EP3963635 - THROUGH-SILICON-VIA FABRICATION IN PLANAR QUANTUM DEVICES [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 04.02.2022 Database last updated on 29.10.2024 | |
Former | The international publication has been made Status updated on 06.11.2020 | ||
Former | unknown Status updated on 18.04.2020 | Most recent event Tooltip | 26.03.2024 | New entry: Renewal fee paid | Applicant(s) | For all designated states International Business Machines Corporation New Orchard Road Armonk, New York 10504 / US | [2022/10] | Inventor(s) | 01 /
RUBIN, Joshua IBM CORPORATION 257 FULLER ROAD ALBANY New York, 12203 / US | 02 /
HERTZBERG, Jared IBM CORPORATION PO BOX 218 1101 KITCHAWAN ROAD YORKTOWN HEIGHTS New York, 10598 / US | 03 /
ROSENBLATT, Sami IBM CORPORATION PO BOX 218 1101 KITCHAWAN ROAD YORKTOWN HEIGHTS New York, 10598 / US | 04 /
VIVEKANANDA, Adiga IBM CORPORATION PO BOX 218 1101 KITCHAWAN ROAD YORKTOWN HEIGHTS New York, 10598 / US | 05 /
BRINK, Markus IBM CORPORATION PO BOX 218 1101 KITCHAWAN ROAD YORKTOWN HEIGHTS New York, 10598 / US | 06 /
KUMAR, Arvind IBM CORPORATION PO BOX 218 1101 KITCHAWAN ROAD YORKTOWN HEIGHTS New York, 10598 / US | [2022/10] | Representative(s) | RPK Patentanwälte Reinhardt und Kaufmann Partnerschaft mbB Gaisburgstraße 21 70182 Stuttgart / DE | [N/P] |
Former [2022/10] | RPK Patentanwälte Reinhardt, Pohlmann und Kaufmann Partnerschaft mbB Gaisburgstrasse 21 70182 Stuttgart / DE | Application number, filing date | 20717098.6 | 20.03.2020 | [2022/10] | WO2020EP57766 | Priority number, date | US201916396992 | 29.04.2019 Original published format: US201916396992 | [2022/10] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2020221510 | Date: | 05.11.2020 | Language: | EN | [2020/45] | Type: | A1 Application with search report | No.: | EP3963635 | Date: | 09.03.2022 | Language: | EN | The application published by WIPO in one of the EPO official languages on 05.11.2020 takes the place of the publication of the European patent application. | [2022/10] | Search report(s) | International search report - published on: | EP | 05.11.2020 | Classification | IPC: | H01L27/18, G06N10/00, H01L23/532, H01L39/02, H01L39/24 | [2022/10] | CPC: |
H01L21/76898 (EP,IL,KR,US);
G06N20/10 (EP,IL,KR);
H10N60/0241 (EP,KR);
H10N60/805 (US);
H01L21/32058 (IL,US);
H01L23/481 (EP,IL,KR,US);
H01L23/53285 (IL,US);
H10N60/0912 (US);
H10N60/12 (US);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2022/10] | Title | German: | SILICIUMDURCHKONTAKTIERUNGSHERSTELLUNG IN PLANAREN QUANTENVORRICHTUNGEN | [2022/10] | English: | THROUGH-SILICON-VIA FABRICATION IN PLANAR QUANTUM DEVICES | [2022/10] | French: | FABRICATION DE TROU D'INTERCONNEXION TRAVERSANT LE SILICIUM DANS DES DISPOSITIFS QUANTIQUES PLANS | [2022/10] | Entry into regional phase | 24.11.2021 | National basic fee paid | 24.11.2021 | Designation fee(s) paid | 24.11.2021 | Examination fee paid | Examination procedure | 24.11.2021 | Amendment by applicant (claims and/or description) | 24.11.2021 | Examination requested [2022/10] | 24.11.2021 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 17.03.2022 | Renewal fee patent year 03 | 07.03.2023 | Renewal fee patent year 04 | 25.03.2024 | Renewal fee patent year 05 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Cited in | International search | [IY]US2017373044 (DAS RABINDRA N [US], et al); |