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Extract from the Register of European Patents

EP About this file: EP4027380

EP4027380 - ARRANGEMENT COMPRISING AN INTEGRATED CIRCUIT PACKAGE AND A HEATSINK ELEMENT [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  13.01.2023
Database last updated on 31.08.2024
FormerThe application has been published
Status updated on  10.06.2022
Most recent event   Tooltip15.12.2023New entry: Renewal fee paid 
Applicant(s)For all designated states
Sivers Wireless AB
Box 1274
164 29 Kista / SE
[2022/28]
Inventor(s)01 / Öjefors, Erik
753 31 Uppsala / SE
02 / Dancila, Dragos
756 59 Uppsala / SE
03 / Aziz, Imran
753 12 Uppsala / SE
04 / Hanning, Johanna
422 56 Hisings Backa / SE
 [2022/28]
Representative(s)AWA Sweden AB
Box 45086
104 30 Stockholm / SE
[2022/28]
Application number, filing date21150555.707.01.2021
[2022/28]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP4027380
Date:13.07.2022
Language:EN
[2022/28]
Search report(s)(Supplementary) European search report - dispatched on:EP23.07.2021
ClassificationIPC:H01L23/367, H01L23/66, H01Q1/22
[2022/28]
CPC:
H01Q1/02 (EP); H01L23/66 (EP,CN,US); H01L21/4871 (US);
H01L23/367 (EP,CN,US); H01L23/49816 (US); H01L23/538 (US);
H01L24/20 (US); H01Q1/002 (CN); H01Q1/2283 (EP,CN,US);
H01Q13/02 (EP); H01L2223/6677 (EP,CN,US); H01L23/3128 (EP);
H01L23/4006 (EP); H01Q9/16 (EP) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2023/07]
Former [2022/28]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:ANORDNUNG MIT EINEM INTEGRIERTEN SCHALTUNGSGEHÄUSE UND EINEM KÜHLKÖRPER[2022/28]
English:ARRANGEMENT COMPRISING AN INTEGRATED CIRCUIT PACKAGE AND A HEATSINK ELEMENT[2022/28]
French:AGENCEMENT COMPRENANT UN BOÎTIER DE CIRCUIT INTÉGRÉ ET UN ÉLÉMENT DE DISSIPATEUR THERMIQUE[2022/28]
Examination procedure11.01.2023Amendment by applicant (claims and/or description)
11.01.2023Examination requested  [2023/07]
11.01.2023Date on which the examining division has become responsible
Fees paidRenewal fee
28.02.2023Renewal fee patent year 03
14.12.2023Renewal fee patent year 04
Penalty fee
Additional fee for renewal fee
31.01.202303   M06   Fee paid on   28.02.2023
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Documents cited:Search[XI]US2014110841  (BEER GOTTFRIED [DE], et al) [X] 1-5,9,11-15 * abstract * * figures 11A,11B * * paragraph [0035] * * paragraphs [0043] , [0100] * * paragraph [0047] * * paragraph [0077] - paragraph [0078] * [I] 6-8,10,16;
 [A]US2019355680  (CHUANG PO-YAO [TW], et al) [A] 4-8,10 * abstract ** figure 1E *;
 [XI]US2020251414  (HSU SEN-KUEI [TW], et al) [X] 1,3,4,9,11-15 * abstract * * figures 1F,1G,2A-2D,3 * * paragraph [0029] * * paragraphs [0033] - [0038] * [I] 5-8,10
by applicantUS9583811
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