EP3896694 - WRITE OPERATION CIRCUIT, SEMICONDUCTOR MEMORY, AND WRITE OPERATION METHOD [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 10.05.2024 Database last updated on 22.08.2024 | |
Former | The patent has been granted Status updated on 02.06.2023 | ||
Former | Grant of patent is intended Status updated on 16.04.2023 | ||
Former | Request for examination was made Status updated on 17.09.2021 | ||
Former | The international publication has been made Status updated on 01.05.2021 | Most recent event Tooltip | 02.08.2024 | Lapse of the patent in a contracting state New state(s): SI | published on 04.09.2024 [2024/36] | Applicant(s) | For all designated states Changxin Memory Technologies, Inc. No. 388, Xingye Avenue Airport Industrial Park Economic and Technological Development Area Hefei City, Anhui 230000 / CN | [2023/27] |
Former [2021/42] | For all designated states Changxin Memory Technologies, Inc. No. 388, Xingye Avenue Airport Industrial Park Economic and Technological Development Area 230000 Hefei City, Anhui / CN | Inventor(s) | 01 /
ZHANG, Liang Unit 801, 802, 805 (9th Floor, Nominal Floor), Building 1 No. 1438, Hongqiao Road Changning District Shanghai 200336 / CN | [2023/27] |
Former [2021/42] | 01 /
ZHANG, Liang Unit 801, 802, 805 (9th Floor, Nominal Floor), Building 1 No. 1438, Hongqiao Road, Changning District Shanghai 200336 / CN | Representative(s) | V.O. P.O. Box 87930 2508 DH Den Haag / NL | [2021/42] | Application number, filing date | 20878752.3 | 22.06.2020 | [2021/42] | WO2020CN97504 | Priority number, date | CN20191121460 | 25.10.2019 Original published format: CN201911021460 | [2021/42] | Filing language | ZH | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2021077783 | Date: | 29.04.2021 | Language: | ZH | [2021/17] | Type: | A1 Application with search report | No.: | EP3896694 | Date: | 20.10.2021 | Language: | EN | [2021/42] | Type: | B1 Patent specification | No.: | EP3896694 | Date: | 05.07.2023 | Language: | EN | [2023/27] | Search report(s) | International search report - published on: | CN | 29.04.2021 | (Supplementary) European search report - dispatched on: | EP | 14.02.2022 | Classification | IPC: | G11C11/409, G11C7/10 | [2022/11] | CPC: |
G06F13/1668 (EP,US);
G11C11/409 (CN);
G11C11/4093 (EP,US);
G11C11/4096 (EP,US);
G11C7/1006 (EP);
G11C7/1048 (EP);
G11C7/1084 (EP);
H03M9/00 (EP,US);
G11C7/10 (US);
|
Former IPC [2021/42] | G11C11/409 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2021/42] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | SCHREIBOPERATIONSSCHALTUNG, HALBLEITERSPEICHER UND SCHREIBOPERATIONSVERFAHREN | [2021/42] | English: | WRITE OPERATION CIRCUIT, SEMICONDUCTOR MEMORY, AND WRITE OPERATION METHOD | [2021/42] | French: | CIRCUIT D'OPÉRATION D'ÉCRITURE, MÉMOIRE À SEMI-CONDUCTEURS, ET PROCÉDÉ D'OPÉRATION D'ÉCRITURE | [2021/42] | Entry into regional phase | 14.07.2021 | Translation filed | 14.07.2021 | National basic fee paid | 14.07.2021 | Search fee paid | 14.07.2021 | Designation fee(s) paid | 14.07.2021 | Examination fee paid | Examination procedure | 14.07.2021 | Examination requested [2021/42] | 02.09.2022 | Amendment by applicant (claims and/or description) | 17.04.2023 | Communication of intention to grant the patent | 25.05.2023 | Fee for grant paid | 25.05.2023 | Fee for publishing/printing paid | 25.05.2023 | Receipt of the translation of the claim(s) | Opposition(s) | 08.04.2024 | No opposition filed within time limit [2024/24] | Fees paid | Renewal fee | 22.03.2022 | Renewal fee patent year 03 | 31.03.2023 | Renewal fee patent year 04 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 05.07.2023 | CZ | 05.07.2023 | DK | 05.07.2023 | EE | 05.07.2023 | ES | 05.07.2023 | FI | 05.07.2023 | HR | 05.07.2023 | IT | 05.07.2023 | LT | 05.07.2023 | LV | 05.07.2023 | NL | 05.07.2023 | PL | 05.07.2023 | RO | 05.07.2023 | RS | 05.07.2023 | SE | 05.07.2023 | SI | 05.07.2023 | SK | 05.07.2023 | SM | 05.07.2023 | NO | 05.10.2023 | GR | 06.10.2023 | IS | 05.11.2023 | PT | 06.11.2023 | [2024/36] |
Former [2024/27] | AT | 05.07.2023 | |
CZ | 05.07.2023 | ||
DK | 05.07.2023 | ||
EE | 05.07.2023 | ||
ES | 05.07.2023 | ||
FI | 05.07.2023 | ||
HR | 05.07.2023 | ||
IT | 05.07.2023 | ||
LT | 05.07.2023 | ||
LV | 05.07.2023 | ||
NL | 05.07.2023 | ||
PL | 05.07.2023 | ||
RO | 05.07.2023 | ||
RS | 05.07.2023 | ||
SE | 05.07.2023 | ||
SK | 05.07.2023 | ||
SM | 05.07.2023 | ||
NO | 05.10.2023 | ||
GR | 06.10.2023 | ||
IS | 05.11.2023 | ||
PT | 06.11.2023 | ||
Former [2024/23] | AT | 05.07.2023 | |
CZ | 05.07.2023 | ||
DK | 05.07.2023 | ||
EE | 05.07.2023 | ||
ES | 05.07.2023 | ||
FI | 05.07.2023 | ||
HR | 05.07.2023 | ||
LT | 05.07.2023 | ||
LV | 05.07.2023 | ||
NL | 05.07.2023 | ||
PL | 05.07.2023 | ||
RO | 05.07.2023 | ||
RS | 05.07.2023 | ||
SE | 05.07.2023 | ||
SK | 05.07.2023 | ||
SM | 05.07.2023 | ||
NO | 05.10.2023 | ||
GR | 06.10.2023 | ||
IS | 05.11.2023 | ||
PT | 06.11.2023 | ||
Former [2024/22] | AT | 05.07.2023 | |
CZ | 05.07.2023 | ||
DK | 05.07.2023 | ||
ES | 05.07.2023 | ||
FI | 05.07.2023 | ||
HR | 05.07.2023 | ||
LT | 05.07.2023 | ||
LV | 05.07.2023 | ||
NL | 05.07.2023 | ||
PL | 05.07.2023 | ||
RO | 05.07.2023 | ||
RS | 05.07.2023 | ||
SE | 05.07.2023 | ||
SM | 05.07.2023 | ||
NO | 05.10.2023 | ||
GR | 06.10.2023 | ||
IS | 05.11.2023 | ||
PT | 06.11.2023 | ||
Former [2024/20] | AT | 05.07.2023 | |
ES | 05.07.2023 | ||
FI | 05.07.2023 | ||
HR | 05.07.2023 | ||
LT | 05.07.2023 | ||
LV | 05.07.2023 | ||
NL | 05.07.2023 | ||
PL | 05.07.2023 | ||
RS | 05.07.2023 | ||
SE | 05.07.2023 | ||
SM | 05.07.2023 | ||
NO | 05.10.2023 | ||
GR | 06.10.2023 | ||
IS | 05.11.2023 | ||
PT | 06.11.2023 | ||
Former [2024/10] | AT | 05.07.2023 | |
ES | 05.07.2023 | ||
FI | 05.07.2023 | ||
HR | 05.07.2023 | ||
LT | 05.07.2023 | ||
LV | 05.07.2023 | ||
NL | 05.07.2023 | ||
PL | 05.07.2023 | ||
RS | 05.07.2023 | ||
SE | 05.07.2023 | ||
NO | 05.10.2023 | ||
GR | 06.10.2023 | ||
IS | 05.11.2023 | ||
PT | 06.11.2023 | ||
Former [2024/09] | AT | 05.07.2023 | |
ES | 05.07.2023 | ||
FI | 05.07.2023 | ||
LT | 05.07.2023 | ||
NL | 05.07.2023 | ||
SE | 05.07.2023 | ||
NO | 05.10.2023 | ||
GR | 06.10.2023 | ||
IS | 05.11.2023 | ||
Former [2024/08] | LT | 05.07.2023 | |
NL | 05.07.2023 | ||
NO | 05.10.2023 | ||
GR | 06.10.2023 | ||
Former [2024/05] | NL | 05.07.2023 | Documents cited: | Search | [Y]US6859402 (CAMPBELL BRIAN J [US], et al) [Y] 1-3,6-10 * columns 2-8; figures 1-10 *; | [A]US2015095520 (KWACK SEUNG WOOK [KR]) [A] 1-10* the whole document *; | [YA]US2015356047 (AYYAPUREDDI SUJEET [US], et al) [Y] 1-3,6-10 * paragraphs [0001] , [0 10] - [0044]; figures 1-6 * [A] 4,5; | [A]US10373657 (KONDO CHIKARA [JP], et al) [A] 1-10 * the whole document * | International search | [A]US2010042889 (HARGAN EBRAHIM [US]) [A] 1-10* entire document *; | [A]CN104681085 (INST OF MICROELECTRONICS CAS) [A] 1-10 * entire document *; | [A]CN107545918 (PHISON ELECTRONICS CORP) [A] 1-10 * description, paragraphs 72-78 *; | [A]CN108872837 (CHANGXIN MEMORY TECH INC) [A] 1-10 * entire document *; | [A]CN109582507 (XIAN UNIIC SEMICONDUCTORS CO LTD) [A] 1-10 * description, paragraphs 5-30 *; | [PX]CN210575117U (CHANGXIN STORAGE TECH SHANGHAI CO LTD) [PX] 1-10 * entire document * | by applicant | CN20191121460 |