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Extract from the Register of European Patents

EP About this file: EP3933914

EP3933914 - PACKAGING STRUCTURE, ELECTRIC VEHICLE AND ELECTRONIC DEVICE [Right-click to bookmark this link]
StatusGrant of patent is intended
Status updated on  03.07.2024
Database last updated on 13.09.2024
FormerRequest for examination was made
Status updated on  03.12.2021
FormerThe international publication has been made
Status updated on  22.10.2021
Formerunknown
Status updated on  27.09.2021
Most recent event   Tooltip03.07.2024New entry: Communication of intention to grant a patent 
Applicant(s)For all designated states
Huawei Digital Power Technologies Co., Ltd.
Office 01, 39th Floor, Block A
Antuoshan Headquarters Towers
33 Antuoshan 6th Road
Futian District
Shenzhen, 518043 / CN
[2022/01]
Inventor(s)01 / LANG, Fengqun
Huawei Administration Building
Bantian
Longgang District
Shenzhen, Guangdong 518129 / CN
02 / LIN, Kaiwen
Huawei Administration Building
Bantian
Longgang District
Shenzhen, Guangdong 518129 / CN
[N/P]
Former [2022/01]01 / LANG, Fengqun
Shenzhen, Guangdong 518129 / CN
02 / LIN, Kaiwen
Shenzhen, Guangdong 518129 / CN
Representative(s)Körber, Martin Hans, et al
Mitscherlich PartmbB
Patent- und Rechtsanwälte
Karlstraße 7
80333 München / DE
[N/P]
Former [2022/01]Körber, Martin Hans
Mitscherlich PartmbB
Patent- und Rechtsanwälte
Sonnenstrasse 33
80331 München / DE
Application number, filing date20926350.816.04.2020
[2022/01]
WO2020CN85092
Filing languageZH
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2021208006
Date:21.10.2021
Language:ZH
[2021/42]
Type: A1 Application with search report 
No.:EP3933914
Date:05.01.2022
Language:EN
[2022/01]
Search report(s)International search report - published on:CN21.10.2021
(Supplementary) European search report - dispatched on:EP21.06.2023
ClassificationIPC:H01L23/488, H01L21/60, H01L25/16, H01L23/00
[2022/01]
CPC:
H01L23/3735 (EP); H01L24/32 (EP,CN); H01L23/24 (CN);
H01L23/4334 (EP); H01L23/49506 (EP); H01L23/49513 (EP);
H01L23/49531 (EP); H01L23/49562 (EP); H01L23/49575 (EP);
H01L23/5385 (EP); H01L24/11 (EP); H01L24/13 (EP);
H01L24/33 (EP); H01L24/48 (EP); H01L24/742 (EP);
H01L24/83 (EP); H01L25/071 (EP); H01L25/16 (CN);
H01L25/18 (EP,CN); H01L2224/1134 (EP); H01L2224/1184 (EP);
H01L2224/13124 (EP); H01L2224/13144 (EP); H01L2224/13147 (EP);
H01L2224/13155 (EP); H01L2224/291 (EP); H01L2224/29199 (EP);
H01L2224/293 (EP); H01L2224/32225 (EP,CN); H01L2224/33181 (EP);
H01L2224/45124 (EP); H01L2224/45147 (EP); H01L2224/45565 (EP);
H01L2224/45624 (EP); H01L2224/48091 (EP); H01L2224/48227 (EP);
H01L2224/73204 (EP); H01L2224/73265 (EP); H01L2224/83101 (EP);
H01L2224/83139 (EP); H01L2224/8314 (EP); H01L2224/83191 (EP);
H01L2224/83192 (EP); H01L2224/83385 (EP); H01L2224/83447 (EP);
H01L2224/83801 (EP); H01L2224/85447 (EP); H01L23/3107 (EP);
H01L23/36 (EP); H01L24/29 (EP); H01L24/45 (EP);
H01L24/73 (EP); H01L2924/13055 (EP); H01L2924/181 (EP) (-)
C-Set:
H01L2224/13124, H01L2924/013, H01L2924/00013 (EP);
H01L2224/13144, H01L2924/013, H01L2924/00013 (EP);
H01L2224/13147, H01L2924/013, H01L2924/00013 (EP);
H01L2224/13155, H01L2924/013, H01L2924/00013 (EP);
H01L2224/29199, H01L2924/00014 (EP);
H01L2224/291, H01L2924/014, H01L2924/00014 (EP);
H01L2224/293, H01L2924/014, H01L2924/00014 (EP);
H01L2224/45124, H01L2924/00014 (EP);
H01L2224/45147, H01L2924/00014 (EP);
H01L2224/45565, H01L2224/45147, H01L2224/45624 (EP);
H01L2224/45624, H01L2924/00014 (EP);
H01L2224/48091, H01L2924/00014 (EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (EP);
H01L2224/83447, H01L2924/00014 (EP);
H01L2224/85447, H01L2924/00014 (EP);
H01L2924/13055, H01L2924/00 (EP);
H01L2924/181, H01L2924/00012 (EP)
(-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2022/01]
TitleGerman:VERPACKUNGSSTRUKTUR, ELEKTRISCHES FAHRZEUG UND ELEKTRONISCHES GERÄT[2022/01]
English:PACKAGING STRUCTURE, ELECTRIC VEHICLE AND ELECTRONIC DEVICE[2022/01]
French:STRUCTURE DE MISE EN BOÎTIER, VÉHICULE ÉLECTRIQUE ET DISPOSITIF ÉLECTRONIQUE[2022/01]
Entry into regional phase27.09.2021Translation filed 
27.09.2021National basic fee paid 
27.09.2021Search fee paid 
27.09.2021Designation fee(s) paid 
27.09.2021Examination fee paid 
Examination procedure27.09.2021Examination requested  [2022/01]
16.01.2024Amendment by applicant (claims and/or description)
04.07.2024Communication of intention to grant the patent
Fees paidRenewal fee
31.03.2022Renewal fee patent year 03
26.04.2023Renewal fee patent year 04
20.03.2024Renewal fee patent year 05
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Documents cited:Search[XI]US2016113107  (WANG TAO [TW], et al);
 [A]US2019341332  (LIN YUSHENG [US], et al)
International search[A]US2006057817  (SONODA JUNICHI [JP], et al) [A] 1-25 * entire document *;
 [A]JP2014060341  (TOSHIBA CORP) [A] 1-25* entire document *;
 [A]CN104103599  (TOSHIBA KK) [A] 1-25 * entire document *;
 [A]CN104701188  (ADL ENGINEERING INC) [A] 1-25 * entire document *;
 [A]CN104882433  (TOSHIBA KK) [A] 1-25 * entire document *;
 [A]CN107785690  (SAMSUNG DISPLAY CO LTD) [A] 1-25 * entire document *;
 [A]CN109755208  (XIAN HUAWEI TECH CO LTD) [A] 1-25 * description paragraphs [0048]-[0084], figures 4-5 *;
 [A]CN109755266  (PLAYNITRIDE DIAPLY TECH CO LTD) [A] 1-25 * entire document *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.