082 (EP); H04N25/76 (US); G06G7/18 (US);
H03F3/45179 (EP); H04N25/00 (EP); H04N25/40 (US);
H04N25/47 (EP); H04N25/60 (US); H04N25/65 (EP);
H04N25/707 (EP); H04N25/77 (EP); H03F2200/78 (EP);
H03F2203/45394 (EP) (-)
Former IPC [2021/36]H04N5/374, G06G7/18, H03F3/45
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2021/36]
TitleGerman:ELEKTRONISCHER STROMKREIS, BILDERZEUGENDES FESTKÖRPERELEMENT, UND HERSTELLUNGSVERFAHREN FÜR DEN ELEKTRONISCHEN STROMKREIS[2021/36]
English:ELECTRONIC CIRCUIT, SOLID-STATE IMAGING ELEMENT, AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT[2021/36]
French:CIRCUIT ÉLECTRONIQUE, ÉLÉMENT D'IMAGERIE À SEMI-CONDUCTEURS, ET PROCÉDÉ DE FABRICATION DE CIRCUIT ÉLECTRONIQUE[2021/36]
Entry into regional phase24.03.2021Translation filed 
24.03.2021National basic fee paid 
24.03.2021Search fee paid 
24.03.2021Designation fee(s) paid 
24.03.2021Examination fee paid 
Examination procedure24.03.2021Examination requested  [2021/36]
10.06.2022Amendment by applicant (claims and/or description)
31.03.2023Despatch of a communication from the examining division (Time limit: M04)
31.07.2023Reply to a communication from the examining division
14.02.2024Despatch of a communication from the examining division (Time limit: M04)
14.06.2024Reply to a communication from the examining division
23.10.2025Date of oral proceedings
Fees paidRenewal fee
21.09.2021Renewal fee patent year 03
21.09.2022Renewal fee patent year 04
20.09.2023Renewal fee patent year 05
19.09.2024Renewal fee patent year 06
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[XI]US2011242381  (SAKAKIBARA MASAKI [JP], et al);
International search[A]JP2009508085  ;
 [A]JP2010510732  ;
 [A]JP2016501495  ;
 [A]JP2017050853  (SAMSUNG ELECTRONICS CO LTD);
ExaminationUS2005231621
 US2009190018
by applicantJP2016533140
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.