Extract from the Register of European Patents

EP About this file: EP3696750

EP3696750 - SYSTEMS AND METHODS PROVIDING PATTERN RECOGNITION AND DATA ANALYSIS IN WELDING AND CUTTING [Right-click to bookmark this link]
StatusThe patent has been granted
Status updated on  06.06.2025
Database last updated on 21.03.2026
FormerGrant of patent is intended
Status updated on  30.01.2025
FormerExamination is in progress
Status updated on  03.04.2021
FormerRequest for examination was made
Status updated on  26.02.2021
FormerThe application has been published
Status updated on  17.07.2020
Most recent event   Tooltip06.02.2026Lapse of the patent in a contracting state
New state(s): ES
published on 11.03.2026  [2026/11]
Applicant(s)For all designated states
Lincoln Global, Inc.
9160 Norwalk Boulevard
Santa Fe Springs, CA 90670 / US
[2020/34]
Inventor(s)01 / Daniel, Joseph A.
Lincoln
7946 North Gannett Road
Sagamore Hills, OH 44067 / US
 [2020/34]
Representative(s)Grosse Schumacher Knauer von Hirschhausen
Patent- und Rechtsanwälte
Schloss Schellenberg - Backhaus
Renteilichtung 1
45134 Essen / DE
[2025/28]
Former [2020/34]Grosse Schumacher Knauer von Hirschhausen
Patent- und Rechtsanwälte
Frühlingstrasse 43A
45133 Essen / DE
Application number, filing date20157943.018.02.2020
[2020/34]
Priority number, dateUS20191627823218.02.2019         Original published format: US201916278232
[2020/34]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP3696750
Date:19.08.2020
Language:EN
[2020/34]
Type: B1 Patent specification 
No.:EP3696750
Date:09.07.2025
Language:EN
[2025/28]
Search report(s)(Supplementary) European search report - dispatched on:EP07.05.2020
ClassificationIPC:G05B19/418, B23K31/12, B23K9/095, G05B23/02, G06Q10/06
[2025/07]
CPC:
G06Q10/06 (EP,US); B23K9/095 (BR,KR,US); G05B19/406 (KR);
B23K10/00 (CN); B23K10/006 (CN); B23K10/02 (CN);
B23K31/125 (EP,KR); B23K9/013 (KR); B23K9/0953 (EP);
B23K9/127 (KR); B23K9/16 (KR); B23Q17/0966 (BR);
G05B19/408 (KR); G05B19/4183 (EP); G05B23/0283 (EP);
G06F18/23 (KR,US); G05B2219/45104 (EP); G05B2219/45135 (KR);
Y02P80/40 (EP); Y02P90/02 (EP); Y02P90/80 (EP) (-)
Former IPC [2020/34]G06Q10/06, B23K31/12, G05B23/02
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2021/13]  
Former [2020/34]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:SYSTEME UND METHODEN ZUR MUSTERERKENNUNG UND DATENANALYSE BEIM SCHWEISSEN UND SCHNEIDEN[2020/34]
English:SYSTEMS AND METHODS PROVIDING PATTERN RECOGNITION AND DATA ANALYSIS IN WELDING AND CUTTING[2020/34]
French:SYSTÈMES ET PROCÉDÉS FOURNISSANT UNE RECONNAISSANCE DE MOTIF ET UNE ANALYSE DE DONNÉES DANS LE SOUDAGE ET LA DÉCOUPE[2020/34]
Examination procedure19.02.2021Amendment by applicant (claims and/or description)
19.02.2021Examination requested  [2021/13]
19.02.2021Date on which the examining division has become responsible
08.04.2021Despatch of a communication from the examining division (Time limit: M06)
18.10.2021Reply to a communication from the examining division
31.03.2023Despatch of a communication from the examining division (Time limit: M06)
17.04.2023Cancellation of oral proceeding that was planned for 25.04.2023
25.04.2023Date of oral proceedings (cancelled)
10.10.2023Reply to a communication from the examining division
31.01.2025Communication of intention to grant the patent
02.06.2025Fee for grant paid
02.06.2025Fee for publishing/printing paid
02.06.2025Receipt of the translation of the claim(s)
Fees paidRenewal fee
17.02.2022Renewal fee patent year 03
15.02.2023Renewal fee patent year 04
23.02.2024Renewal fee patent year 05
24.02.2025Renewal fee patent year 06
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Lapses during opposition  TooltipES09.07.2025
HR09.07.2025
PL09.07.2025
NO09.10.2025
RS09.10.2025
GR10.10.2025
IS09.11.2025
[2026/11]
Former [2026/10]HR09.07.2025
PL09.07.2025
NO09.10.2025
RS09.10.2025
GR10.10.2025
IS09.11.2025
Former [2026/09]HR09.07.2025
NO09.10.2025
GR10.10.2025
IS09.11.2025
Former [2026/08]HR09.07.2025
NO09.10.2025
IS09.11.2025
Former [2026/07]IS09.11.2025
Documents cited:Search[I] US2017032281  (HSU CHRISTOPHER et al.)
 [I] US2013075380  (ALBRECH BRUCE PATRICK et al.) [I] 1-15 * figures 1-9 * * paragraph [0064] * * paragraph [0087] * * paragraph [0100] * * claims 1-33 *
 [A] WO2014143532  (ILLINOIS TOOL WORKS et al.) [A] 1-15 * figures 1-9 * * claims 1-25 *
 [A]   YUAN BAO ET AL: "Massive sensor data management framework in Cloud manufacturing based on Hadoop", INDUSTRIAL INFORMATICS (INDIN), 2012 10TH IEEE INTERNATIONAL CONFERENCE ON, IEEE, 25 July 2012 (2012-07-25), pages 397 - 401, XP032235317, ISBN: 978-1-4673-0312-5, DOI: 10.1109/INDIN.2012.6301192

DOI:   http://dx.doi.org/10.1109/INDIN.2012.6301192
by applicantUS8224881
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