EP4027380 - ARRANGEMENT COMPRISING AN INTEGRATED CIRCUIT PACKAGE AND A HEATSINK ELEMENT [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 13.01.2023 Database last updated on 31.08.2024 | |
Former | The application has been published Status updated on 10.06.2022 | Most recent event Tooltip | 15.12.2023 | New entry: Renewal fee paid | Applicant(s) | For all designated states Sivers Wireless AB Box 1274 164 29 Kista / SE | [2022/28] | Inventor(s) | 01 /
Öjefors, Erik 753 31 Uppsala / SE | 02 /
Dancila, Dragos 756 59 Uppsala / SE | 03 /
Aziz, Imran 753 12 Uppsala / SE | 04 /
Hanning, Johanna 422 56 Hisings Backa / SE | [2022/28] | Representative(s) | AWA Sweden AB Box 45086 104 30 Stockholm / SE | [2022/28] | Application number, filing date | 21150555.7 | 07.01.2021 | [2022/28] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4027380 | Date: | 13.07.2022 | Language: | EN | [2022/28] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 23.07.2021 | Classification | IPC: | H01L23/367, H01L23/66, H01Q1/22 | [2022/28] | CPC: |
H01Q1/02 (EP);
H01L23/66 (EP,CN,US);
H01L21/4871 (US);
H01L23/367 (EP,CN,US);
H01L23/49816 (US);
H01L23/538 (US);
H01L24/20 (US);
H01Q1/002 (CN);
H01Q1/2283 (EP,CN,US);
H01Q13/02 (EP);
H01L2223/6677 (EP,CN,US);
H01L23/3128 (EP);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/07] |
Former [2022/28] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | ANORDNUNG MIT EINEM INTEGRIERTEN SCHALTUNGSGEHÄUSE UND EINEM KÜHLKÖRPER | [2022/28] | English: | ARRANGEMENT COMPRISING AN INTEGRATED CIRCUIT PACKAGE AND A HEATSINK ELEMENT | [2022/28] | French: | AGENCEMENT COMPRENANT UN BOÎTIER DE CIRCUIT INTÉGRÉ ET UN ÉLÉMENT DE DISSIPATEUR THERMIQUE | [2022/28] | Examination procedure | 11.01.2023 | Amendment by applicant (claims and/or description) | 11.01.2023 | Examination requested [2023/07] | 11.01.2023 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 28.02.2023 | Renewal fee patent year 03 | 14.12.2023 | Renewal fee patent year 04 | Penalty fee | Additional fee for renewal fee | 31.01.2023 | 03   M06   Fee paid on   28.02.2023 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XI]US2014110841 (BEER GOTTFRIED [DE], et al) [X] 1-5,9,11-15 * abstract * * figures 11A,11B * * paragraph [0035] * * paragraphs [0043] , [0100] * * paragraph [0047] * * paragraph [0077] - paragraph [0078] * [I] 6-8,10,16; | [A]US2019355680 (CHUANG PO-YAO [TW], et al) [A] 4-8,10 * abstract ** figure 1E *; | [XI]US2020251414 (HSU SEN-KUEI [TW], et al) [X] 1,3,4,9,11-15 * abstract * * figures 1F,1G,2A-2D,3 * * paragraph [0029] * * paragraphs [0033] - [0038] * [I] 5-8,10 | by applicant | US9583811 |