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Extract from the Register of European Patents

EP About this file: EP3890039

EP3890039 - METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
Former [2021/40]SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
[2023/45]
StatusNo opposition filed within time limit
Status updated on  28.02.2025
Database last updated on 14.03.2026
FormerThe patent has been granted
Status updated on  22.03.2024
FormerGrant of patent is intended
Status updated on  13.12.2023
FormerExamination is in progress
Status updated on  25.03.2022
FormerRequest for examination was made
Status updated on  24.12.2021
FormerThe application has been published
Status updated on  03.09.2021
Most recent event   Tooltip30.01.2026Lapse of the patent in a contracting state
New state(s): IT		published on 04.03.2026  [2026/10]
Applicant(s)For all designated states
United Microelectronics Corp.
No.3, Li-Hsin Road 2
Science-Based Industrial Park
Hsin-Chu City 300 / TW
[2024/43]
Former [2024/15]For all designated states
United Microelectronics Corp.
No. 3, Li-Hsin Rd. 2
Science-Based Industrial Park
Hsin-Chu City 300 / TW
Former [2021/40]For all designated states
United Microelectronics Corp.
No. 3, Lin-Hsin Rd. 2
Science-Based Industrial Park
Hsin-Chu City 300 / TW
Inventor(s)01 / WU, Jia-Rong
No.1, Ln. 16, Heping Rd.,
Linyuan Dist.
Kaohsiung City 832 / TW
02 / CHANG, I-Fan
Tainan City 741 / TW
03 / HUANG, Rai-Min
4F., No.25, Aly. 56, Ln. 258, Sec. 6,
Yanping N. Rd.
Taipei City 111 / TW
04 / TSAI, Ya-Huei
5F.-10, No.166, Yuping Rd.,
Anping Dist.
Tainan City 708 / TW
05 / WANG, Yu-Ping
20F.-11, No. 201, Beida Rd.,
North Dist.
Hsinchu City 300 / TW
 [2024/17]
Former [2024/02]01 / WU, Jia-Rong
No.1, Ln. 16, Heping Rd.,
Linyuan Dist.
Kaohsiung City 832 / TW
02 / CHANG, I-Fan
11F., No.98, Ln. 185, Xinzhuang St.
Hsinchu City 300 / TW
03 / HUANG, Rai-Min
4F., No.25, Aly. 56, Ln. 258, Sec. 6,
Yanping N. Rd.
Taipei City 111 / TW
04 / TSAI, Ya-Huei
5F.-10, No.166, Yuping Rd.,
Anping Dist.
Tainan City 708 / TW
05 / WANG, Yu-Ping
20F.-11, No. 201, Beida Rd.,
North Dist.
Hsinchu City 300 / TW
Former [2021/40]01 / WU, Jia-Rong
No.1, Ln. 16, Heping Rd., Linyuan Dist.
832 Kaohsiung City / TW
02 / CHANG, I-Fan
11F., No.98, Ln. 185, Xinzhuang St.
300 Hsinchu City / TW
03 / HUANG, Rai-Min
4F., No.25, Aly. 56, Ln. 258, Sec. 6,
Yanping N. Rd.
111 Taipei City / TW
04 / TSAI, Ya-Huei
5F.-10, No.166, Yuping Rd., Anping Dist.
708 Tainan City / TW
05 / WANG, Yu-Ping
20F.-11, No. 201, Beida Rd., North Dist.
300 Hsinchu City / TW
Representative(s)Isarpatent
Patent- und Rechtsanwälte Barth
Charles Hassa Peckmann & Partner mbB
Friedrichstrasse 31
80801 München / DE
[2021/40]
Application number, filing date20176885.027.05.2020
[2021/40]
Priority number, dateCN20201023526630.03.2020         Original published format: CN202010235266
[2021/40]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP3890039
Date:06.10.2021
Language:EN
[2021/40]
Type: B1 Patent specification 
No.:EP3890039
Date:24.04.2024
Language:EN
[2024/17]
Search report(s)(Supplementary) European search report - dispatched on:EP17.11.2020
ClassificationIPC:H10B61/00, H10N50/01, H10N50/10, H10N50/80
[2023/45]
CPC:
H10B61/00 (EP,CN,US); G11C11/161 (EP,US); H01F10/3254 (US);
H01F41/34 (US); H10B61/22 (CN); H10N50/01 (EP,CN,US);
H10N50/10 (EP,CN); H10N50/80 (EP,US); H10N50/85 (EP,CN,US);
H10W20/42 (US); H10W20/43 (US) (-)
Former IPC [2021/40]H01L43/02, H01L43/08, H01L43/12, H01L27/22, G11C11/16
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2022/04]
Former [2021/40]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERELEMENTS[2023/45]
English:METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE[2023/45]
French:PROCÉDÉ DE FABRICATION D'UN DISPOSITIF SEMICONDUCTEUR[2023/45]
Former [2021/40]HALBLEITERBAUELEMENT UND VERFAHREN ZUR HERSTELLUNG DAVON
Former [2021/40]SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Former [2021/40]DISPOSITIF SEMICONDUCTEUR ET SON PROCÉDÉ DE FABRICATION
Examination procedure17.12.2021Amendment by applicant (claims and/or description)
17.12.2021Examination requested  [2022/04]
17.12.2021Date on which the examining division has become responsible
25.03.2022Despatch of a communication from the examining division (Time limit: M04)
15.07.2022Reply to a communication from the examining division
30.01.2023Despatch of a communication from the examining division (Time limit: M04)
22.05.2023Reply to a communication from the examining division
14.12.2023Communication of intention to grant the patent
15.03.2024Fee for grant paid
15.03.2024Fee for publishing/printing paid
15.03.2024Receipt of the translation of the claim(s)
Divisional application(s)EP24160422.2  / EP4355064
Opposition(s)27.01.2025No opposition filed within time limit [2025/14]
Fees paidRenewal fee
21.03.2022Renewal fee patent year 03
21.03.2023Renewal fee patent year 04
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Lapses during opposition  TooltipCY27.05.2020
HU27.05.2020
AT24.04.2024
BG24.04.2024
CZ24.04.2024
DK24.04.2024
EE24.04.2024
ES24.04.2024
FI24.04.2024
HR24.04.2024
IT24.04.2024
LV24.04.2024
MC24.04.2024
NL24.04.2024
PL24.04.2024
RO24.04.2024
SE24.04.2024
SI24.04.2024
SK24.04.2024
SM24.04.2024
IE27.05.2024
LU27.05.2024
BE31.05.2024
CH31.05.2024
FR24.06.2024
GB24.07.2024
NO24.07.2024
RS24.07.2024
GR25.07.2024
IS24.08.2024
PT26.08.2024
[2026/10]
Former [2025/43]CY27.05.2020
HU27.05.2020
AT24.04.2024
BG24.04.2024
CZ24.04.2024
DK24.04.2024
EE24.04.2024
ES24.04.2024
FI24.04.2024
HR24.04.2024
LV24.04.2024
MC24.04.2024
NL24.04.2024
PL24.04.2024
RO24.04.2024
SE24.04.2024
SI24.04.2024
SK24.04.2024
SM24.04.2024
IE27.05.2024
LU27.05.2024
BE31.05.2024
CH31.05.2024
FR24.06.2024
GB24.07.2024
NO24.07.2024
RS24.07.2024
GR25.07.2024
IS24.08.2024
PT26.08.2024
Former [2025/42]HU27.05.2020
AT24.04.2024
BG24.04.2024
CZ24.04.2024
DK24.04.2024
EE24.04.2024
ES24.04.2024
FI24.04.2024
HR24.04.2024
LV24.04.2024
MC24.04.2024
NL24.04.2024
PL24.04.2024
RO24.04.2024
SE24.04.2024
SI24.04.2024
SK24.04.2024
SM24.04.2024
IE27.05.2024
LU27.05.2024
BE31.05.2024
CH31.05.2024
FR24.06.2024
GB24.07.2024
NO24.07.2024
RS24.07.2024
GR25.07.2024
IS24.08.2024
PT26.08.2024
Former [2025/41]HU27.05.2020
AT24.04.2024
BG24.04.2024
CZ24.04.2024
DK24.04.2024
EE24.04.2024
ES24.04.2024
FI24.04.2024
HR24.04.2024
LV24.04.2024
MC24.04.2024
NL24.04.2024
PL24.04.2024
RO24.04.2024
SI24.04.2024
SK24.04.2024
SM24.04.2024
IE27.05.2024
LU27.05.2024
BE31.05.2024
CH31.05.2024
FR24.06.2024
GB24.07.2024
NO24.07.2024
RS24.07.2024
GR25.07.2024
IS24.08.2024
PT26.08.2024
Former [2025/23]AT24.04.2024
BG24.04.2024
CZ24.04.2024
DK24.04.2024
EE24.04.2024
ES24.04.2024
FI24.04.2024
HR24.04.2024
LV24.04.2024
MC24.04.2024
NL24.04.2024
PL24.04.2024
RO24.04.2024
SI24.04.2024
SK24.04.2024
SM24.04.2024
IE27.05.2024
LU27.05.2024
BE31.05.2024
CH31.05.2024
FR24.06.2024
GB24.07.2024
NO24.07.2024
RS24.07.2024
GR25.07.2024
IS24.08.2024
PT26.08.2024
Former [2025/22]AT24.04.2024
BG24.04.2024
CZ24.04.2024
DK24.04.2024
EE24.04.2024
ES24.04.2024
FI24.04.2024
HR24.04.2024
LV24.04.2024
MC24.04.2024
NL24.04.2024
PL24.04.2024
RO24.04.2024
SI24.04.2024
SK24.04.2024
SM24.04.2024
IE27.05.2024
LU27.05.2024
BE31.05.2024
CH31.05.2024
NO24.07.2024
RS24.07.2024
GR25.07.2024
IS24.08.2024
PT26.08.2024
Former [2025/11]AT24.04.2024
BG24.04.2024
CZ24.04.2024
DK24.04.2024
EE24.04.2024
ES24.04.2024
FI24.04.2024
HR24.04.2024
LV24.04.2024
MC24.04.2024
NL24.04.2024
PL24.04.2024
RO24.04.2024
SK24.04.2024
SM24.04.2024
LU27.05.2024
CH31.05.2024
NO24.07.2024
RS24.07.2024
GR25.07.2024
IS24.08.2024
PT26.08.2024
Former [2025/10]AT24.04.2024
BG24.04.2024
CZ24.04.2024
DK24.04.2024
EE24.04.2024
ES24.04.2024
FI24.04.2024
HR24.04.2024
LV24.04.2024
NL24.04.2024
PL24.04.2024
RO24.04.2024
SK24.04.2024
SM24.04.2024
LU27.05.2024
NO24.07.2024
RS24.07.2024
GR25.07.2024
IS24.08.2024
PT26.08.2024
Former [2025/09]AT24.04.2024
BG24.04.2024
DK24.04.2024
EE24.04.2024
ES24.04.2024
FI24.04.2024
HR24.04.2024
LV24.04.2024
NL24.04.2024
PL24.04.2024
LU27.05.2024
NO24.07.2024
RS24.07.2024
GR25.07.2024
IS24.08.2024
PT26.08.2024
Former [2025/08]AT24.04.2024
BG24.04.2024
DK24.04.2024
ES24.04.2024
FI24.04.2024
HR24.04.2024
LV24.04.2024
NL24.04.2024
PL24.04.2024
LU27.05.2024
NO24.07.2024
RS24.07.2024
GR25.07.2024
IS24.08.2024
PT26.08.2024
Former [2024/49]AT24.04.2024
BG24.04.2024
ES24.04.2024
FI24.04.2024
HR24.04.2024
LV24.04.2024
NL24.04.2024
PL24.04.2024
NO24.07.2024
RS24.07.2024
GR25.07.2024
IS24.08.2024
PT26.08.2024
Former [2024/48]AT24.04.2024
BG24.04.2024
ES24.04.2024
FI24.04.2024
HR24.04.2024
NL24.04.2024
NO24.07.2024
GR25.07.2024
IS24.08.2024
PT26.08.2024
Former [2024/47]BG24.04.2024
FI24.04.2024
HR24.04.2024
NL24.04.2024
NO24.07.2024
GR25.07.2024
IS24.08.2024
PT26.08.2024
Former [2024/46]BG24.04.2024
FI24.04.2024
HR24.04.2024
NL24.04.2024
NO24.07.2024
IS24.08.2024
Former [2024/44]NL24.04.2024
Documents cited:Search[X] US2019378971  (CHU CHUNG-LIANG et al.)
 [X] US2020083428  (WENG CHEN-YI et al.) [X] 1-5,8-12,14 * paragraph [0011] - paragraph [0025]; figures 1, 2 *
 [X] US2019206928  (LI PINGHUI et al.) [X] 1,8 * paragraph [0023] - paragraph [0024]; figure 7 *
ExaminationUS2009085132
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.