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EP4056309
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EP About this file: EP4056309
| EP4056309 - DEVICE AND METHOD FOR LASER CUTTING A WORKPIECE AND PRODUCING WORKPIECE PARTS [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 21.07.2023 Database last updated on 15.11.2024 | |
| Former | The application has been published Status updated on 12.08.2022 | Most recent event Tooltip | 21.07.2023 | Application deemed to be withdrawn | published on 23.08.2023 [2023/34] | Applicant(s) | For all designated states Bystronic Laser AG Industriestrasse 21 3362 Niederönz / CH | [2022/37] | Inventor(s) | 01 /
Haas, Titus 4800 Zofingen / CH | 02 /
Scheidiger, Simon 4900 Langenthal / CH | 03 /
Steinlin, Markus 8053 Zürich / CH | 04 /
Berger, Michael 3005 Bern / CH | [2022/37] | Representative(s) | Patentanwälte Geyer, Fehners & Partner mbB Perhamerstrasse 31 80687 München / DE | [2022/37] | Application number, filing date | 21161527.3 | 09.03.2021 | [2022/37] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | EP4056309 | Date: | 14.09.2022 | Language: | DE | [2022/37] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 24.09.2021 | Classification | IPC: | B23K26/03, B23K26/06, B23K26/082, B23K26/08, B23K26/38, // B23K31/12 | [2022/37] | CPC: |
B23K26/38 (EP,US);
B23K26/03 (EP);
B23K26/0643 (EP,US);
B23K26/0648 (EP,US);
B23K26/082 (EP,US);
B23K26/0821 (EP);
B23K26/0876 (US);
B23K26/0884 (EP);
B23K31/12 (US);
B23K31/125 (EP)
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| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2022/37] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | VORRICHTUNG UND VERFAHREN ZUM LASERSCHNEIDEN EINES WERKSTÜCKS UND ERZEUGEN VON WERKSTÜCKTEILEN | [2022/37] | English: | DEVICE AND METHOD FOR LASER CUTTING A WORKPIECE AND PRODUCING WORKPIECE PARTS | [2022/37] | French: | DISPOSITIF ET PROCÉDÉ DE DÉCOUPE LASER D'UNE PIÈCE ET PRODUCTION DE PIÈCES | [2022/37] | Examination procedure | 15.03.2023 | Application deemed to be withdrawn, date of legal effect [2023/34] | 05.04.2023 | Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time [2023/34] | Fees paid | Penalty fee | Additional fee for renewal fee | 31.03.2023 | 03 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]EP2303502 (FRAUNHOFER GES FORSCHUNG [DE]); | [A]DE102018220336 (FRAUNHOFER GES FORSCHUNG [DE]); | [A]US2020246920 (NAKAGAWA TATSUYUKI [JP], et al); | [XA]EP3747588 (BYSTRONIC LASER AG [CH]); | [XAY]US2020398373 (RATAJ THOMAS [DE], et al); | [Y]DE102019120830 (SCANLAB GMBH [DE]) | by applicant | DE2821883 | US4532402 | US5109148 | EP0815499 | EP1758003 | EP1838486 | DE102008053397 | EP2730363 | US8781269 | EP2762263 | EP2778746 | US9250390 | DE102015116033 | US9346126 | DE102015101263 |