blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability

2022.02.11

More...
blank News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...
blank Related links

Release notes
European Patent Register Assistant
European Patent Register Resource Book
European Patent Register – pocket guide
FAQ - European Patent Register
FAQ - Register Alert
Federated Register (Flyer)
Global Dossier (Flyer)
Register events
Deep link coverage
Federated Register content
The Patent Information Tour
Fair use charter

Extract from the Register of European Patents

EP About this file: EP3937231

EP3937231 - PACKAGE AND METHOD OF FABRICATING THE SAME [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  25.11.2022
Database last updated on 13.09.2024
FormerThe application has been published
Status updated on  10.12.2021
Most recent event   Tooltip25.11.2022Application deemed to be withdrawnpublished on 28.12.2022  [2022/52]
Applicant(s)For all designated states
Taiwan Semiconductor Manufacturing Co., Ltd.
No. 8, Li-Hsin Rd. 6
Hsinchu Science Park
Hsinchu
300-78 / TW
[2022/02]
Inventor(s)01 / CHEN, Ming-Fa
Hsinchu / TW
02 / SHIH, Chao-Wen
Hsinchu / TW
03 / LIU, Tzuan-Horng
Hsinchu / TW
04 / HU, Jen-Li
Hsinchu / TW
 [2022/02]
Representative(s)Valea AB
Box 17067
200 10 Malmö / SE
[2022/02]
Application number, filing date21184505.208.07.2021
[2022/02]
Priority number, dateUS20201692421609.07.2020         Original published format: US202016924216
[2022/02]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP3937231
Date:12.01.2022
Language:EN
[2022/02]
Type: A3 Search report 
No.:EP3937231
Date:19.01.2022
Language:EN
[2022/03]
Search report(s)(Supplementary) European search report - dispatched on:EP17.12.2021
ClassificationIPC:H01L23/522, H01L23/00, // H01L25/065, H01L21/60
[2022/03]
CPC:
H01L23/5227 (EP); H01L25/50 (EP,CN); H01L24/05 (US);
H01L21/76807 (US); H01L23/481 (EP); H01L23/5222 (US);
H01L23/5223 (EP); H01L23/5226 (US); H01L23/645 (US);
H01L24/03 (US); H01L25/0657 (EP); H01L25/105 (EP);
H01L25/16 (CN); H01L2224/05546 (EP); H01L2224/05624 (EP);
H01L2224/05639 (EP); H01L2224/05644 (EP); H01L2224/05647 (EP);
H01L2224/05684 (EP); H01L2224/08145 (EP); H01L2224/08146 (EP);
H01L2224/09181 (EP); H01L2224/73251 (EP); H01L2224/80047 (EP);
H01L2224/80357 (EP); H01L2224/80895 (EP); H01L2224/80896 (EP);
H01L2224/9222 (EP); H01L2224/94 (EP); H01L2224/96 (EP);
H01L2225/0651 (EP); H01L2225/06541 (EP); H01L2225/06568 (EP);
H01L24/19 (EP); H01L24/80 (EP); H01L2924/1205 (US);
H01L2924/1206 (US) (-)
C-Set:
H01L2224/05624, H01L2924/013, H01L2924/00014 (EP);
H01L2224/05639, H01L2924/013, H01L2924/00014 (EP);
H01L2224/05644, H01L2924/013, H01L2924/00014 (EP);
H01L2224/05647, H01L2924/013, H01L2924/00014 (EP);
H01L2224/05684, H01L2924/013, H01L2924/00014 (EP);
H01L2224/73251, H01L2224/08, H01L2224/20 (EP);
H01L2224/80047, H01L2924/00014 (EP);
H01L2224/80895, H01L2924/00014 (EP);
H01L2224/80896, H01L2924/00014 (EP);
H01L2224/9222, H01L2224/80001, H01L2224/19 (EP);
H01L2224/94, H01L2224/80001 (EP);
H01L2224/96, H01L2224/19 (EP);
H01L2224/96, H01L2224/80001 (EP)
(-)
Former IPC [2022/02]H01L23/522, // H01L25/065, H01L21/60
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2022/02]
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:GEHÄUSE UND VERFAHREN ZUR HERSTELLUNG DAVON[2022/02]
English:PACKAGE AND METHOD OF FABRICATING THE SAME[2022/02]
French:EMBALLAGE ET SON PROCÉDÉ DE FABRICATION[2022/02]
Examination procedure20.07.2022Application deemed to be withdrawn, date of legal effect  [2022/52]
09.08.2022Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time  [2022/52]
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[X]US2013037965  (MORIMOTO TAKASHI [JP], et al) [X] 1,3,7 * abstract * * paragraphs [0039] , [0040] , [0044] *;
 [X]US2015001948  (BRAUCHLER FRED T [US], et al) [X] 1 * abstract * * paragraph [0049] *;
 [X]US9716088  (EDELSTEIN DANIEL C [US], et al) [X] 1-3 * abstract *;
 [X]US2018190580  (HABA BELGACEM [US], et al) [X] 1,3 * abstract * * paragraphs [0075] , [0082] *;
 [X]US2018240860  (YANG CHIH-CHAO [US]) [X] 1-3 * abstract * * paragraphs [0027] , [0070] *;
 [X]US2018366409  (KUWABARA SHINICHI [JP], et al) [X] 1,4,5,7 * abstract * * paragraph [0086] *;
 [X]US2019122931  (HUANG SHIH-HAN [TW], et al) [X] 1,6,7 * abstract * * paragraphs [0049] - [0053] *;
 [X]US2019148342  (HU CHIH-CHIA [TW], et al) [X] 1* abstract *;
 [X]US2019157333  (TSAI BO-TSUNG [TW]) [X] 1,2 * abstract * * paragraphs [0035] , [0039] *;
 [X]US10431565  (KIM MYONGSEOB [US], et al) [X] 1,2 * abstract *;
 [X]CN110998846  (YANGTZE MEMORY TECH CO LTD) [X] 1 * abstract *;
 [XP]US2021134779  (HUANG SHIQI [CN], et al) [XP] 1 * abstract * * paragraphs [0060] , [0065] , [0066] , [0071] , [0078] , [0085] *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.