-
EP4016605
European procedure
- EP About this file
- EP Legal status
- EP Federated register
- EP Event history
- EP Citations
- EP Patent family
- EP All documents
Extract from the Register of European Patents
EP About this file: EP4016605
| EP4016605 - BACKSIDE INTERCONNECTION INTERFACE DIE FOR INTEGRATED CIRCUITS PACKAGE [Right-click to bookmark this link] | Status | Examination is in progress Status updated on 28.07.2023 Database last updated on 16.11.2024 | |
| Former | Request for examination was made Status updated on 02.12.2022 | ||
| Former | The application has been published Status updated on 20.05.2022 | Most recent event Tooltip | 13.09.2024 | New entry: Despatch of examination report + time limit | Applicant(s) | For all designated states Google LLC 1600 Amphitheatre Parkway Mountain View, CA 94043 / US | [2022/25] | Inventor(s) | 01 /
KIM, Namhoon Mountain View, CA California 94043 / US | 02 /
KWON, Woon-Seong Mountain View, CA California 94043 / US | 03 /
KANG, Teckgyu Mountain View, CA California 94043 / US | [2022/25] | Representative(s) | Betten & Resch Patent- und Rechtsanwälte PartGmbB Maximiliansplatz 14 80333 München / DE | [2022/25] | Application number, filing date | 21168686.0 | 15.04.2021 | [2022/25] | Priority number, date | US202017121868 | 15.12.2020 Original published format: US202017121868 | [2022/25] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4016605 | Date: | 22.06.2022 | Language: | EN | [2022/25] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 22.10.2021 | Classification | IPC: | H01L23/14 | [2022/25] | CPC: |
H01L23/5385 (EP);
H01L25/105 (EP,US);
H01L23/49822 (US);
H01L23/49883 (US);
H01L23/5384 (EP);
H01L25/0655 (EP);
H01L25/18 (EP);
H01L25/50 (EP);
H01L2224/131 (EP);
H01L2224/13111 (EP);
H01L2224/13124 (EP);
H01L2224/13144 (EP);
H01L2224/13147 (EP);
H01L2224/13155 (EP);
H01L2224/13184 (EP);
H01L2224/16227 (EP);
H01L2224/16235 (EP);
H01L2224/17155 (EP);
H01L2225/1052 (US);
H01L2225/1058 (EP);
H01L2225/107 (EP,US);
| C-Set: |
H01L2224/13111, H01L2924/00014 (EP);
H01L2224/13124, H01L2924/00014 (EP);
H01L2224/13144, H01L2924/00014 (EP);
H01L2224/13147, H01L2924/00014 (EP);
H01L2224/13155, H01L2924/00014 (EP);
H01L2224/13184, H01L2924/00014 (EP); | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/01] |
| Former [2022/25] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | RÜCKSEITIGER VERBINDUNGSSCHNITTSTELLENCHIP FÜR BAUGRUPPE AUS INTEGRIERTEN SCHALTUNGEN | [2022/25] | English: | BACKSIDE INTERCONNECTION INTERFACE DIE FOR INTEGRATED CIRCUITS PACKAGE | [2022/25] | French: | MATRICE D'INTERFACE D'INTERCONNEXION ARRIÈRE POUR L'EMBALLAGE DE CIRCUITS INTÉGRÉS | [2022/25] | Examination procedure | 25.11.2022 | Amendment by applicant (claims and/or description) | 25.11.2022 | Examination requested [2023/01] | 25.11.2022 | Date on which the examining division has become responsible | 28.07.2023 | Despatch of a communication from the examining division (Time limit: M04) | 27.11.2023 | Reply to a communication from the examining division | 12.09.2024 | Despatch of a communication from the examining division (Time limit: M04) | Fees paid | Renewal fee | 27.04.2023 | Renewal fee patent year 03 | 29.04.2024 | Renewal fee patent year 04 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XYI]US2015235915 (LIANG YU-MIN [TW], et al); | [A]US2019131976 (CHANDRASEKAR KARTHIK [US], et al); | [Y]US2020006239 (ZHANG CHONG [US], et al); | [A]US2020006235 (ALEKSOV ALEKSANDAR [US], et al); | [Y]US2020098725 (LIFF SHAWNA M [US], et al); | [Y]US2020098724 (LIFF SHAWNA M [US], et al) | Examination | US2006163745 | US2013003310 | US2020035603 |