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EP3937235
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EP About this file: EP3937235
| EP3937235 - SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 10.12.2021 Database last updated on 02.11.2024 | |
| Former | The international publication has been made Status updated on 18.09.2020 | Most recent event Tooltip | 05.10.2024 | New entry: Renewal fee paid | Applicant(s) | For all designated states AISIN CORPORATION 2-1 Asahi-machi Kariya-shi Aichi 448-8650 / JP | [2022/02] | Inventor(s) | 01 /
NARUSE, Takanobu c/o Intellectual Property Department AISIN CORPORATION 2-1 Asahi-machi Kariya, Aichi 448-8650 / JP | [N/P] |
| Former [2022/02] | 01 /
NARUSE, Takanobu Kariya, Aichi 448-8650 / JP | Representative(s) | TBK Bavariaring 4-6 80336 München / DE | [2022/02] | Application number, filing date | 19919330.1 | 21.11.2019 | [2022/02] | WO2019JP45554 | Priority number, date | JP20190042559 | 08.03.2019 Original published format: JP 2019042559 | [2022/02] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2020183802 | Date: | 17.09.2020 | Language: | JA | [2020/38] | Type: | A1 Application with search report | No.: | EP3937235 | Date: | 12.01.2022 | Language: | EN | [2022/02] | Search report(s) | International search report - published on: | JP | 17.09.2020 | (Supplementary) European search report - dispatched on: | EP | 29.03.2022 | Classification | IPC: | H01L23/538, H01L23/50, H01L25/04 | [2022/17] | CPC: |
H01L23/5386 (EP,KR);
H01L25/18 (EP,KR,US);
H01L23/49838 (US);
H01L23/50 (EP);
H01L23/5286 (KR);
H01L23/5384 (KR);
H01L24/16 (EP,US);
H01L25/0655 (US);
H01L25/16 (EP);
H05K1/0231 (EP);
H05K1/141 (EP);
H05K1/181 (KR);
H05K3/4007 (KR);
H01L2224/16225 (EP);
H01L2224/16227 (US);
H01L23/49816 (EP);
H01L23/5385 (EP);
H01L2924/1205 (US);
H01L2924/1431 (US);
H01L2924/1434 (US);
H05K2201/10159 (EP);
H05K2201/10545 (EP)
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| Former IPC [2022/02] | H01L25/04 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2022/02] | Title | German: | HALBLEITERMODUL UND HALBLEITERBAUELEMENT | [2022/02] | English: | SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE | [2022/02] | French: | MODULE SEMICONDUCTEUR ET DISPOSITIF SEMICONDUCTEUR | [2022/02] | Entry into regional phase | 22.06.2021 | Translation filed | 22.06.2021 | National basic fee paid | 22.06.2021 | Search fee paid | 22.06.2021 | Designation fee(s) paid | 22.06.2021 | Examination fee paid | Examination procedure | 22.06.2021 | Examination requested [2022/02] | 23.09.2022 | Amendment by applicant (claims and/or description) | Fees paid | Renewal fee | 22.06.2021 | Renewal fee patent year 03 | 13.10.2022 | Renewal fee patent year 04 | 29.09.2023 | Renewal fee patent year 05 | 04.10.2024 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]EP3309828 (RENESAS ELECTRONICS CORP [JP]) [Y] 12 * figure 7 *; | [XAYI]US2018204827 (BETSUI TAKAFUMI [JP], et al) [X] 1-6,11,13 * figures 2,8,29 * [A] 7-9 [Y] 12 [I] 10; | [E]EP3937234 (AISIN CORP [JP]) [E] 1-13* the whole document * | International search | [A]WO2016046987 (RENESAS ELECTRONICS CORP [JP])[A] 1-13 | by applicant | WO2017038905 |