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EP4083081
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EP About this file: EP4083081
| EP4083081 - ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 30.09.2022 Database last updated on 22.01.2025 | |
| Former | The international publication has been made Status updated on 07.07.2021 | Most recent event Tooltip | 13.11.2024 | New entry: Renewal fee paid | Applicant(s) | For all designated states FUJIFILM Corporation 26-30, Nishiazabu 2-chome Minato-ku Tokyo 106-8620 / JP | [2022/44] | Inventor(s) | 01 /
YOSHIMURA Tsutomu c/o FUJIFILM Corporation, 4000, Kawashiri, Yoshida-cho Haibara-gun, Shizuoka 421-0396 / JP | 02 /
GOTO Akiyoshi c/o FUJIFILM Corporation, 4000, Kawashiri, Yoshida-cho Haibara-gun, Shizuoka 421-0396 / JP | 03 /
KOJIMA Masafumi c/o FUJIFILM Corporation, 4000, Kawashiri, Yoshida-cho Haibara-gun, Shizuoka 421-0396 / JP | 04 /
SAKITA Kyohei c/o FUJIFILM Corporation, 4000, Kawashiri, Yoshida-cho Haibara-gun, Shizuoka 421-0396 / JP | [2022/44] | Representative(s) | HGF HGF Limited 1 City Walk Leeds LS11 9DX / GB | [2022/44] | Application number, filing date | 20905953.4 | 07.12.2020 | [2022/44] | WO2020JP45551 | Priority number, date | JP20190239614 | 27.12.2019 Original published format: JP 2019239614 | [2022/44] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2021131655 | Date: | 01.07.2021 | Language: | JA | [2021/26] | Type: | A1 Application with search report | No.: | EP4083081 | Date: | 02.11.2022 | Language: | EN | [2022/44] | Search report(s) | International search report - published on: | JP | 01.07.2021 | (Supplementary) European search report - dispatched on: | EP | 17.01.2023 | Classification | IPC: | C08F20/38, G03F7/004, G03F7/038, G03F7/039, G03F7/20, C08F2/48, C08F2/50, C08F220/18, C08F220/24, C08F220/38, C09D133/08 | [2023/07] | CPC: |
G03F7/0045 (EP);
G03F7/004 (KR);
G03F7/039 (KR,US);
C08F2/48 (KR);
C08F2/50 (EP);
C08F20/38 (KR);
C08F212/22 (EP);
C08F212/24 (EP);
C08F212/30 (EP);
C08F212/32 (EP);
C08F220/1807 (EP);
C08F220/1808 (EP);
C08F220/1809 (EP);
C08F220/1811 (EP);
C08F220/1812 (EP);
C08F220/1818 (US);
C08F220/24 (EP);
C08F220/382 (EP);
C09D125/18 (EP);
C09D133/08 (EP);
G03F7/038 (KR,US);
| C-Set: |
C08F212/22, C08F220/1808, C08F220/283, C08F220/24 (EP);
C08F212/22, C08F220/1808, C08F220/283, C08F220/283 (EP);
C08F212/24, C08F212/22, C08F220/283, C08F220/382 (EP);
C08F212/30, C08F220/1808, C08F220/283, C08F220/24 (EP);
C08F212/30, C08F220/1808, C08F220/283, C08F220/283 (EP);
C08F212/32, C08F220/1808, C08F220/283, C08F220/24 (EP);
C08F212/32, C08F220/1808, C08F220/283, C08F220/283 (EP);
C08F220/1807, C08F220/24, C08F212/24, C08F220/382 (EP);
C08F220/1808, C08F220/283, C08F220/42, C08F212/32 (EP);
C08F220/1809, C08F220/382, C08F220/06 (EP);
C08F220/1811, C08F220/283, C08F220/382 (EP);
C08F220/1812, C08F220/283, C08F122/40, C08F220/1804 (EP);
C08F220/24, C08F220/1811, C08F220/1808 (EP);
C08F220/382, C08F220/1807 (EP); |
| Former IPC [2022/44] | C08F20/38, G03F7/004, G03F7/038, G03F7/039, G03F7/20 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2022/44] | Title | German: | AKTINISCHE STRAHLUNGSEMPFINDLICHE ODER STRAHLUNGSEMPFINDLICHE HARZZUSAMMENSETZUNG, AKTINISCHE STRAHLUNGSEMPFINDLICHE ODER STRAHLUNGSEMPFINDLICHE FOLIE, VERFAHREN ZUR MUSTERBILDUNG UND VERFAHREN ZUR HERSTELLUNG EINER ELEKTRONISCHEN VORRICHTUNG | [2022/44] | English: | ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | [2022/44] | French: | COMPOSITION DE RÉSINE SENSIBLE AUX RAYONS ACTINIQUES OU SENSIBLE AU RAYONNEMENT, FILM SENSIBLE AUX RAYONS ACTINIQUES OU SENSIBLE AU RAYONNEMENT, PROCÉDÉ DE FORMATION DE MOTIF ET PROCÉDÉ DE FABRICATION DE DISPOSITIF ÉLECTRONIQUE | [2022/44] | Entry into regional phase | 08.06.2022 | Translation filed | 08.06.2022 | National basic fee paid | 08.06.2022 | Search fee paid | 08.06.2022 | Designation fee(s) paid | 08.06.2022 | Examination fee paid | Examination procedure | 08.06.2022 | Examination requested [2022/44] | 09.06.2023 | Amendment by applicant (claims and/or description) | 09.06.2023 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 16.11.2022 | Renewal fee patent year 03 | 15.11.2023 | Renewal fee patent year 04 | 13.11.2024 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US2016004157 (ITO JUNICHI [JP], et al); | [X]JP2017088860 (SUMITOMO CHEMICAL CO); | [XI]JP6493386B | International search | [XA]JP2014178645 (FUJIFILM CORP); | [X]WO2015129832 (JSR CORP [JP]); | [XA]JP2017088860 (SUMITOMO CHEMICAL CO) | Examination | US2019107779 | by applicant | JPH03270227 | JP2002090991 | JP2004235468 | JP2008083384 | US2008248425 | JP2009267112 | US2010020297 | JP2010175859 | JP2011248019 | JP2012032544 | US2012251948 | JP2013011833 | JP2013061648 | JP2013164509 | JP2013209360 | JP2013228681 | WO2014002808 | JP2014010245 | JP2014041328 | JP2014059543 | JP2014134686 | JP2014178645 | US2015004533 | US2016070167 | WO2018074382 | JP2019168475 | JP20190239614 |