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Extract from the Register of European Patents

EP About this file: EP4071788

EP4071788 - CHIP TRAY FOR SELF-ASSEMBLY AND METHOD FOR SUPPLYING SEMICONDUCTOR LIGHT EMITTING DIODE [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  09.09.2022
Database last updated on 10.07.2024
FormerThe international publication has been made
Status updated on  27.03.2021
Most recent event   Tooltip23.03.2024Amendment by applicant 
Applicant(s)For all designated states
LG Electronics Inc.
128, Yeoui-daero
Yeongdeungpo-gu
Seoul 07336 / KR
[2022/41]
Inventor(s)01 / YANG, Inbum
IP Center, LG Electronics Inc., 19, Yangjae-daero
11-gil, Seocho-gu
Seoul 06772 / KR
02 / RHO, Junghun
IP Center, LG Electronics Inc., 19, Yangjae-daero
11-gil, Seocho-gu
Seoul 06772 / KR
03 / JUNG, Sangsik
IP Center, LG Electronics Inc., 19, Yangjae-daero
11-gil, Seocho-gu
Seoul 06772 / KR
04 / CHOI, Bongwoon
IP Center, LG Electronics Inc., 19, Yangjae-daero
11-gil, Seocho-gu
Seoul 06772 / KR
 [2022/41]
Representative(s)Vossius & Partner Patentanwälte Rechtsanwälte mbB
Siebertstraße 3
81675 München / DE
[2022/41]
Application number, filing date20866298.113.02.2020
[2022/41]
WO2020KR02020
Priority number, dateKR2019011557419.09.2019         Original published format: KR 20190115574
KR2020000886122.01.2020         Original published format: KR 20200008861
[2022/41]
Filing languageKO
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2021054547
Date:25.03.2021
Language:KO
[2021/12]
Type: A1 Application with search report 
No.:EP4071788
Date:12.10.2022
Language:EN
[2022/41]
Search report(s)International search report - published on:KR25.03.2021
(Supplementary) European search report - dispatched on:EP16.01.2024
ClassificationIPC:H01L33/00, H01L25/075, H01L21/673, H01L21/67, H01L21/68, H01L23/00
[2024/07]
CPC:
H01L21/67144 (EP); H01L33/005 (US); H01L21/67333 (EP);
H01L21/68 (EP); H01L24/95 (EP); H01L25/0753 (EP,US);
H01L33/00 (EP); H01L33/0095 (EP); H01L2224/95001 (EP);
H01L2224/95101 (EP); H01L2224/95144 (EP); H01L2924/12041 (EP) (-)
Former IPC [2022/41]H01L21/677, H01L21/673, H01L21/68, H01L21/67, H01L33/00
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2022/41]
TitleGerman:CHIPSCHALE FÜR SELBSTMONTAGE UND VERFAHREN ZUR VERSORGUNG EINER LICHTEMITTIERENDEN HALBLEITERDIODE[2022/41]
English:CHIP TRAY FOR SELF-ASSEMBLY AND METHOD FOR SUPPLYING SEMICONDUCTOR LIGHT EMITTING DIODE[2022/41]
French:PLATEAU À PUCES POUR AUTO-ASSEMBLAGE ET PROCÉDÉ D'ALIMENTATION D'UNE DIODE ÉLECTROLUMINESCENTE À SEMI-CONDUCTEUR[2022/41]
Entry into regional phase12.07.2022Translation filed 
12.07.2022National basic fee paid 
12.07.2022Search fee paid 
12.07.2022Designation fee(s) paid 
12.07.2022Examination fee paid 
Examination proceduredeletedDeletion: Application deemed to be withdrawn, date of legal effect  [2022/41]
12.05.2022Despatch of communication that the application is deemed to be withdrawn, reason: filing fee / search fee not paid in time  [2022/41]
12.07.2022Examination requested  [2022/41]
22.03.2024Amendment by applicant (claims and/or description)
22.03.2024Date on which the examining division has become responsible
Request for further processing for:The application is deemed to be withdrawn due to non-payment of designation fees
SM, DK, AL, TR, SK, SI, SE, RS, RO, PT, PL, NO, NL, MT, MK, MC, LV, LU, LT, IT, IS, IE, HU, HR, GR, GB, FR, FI, ES, EE, DE, CZ, CY, CH, BG, BE, AT
12.07.2022Request for further processing filed
12.07.2022Full payment received (date of receipt of payment)
Request granted
26.07.2022Decision despatched
The application is deemed to be withdrawn due to failure to file the translation
12.07.2022Request for further processing filed
12.07.2022Full payment received (date of receipt of payment)
Request granted
26.07.2022Decision despatched
The application is deemed to be withdrawn due to non-payment of the search fee
12.07.2022Request for further processing filed
12.07.2022Full payment received (date of receipt of payment)
Request granted
26.07.2022Decision despatched
12.07.2022Request for further processing filed
12.07.2022Full payment received (date of receipt of payment)
Request granted
26.07.2022Decision despatched
The application is deemed to be withdrawn due to non-payment of the filing fee
12.07.2022Request for further processing filed
12.07.2022Full payment received (date of receipt of payment)
Request granted
26.07.2022Decision despatched
The application is deemed to be withdrawn due to non-payment of the examination fee
12.07.2022Request for further processing filed
12.07.2022Full payment received (date of receipt of payment)
Request granted
26.07.2022Decision despatched
12.07.2022Request for further processing filed
12.07.2022Full payment received (date of receipt of payment)
Request granted
26.07.2022Decision despatched
Fees paidRenewal fee
12.07.2022Renewal fee patent year 03
28.02.2023Renewal fee patent year 04
26.02.2024Renewal fee patent year 05
Penalty fee
Additional fee for renewal fee
19.04.202203   M06   Fee paid on   12.07.2022
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Documents cited:Search[YA]US2012291950  (SUGIYAMA MASAHIKO [JP], et al) [Y] 6,7 * paragraphs [0026] - [0095]; figure 1 *[A] 1-5,8-10;
 [XY]US2018102352  (SASAKI KENJI [US], et al) [X] 1-5,8-10 * paragraphs [0048] - [0094]; figures 1-16 * [Y] 6,7
International search[Y]JPH09153541  (FUJITSU LTD) [Y] 6-7 * See paragraph [0011] and figures 1-2. *;
 [Y]KR20170026957  (SAMSUNG DISPLAY CO LTD [KR]) [Y] 1-10 * See paragraphs [0043]-[0054] and figures 5-9. *;
 [Y]KR20170071514  (RENSSELAER POLYTECH INST [US]) [Y] 1-10 * See paragraphs [0066]-[0070] and figures 12-14. *;
 [A]KR20190017691  (UNIV KOREA RES & BUS FOUND [KR]) [A] 1-10 * See paragraphs [0027]-[0029] and figures 1-2. *;
 [A]KR20190099164  (LG ELECTRONICS INC [KR]) [A] 1-10* See paragraphs [0107]-[0130] and figures 7-8. *
by applicantUS9825202
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