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Extract from the Register of European Patents

EP About this file: EP3963635

EP3963635 - THROUGH-SILICON-VIA FABRICATION IN PLANAR QUANTUM DEVICES [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  04.02.2022
Database last updated on 29.10.2024
FormerThe international publication has been made
Status updated on  06.11.2020
Formerunknown
Status updated on  18.04.2020
Most recent event   Tooltip26.03.2024New entry: Renewal fee paid 
Applicant(s)For all designated states
International Business Machines Corporation
New Orchard Road
Armonk, New York 10504 / US
[2022/10]
Inventor(s)01 / RUBIN, Joshua
IBM CORPORATION 257 FULLER ROAD
ALBANY New York, 12203 / US
02 / HERTZBERG, Jared
IBM CORPORATION PO BOX 218 1101 KITCHAWAN ROAD
YORKTOWN HEIGHTS New York, 10598 / US
03 / ROSENBLATT, Sami
IBM CORPORATION PO BOX 218 1101 KITCHAWAN ROAD
YORKTOWN HEIGHTS New York, 10598 / US
04 / VIVEKANANDA, Adiga
IBM CORPORATION PO BOX 218 1101 KITCHAWAN ROAD
YORKTOWN HEIGHTS New York, 10598 / US
05 / BRINK, Markus
IBM CORPORATION PO BOX 218 1101 KITCHAWAN ROAD
YORKTOWN HEIGHTS New York, 10598 / US
06 / KUMAR, Arvind
IBM CORPORATION
PO BOX 218
1101 KITCHAWAN ROAD
YORKTOWN HEIGHTS New York, 10598 / US
 [2022/10]
Representative(s)RPK Patentanwälte Reinhardt und Kaufmann Partnerschaft mbB
Gaisburgstraße 21
70182 Stuttgart / DE
[N/P]
Former [2022/10]RPK Patentanwälte Reinhardt, Pohlmann und Kaufmann Partnerschaft mbB
Gaisburgstrasse 21
70182 Stuttgart / DE
Application number, filing date20717098.620.03.2020
[2022/10]
WO2020EP57766
Priority number, dateUS20191639699229.04.2019         Original published format: US201916396992
[2022/10]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2020221510
Date:05.11.2020
Language:EN
[2020/45]
Type: A1 Application with search report 
No.:EP3963635
Date:09.03.2022
Language:EN
The application published by WIPO in one of the EPO official languages on 05.11.2020 takes the place of the publication of the European patent application.
[2022/10]
Search report(s)International search report - published on:EP05.11.2020
ClassificationIPC:H01L27/18, G06N10/00, H01L23/532, H01L39/02, H01L39/24
[2022/10]
CPC:
H01L21/76898 (EP,IL,KR,US); G06N20/10 (EP,IL,KR); H10N60/0241 (EP,KR);
H10N60/805 (US); H01L21/32058 (IL,US); H01L23/481 (EP,IL,KR,US);
H01L23/53285 (IL,US); H10N60/0912 (US); H10N60/12 (US);
H10N60/80 (EP,KR); H10N69/00 (EP,KR) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2022/10]
TitleGerman:SILICIUMDURCHKONTAKTIERUNGSHERSTELLUNG IN PLANAREN QUANTENVORRICHTUNGEN[2022/10]
English:THROUGH-SILICON-VIA FABRICATION IN PLANAR QUANTUM DEVICES[2022/10]
French:FABRICATION DE TROU D'INTERCONNEXION TRAVERSANT LE SILICIUM DANS DES DISPOSITIFS QUANTIQUES PLANS[2022/10]
Entry into regional phase24.11.2021National basic fee paid 
24.11.2021Designation fee(s) paid 
24.11.2021Examination fee paid 
Examination procedure24.11.2021Amendment by applicant (claims and/or description)
24.11.2021Examination requested  [2022/10]
24.11.2021Date on which the examining division has become responsible
Fees paidRenewal fee
17.03.2022Renewal fee patent year 03
07.03.2023Renewal fee patent year 04
25.03.2024Renewal fee patent year 05
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited inInternational search[IY]US2017373044  (DAS RABINDRA N [US], et al);
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.