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EP4233090
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EP About this file: EP4233090
| EP4233090 - METHOD OF FORMING TSV-LAST INTERCONNECT IN WAFER ASSEMBLY AND METHOD OF FORMING THE WAFER ASSEMBLY [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 28.07.2023 Database last updated on 27.07.2024 | |
| Former | The international publication has been made Status updated on 02.07.2022 | Most recent event Tooltip | 08.03.2024 | Amendment by applicant | Applicant(s) | For all designated states Huawei Technologies Co., Ltd. Huawei Administration Building Bantian Longgang District Shenzhen, Guangdong 518129 / CN | [2023/35] | Inventor(s) | 01 /
MULLER, Philippe Shenzhen, Guangdong 518129 / CN | 02 /
ZHU, Weihua Shenzhen, Guangdong 518129 / CN | 03 /
HE, Ran Shenzhen, Guangdong 518129 / CN | 04 /
XU, Jeffrey Junhao Shenzhen, Guangdong 518129 / CN | [2023/35] | Representative(s) | Isarpatent Patent- und Rechtsanwälte Barth Charles Hassa Peckmann & Partner mbB Friedrichstrasse 31 80801 München / DE | [2023/35] | Application number, filing date | 20966336.8 | 23.12.2020 | [2023/35] | WO2020CN138451 | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2022133756 | Date: | 30.06.2022 | Language: | EN | [2022/26] | Type: | A1 Application with search report | No.: | EP4233090 | Date: | 30.08.2023 | Language: | EN | The application published by WIPO in one of the EPO official languages on 30.06.2022 takes the place of the publication of the European patent application. | [2023/35] | Search report(s) | International search report - published on: | CN | 30.06.2022 | (Supplementary) European search report - dispatched on: | EP | 06.11.2023 | Classification | IPC: | H01L21/768, H01L25/065, H01L23/485 | [2023/49] | CPC: |
H01L25/50 (EP);
H01L21/76898 (EP);
H01L24/03 (EP);
H01L24/04 (EP);
H01L24/29 (EP);
H01L24/32 (EP);
H01L24/83 (EP);
H01L25/0657 (EP);
H01L2225/06541 (EP);
H01L2225/06565 (EP)
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| Former IPC [2023/35] | H01L21/46 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/35] | Title | German: | VERFAHREN ZUR HERSTELLUNG EINER TSV-LAST-VERBINDUNG IN EINER WAFERANORDNUNG UND VERFAHREN ZUR HERSTELLUNG DER WAFERANORDNUNG | [2023/35] | English: | METHOD OF FORMING TSV-LAST INTERCONNECT IN WAFER ASSEMBLY AND METHOD OF FORMING THE WAFER ASSEMBLY | [2023/35] | French: | PROCÉDÉ DE FORMATION D'INTERCONNEXION À DERNIER TSV DANS UN ENSEMBLE TRANCHE ET PROCÉDÉ DE FORMATION DE L'ENSEMBLE TRANCHE | [2023/35] | Entry into regional phase | 24.05.2023 | National basic fee paid | 24.05.2023 | Search fee paid | 24.05.2023 | Designation fee(s) paid | 24.05.2023 | Examination fee paid | Examination procedure | 24.05.2023 | Examination requested [2023/35] | 07.03.2024 | Amendment by applicant (claims and/or description) | 07.03.2024 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 24.05.2023 | Renewal fee patent year 03 | 29.12.2023 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US2010244251 (TORAZAWA NAOKI [JP], et al) [A] 1-20* paragraphs [0050] - [0097]; figures 1-5 *; | [XAYI]US2014015136 (GAN ZHENGHAO [CN], et al) [X] 1,4-8,11,12,18,19 * paragraphs [0020] - [0052]; figures 3-11 * [A] 2,3,9,10,13,20 [Y] 5 [I] 14-17; | [XAYI]US2017186799 (LIN JENG-SHYAN [TW], et al) [X] 1,4,6,8,11,12 * paragraphs [0022] - [0056]; figures 2, 5-10 * [A] 2,3,9,13,18-20 [Y] 5 [I] 7,10,14-17 |